JP2013016835A5 - - Google Patents

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Publication number
JP2013016835A5
JP2013016835A5 JP2012191863A JP2012191863A JP2013016835A5 JP 2013016835 A5 JP2013016835 A5 JP 2013016835A5 JP 2012191863 A JP2012191863 A JP 2012191863A JP 2012191863 A JP2012191863 A JP 2012191863A JP 2013016835 A5 JP2013016835 A5 JP 2013016835A5
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JP
Japan
Prior art keywords
surface side
fiber base
insulating substrate
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012191863A
Other languages
English (en)
Japanese (ja)
Other versions
JP5821811B2 (ja
JP2013016835A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012191863A priority Critical patent/JP5821811B2/ja
Priority claimed from JP2012191863A external-priority patent/JP5821811B2/ja
Publication of JP2013016835A publication Critical patent/JP2013016835A/ja
Publication of JP2013016835A5 publication Critical patent/JP2013016835A5/ja
Application granted granted Critical
Publication of JP5821811B2 publication Critical patent/JP5821811B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012191863A 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Expired - Fee Related JP5821811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010258172 2010-11-18
JP2010258172 2010-11-18
JP2012191863A JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011209540A Division JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2013016835A JP2013016835A (ja) 2013-01-24
JP2013016835A5 true JP2013016835A5 (enrdf_load_stackoverflow) 2015-01-29
JP5821811B2 JP5821811B2 (ja) 2015-11-24

Family

ID=47432428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
JP2012191863A Expired - Fee Related JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2012191864A Expired - Fee Related JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Country Status (1)

Country Link
JP (2) JP5152432B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494332B1 (ko) * 2015-07-15 2023-02-02 삼성전기주식회사 전자소자 패키지
KR101916379B1 (ko) * 2016-01-22 2018-11-08 한솔테크닉스(주) 커브드형 회로기판
WO2025154213A1 (ja) * 2024-01-17 2025-07-24 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用基板材料、及び半導体パッケージ用基板材料を製造する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168870B2 (ja) * 1995-04-26 2001-05-21 松下電工株式会社 多層積層板の製造方法
JP2001177244A (ja) * 1999-12-17 2001-06-29 Hitachi Chem Co Ltd 多層板の製造方法
JP2002134918A (ja) * 2000-10-26 2002-05-10 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP3499837B2 (ja) * 2001-03-13 2004-02-23 住友ベークライト株式会社 プリプレグの製造方法
MY148173A (en) * 2006-04-28 2013-03-15 Sumitomo Bakelite Co Solder resist material, wiring board using the solder resist material, and semiconductor package
WO2008056500A1 (fr) * 2006-11-10 2008-05-15 Nec Corporation Substrat à circuit multicouche
WO2008093579A1 (ja) * 2007-01-29 2008-08-07 Sumitomo Bakelite Company Limited 積層体、基板の製造方法、基板および半導体装置

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