JP2013030755A - 多部品出力構造体及びその形成方法 - Google Patents
多部品出力構造体及びその形成方法 Download PDFInfo
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- JP2013030755A JP2013030755A JP2012125792A JP2012125792A JP2013030755A JP 2013030755 A JP2013030755 A JP 2013030755A JP 2012125792 A JP2012125792 A JP 2012125792A JP 2012125792 A JP2012125792 A JP 2012125792A JP 2013030755 A JP2013030755 A JP 2013030755A
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- Condensed Matter Physics & Semiconductors (AREA)
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| US8872328B2 (en) * | 2012-12-19 | 2014-10-28 | General Electric Company | Integrated power module package |
| US10933489B2 (en) * | 2013-07-09 | 2021-03-02 | Raytheon Technologies Corporation | Transient liquid phase bonding of surface coatings metal-covered materials |
| KR102208961B1 (ko) | 2013-10-29 | 2021-01-28 | 삼성전자주식회사 | 반도체소자 패키지 및 그 제조방법 |
| DE102014218426A1 (de) | 2014-09-15 | 2016-03-17 | Siemens Aktiengesellschaft | Baugruppe mit mindestens zwei Tragkörpern und einen Lotverbund |
| DE102014219759A1 (de) * | 2014-09-30 | 2016-03-31 | Siemens Aktiengesellschaft | Leistungsmodul |
| US20160339538A1 (en) * | 2015-05-18 | 2016-11-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | High temperature bonding processes incorporating traces |
| US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
| US9847310B2 (en) | 2015-07-18 | 2017-12-19 | Semiconductor Components Industries, Llc | Flip chip bonding alloys |
| US10115716B2 (en) | 2015-07-18 | 2018-10-30 | Semiconductor Components Industries, Llc | Die bonding to a board |
| DE102015114086B4 (de) * | 2015-08-25 | 2022-01-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement und Verfahren zur Herstellung eines Bauelements |
| CN110431662A (zh) * | 2017-04-06 | 2019-11-08 | 陶瓷技术有限责任公司 | 在两侧冷却的电路 |
| US10886251B2 (en) * | 2017-04-21 | 2021-01-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-layered composite bonding materials and power electronics assemblies incorporating the same |
| DE102017206930A1 (de) * | 2017-04-25 | 2018-10-25 | Siemens Aktiengesellschaft | Lotformteil zum Diffusionslöten, Verfahren zu dessen Herstellung und Verfahren zu dessen Montage |
| DE102019217061A1 (de) * | 2019-11-06 | 2021-05-06 | Zf Friedrichshafen Ag | Anordnung mit einem Substrat für eine Aufnahme von wenigstens einem Halbleiterbauelement für einen Stromrichter und Verfahren zum Diffusionsverlöten wenigstens eines Halbleiterbauelements mit einem Substrat für einen Stromrichter |
| CN111584346B (zh) * | 2020-05-28 | 2021-02-12 | 浙江大学 | 具有热沉结构的GaN器件及其制备方法 |
| KR102580589B1 (ko) * | 2020-12-28 | 2023-09-20 | 주식회사 아모센스 | 전력반도체 모듈의 제조방법 및 이에 의해 제조된 전력반도체 모듈 |
| US20230317670A1 (en) * | 2022-03-29 | 2023-10-05 | Wolfspeed, Inc. | Packaged electronic devices having transient liquid phase solder joints and methods of forming same |
| CN116786933B (zh) * | 2023-06-27 | 2025-07-01 | 北京科技大学 | 一种异向单晶高温合金连接方法 |
| US20250275099A1 (en) * | 2024-02-28 | 2025-08-28 | Lenovo (Singapore) Pte. Ltd. | Liquid metal based thermal interface material |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6034472B2 (ja) | 2016-11-30 |
| JP2016066806A (ja) | 2016-04-28 |
| US20120306105A1 (en) | 2012-12-06 |
| US8431445B2 (en) | 2013-04-30 |
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