JP2013038112A5 - - Google Patents
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- JP2013038112A5 JP2013038112A5 JP2011170666A JP2011170666A JP2013038112A5 JP 2013038112 A5 JP2013038112 A5 JP 2013038112A5 JP 2011170666 A JP2011170666 A JP 2011170666A JP 2011170666 A JP2011170666 A JP 2011170666A JP 2013038112 A5 JP2013038112 A5 JP 2013038112A5
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- JP
- Japan
- Prior art keywords
- insulating layer
- bonding electrode
- semiconductor device
- layer
- semiconductor substrate
- Prior art date
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Priority Applications (17)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011170666A JP5803398B2 (ja) | 2011-08-04 | 2011-08-04 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
TW101121190A TWI495041B (zh) | 2011-07-05 | 2012-06-13 | 半導體裝置、用於半導體裝置之製造方法及電子設備 |
US13/533,526 US8896125B2 (en) | 2011-07-05 | 2012-06-26 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
KR1020120069684A KR102030852B1 (ko) | 2011-07-05 | 2012-06-28 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 기기 |
CN201210233277.XA CN102867847B (zh) | 2011-07-05 | 2012-07-05 | 半导体器件、半导体器件制造方法及电子装置 |
US14/467,852 US9111763B2 (en) | 2011-07-05 | 2014-08-25 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
US14/718,942 US9443802B2 (en) | 2011-07-05 | 2015-05-21 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
US15/228,894 US9911778B2 (en) | 2011-07-05 | 2016-08-04 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
US15/228,860 US10038024B2 (en) | 2011-07-05 | 2016-08-04 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
US15/992,908 US10431621B2 (en) | 2011-07-05 | 2018-05-30 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
US16/410,877 US10985102B2 (en) | 2011-07-05 | 2019-05-13 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
KR1020190069266A KR20190071647A (ko) | 2011-07-05 | 2019-06-12 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 기기 |
KR1020200069977A KR102298787B1 (ko) | 2011-07-05 | 2020-06-10 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 기기 |
US17/194,641 US11569123B2 (en) | 2011-07-05 | 2021-03-08 | Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
KR1020210112763A KR102439964B1 (ko) | 2011-07-05 | 2021-08-26 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 기기 |
KR1020220109225A KR102673911B1 (ko) | 2011-07-05 | 2022-08-30 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 장치 |
KR1020240073260A KR20240085908A (ko) | 2011-07-05 | 2024-06-04 | 반도체 장치, 반도체 장치의 제조 방법 및 전자 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011170666A JP5803398B2 (ja) | 2011-08-04 | 2011-08-04 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013038112A JP2013038112A (ja) | 2013-02-21 |
JP2013038112A5 true JP2013038112A5 (ru) | 2014-09-18 |
JP5803398B2 JP5803398B2 (ja) | 2015-11-04 |
Family
ID=47887475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011170666A Active JP5803398B2 (ja) | 2011-07-05 | 2011-08-04 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5803398B2 (ru) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102161793B1 (ko) | 2014-07-18 | 2020-10-06 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
KR102267168B1 (ko) | 2014-12-02 | 2021-06-21 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
JP2016181531A (ja) * | 2015-03-23 | 2016-10-13 | ソニー株式会社 | 半導体装置、および半導体装置の製造方法、固体撮像素子、撮像装置、並びに電子機器 |
WO2016185883A1 (ja) * | 2015-05-18 | 2016-11-24 | ソニー株式会社 | 半導体装置および撮像装置 |
JP6711614B2 (ja) * | 2015-12-24 | 2020-06-17 | キヤノン株式会社 | 半導体装置 |
JP6856983B2 (ja) | 2016-06-30 | 2021-04-14 | キヤノン株式会社 | 光電変換装置及びカメラ |
JPWO2020079945A1 (ja) * | 2018-10-15 | 2021-09-16 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
JP7321724B2 (ja) * | 2019-03-05 | 2023-08-07 | キヤノン株式会社 | 半導体装置および機器 |
JP2020191334A (ja) | 2019-05-20 | 2020-11-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
EP4169971A4 (en) * | 2020-06-22 | 2024-07-10 | Sekisui Chemical Co Ltd | LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING A LAMINATE, METHOD FOR PRODUCING A SUBSTRATE WITH CONNECTING ELECTRODE, SEMICONDUCTOR COMPONENT AND IMAGE CAPTURE DEVICE |
JP2022082187A (ja) * | 2020-11-20 | 2022-06-01 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及びその製造方法、並びに電子機器 |
JP7425257B2 (ja) * | 2021-12-23 | 2024-01-30 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
WO2023188831A1 (ja) * | 2022-03-30 | 2023-10-05 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及び半導体装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005142553A (ja) * | 2003-10-15 | 2005-06-02 | Toshiba Corp | 半導体装置 |
US7049701B2 (en) * | 2003-10-15 | 2006-05-23 | Kabushiki Kaisha Toshiba | Semiconductor device using insulating film of low dielectric constant as interlayer insulating film |
JP5407660B2 (ja) * | 2009-08-26 | 2014-02-05 | ソニー株式会社 | 半導体装置の製造方法 |
JP2011146563A (ja) * | 2010-01-15 | 2011-07-28 | Panasonic Corp | 半導体装置 |
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2011
- 2011-08-04 JP JP2011170666A patent/JP5803398B2/ja active Active
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