JP2013092758A - 光デバイス及び光デバイスの製造方法 - Google Patents
光デバイス及び光デバイスの製造方法 Download PDFInfo
- Publication number
- JP2013092758A JP2013092758A JP2012217220A JP2012217220A JP2013092758A JP 2013092758 A JP2013092758 A JP 2013092758A JP 2012217220 A JP2012217220 A JP 2012217220A JP 2012217220 A JP2012217220 A JP 2012217220A JP 2013092758 A JP2013092758 A JP 2013092758A
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- optical fiber
- optical device
- groove
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12176—Etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012217220A JP2013092758A (ja) | 2011-10-04 | 2012-09-28 | 光デバイス及び光デバイスの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011219998 | 2011-10-04 | ||
| JP2011219998 | 2011-10-04 | ||
| JP2012217220A JP2013092758A (ja) | 2011-10-04 | 2012-09-28 | 光デバイス及び光デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013092758A true JP2013092758A (ja) | 2013-05-16 |
| JP2013092758A5 JP2013092758A5 (https=) | 2015-07-30 |
Family
ID=48086052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012217220A Pending JP2013092758A (ja) | 2011-10-04 | 2012-09-28 | 光デバイス及び光デバイスの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20130094800A1 (https=) |
| JP (1) | JP2013092758A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015141577A1 (ja) * | 2014-03-19 | 2015-09-24 | オリンパス株式会社 | 光ファイバ保持部材、内視鏡、および光ファイバ保持部材の製造方法 |
| CN116500057A (zh) * | 2023-04-28 | 2023-07-28 | 深圳鑫振华光电科技有限公司 | 一种基于人工智能的光纤设备视觉数据分析系统及方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5925062B2 (ja) * | 2012-06-18 | 2016-05-25 | シチズンホールディングス株式会社 | 光モジュール及び光モジュールの製造方法 |
| CN105576487A (zh) * | 2016-03-18 | 2016-05-11 | 深圳瑞焱通光子技术有限公司 | 一种激光放大器 |
| EP4066031B1 (en) * | 2019-11-26 | 2025-02-19 | Corning Research & Development Corporation | Methods for laser bonding optical elements to substrates and optical assemblies fabricated by the same |
| WO2023168103A1 (en) * | 2022-03-04 | 2023-09-07 | Ofs Fitel, Llc | Stress-controlled packaging scheme for fiber-based optical devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0961674A (ja) * | 1995-08-21 | 1997-03-07 | Nec Corp | 光モジュール及びその製造方法 |
| JP2004295049A (ja) * | 2003-03-28 | 2004-10-21 | Japan Aviation Electronics Industry Ltd | 光モジュール及びその製造方法 |
| JP2011109002A (ja) * | 2009-11-20 | 2011-06-02 | Citizen Holdings Co Ltd | 集積デバイスおよび集積デバイスの製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4788406A (en) * | 1987-01-23 | 1988-11-29 | Battelle Memorial Institute | Microattachment of optical fibers |
| KR0155508B1 (ko) * | 1994-11-30 | 1998-10-15 | 정선종 | 자기 정렬된 광섬유-광소자 결합장치의 제조방법 |
| JP3658426B2 (ja) * | 1995-01-23 | 2005-06-08 | 株式会社日立製作所 | 光半導体装置 |
| JPH09138325A (ja) * | 1995-11-13 | 1997-05-27 | Nec Corp | 光ファイバ実装構造とその製造方法 |
| US5872880A (en) * | 1996-08-12 | 1999-02-16 | Ronald S. Maynard | Hybrid-optical multi-axis beam steering apparatus |
| JP3792358B2 (ja) * | 1997-07-30 | 2006-07-05 | 京セラ株式会社 | 光接続部品及びその製造方法 |
| KR100283075B1 (ko) * | 1998-11-05 | 2001-03-02 | 이계철 | 수동정렬법을 이용한 광소자-플라나 광파회로-광섬유의 광축 정렬방법 |
| US6741778B1 (en) * | 2000-05-23 | 2004-05-25 | International Business Machines Corporation | Optical device with chip level precision alignment |
| WO2002018574A2 (en) * | 2000-08-25 | 2002-03-07 | North Shore-Long Island Jewish Research Institute | Human interleukin-four induced protein |
| WO2002050584A2 (en) * | 2000-12-21 | 2002-06-27 | Biovalve Technologies, Inc. | Microneedle array systems |
| KR100383382B1 (en) * | 2002-08-30 | 2003-05-16 | Fionix Inc | Optical transmission module using optical fiber having tilt angle and reflective side of silicon optical bench |
| US7499614B2 (en) * | 2003-10-24 | 2009-03-03 | International Business Machines Corporation | Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards |
| US20060257074A1 (en) * | 2004-09-21 | 2006-11-16 | The Furukawa Electric Co., Ltd. | Semiconductor device, display device and device fabricating method |
| JP4395103B2 (ja) * | 2005-06-06 | 2010-01-06 | 富士通株式会社 | 導波路基板および高周波回路モジュール |
| JP4704125B2 (ja) * | 2005-06-22 | 2011-06-15 | 浜松ホトニクス株式会社 | 光デバイス |
| TW200807047A (en) * | 2006-05-30 | 2008-02-01 | Sumitomo Bakelite Co | Substrate for mounting photonic device, optical circuit substrate, and photonic device mounting substrate |
| US7978940B2 (en) * | 2009-09-14 | 2011-07-12 | Tyco Electronics Services Gmbh | Self-aligned carrier assembly for optical device supporting wafer scale methods |
| CN102549852B (zh) * | 2009-09-18 | 2015-05-27 | 英特尔公司 | 组合光和电气接口 |
-
2012
- 2012-09-28 JP JP2012217220A patent/JP2013092758A/ja active Pending
- 2012-10-04 US US13/644,637 patent/US20130094800A1/en not_active Abandoned
-
2014
- 2014-08-12 US US14/458,140 patent/US20140348463A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0961674A (ja) * | 1995-08-21 | 1997-03-07 | Nec Corp | 光モジュール及びその製造方法 |
| JP2004295049A (ja) * | 2003-03-28 | 2004-10-21 | Japan Aviation Electronics Industry Ltd | 光モジュール及びその製造方法 |
| JP2011109002A (ja) * | 2009-11-20 | 2011-06-02 | Citizen Holdings Co Ltd | 集積デバイスおよび集積デバイスの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015141577A1 (ja) * | 2014-03-19 | 2015-09-24 | オリンパス株式会社 | 光ファイバ保持部材、内視鏡、および光ファイバ保持部材の製造方法 |
| CN116500057A (zh) * | 2023-04-28 | 2023-07-28 | 深圳鑫振华光电科技有限公司 | 一种基于人工智能的光纤设备视觉数据分析系统及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130094800A1 (en) | 2013-04-18 |
| US20140348463A1 (en) | 2014-11-27 |
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Legal Events
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| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150610 |
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