JP2013016635A5 - - Google Patents

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Publication number
JP2013016635A5
JP2013016635A5 JP2011148288A JP2011148288A JP2013016635A5 JP 2013016635 A5 JP2013016635 A5 JP 2013016635A5 JP 2011148288 A JP2011148288 A JP 2011148288A JP 2011148288 A JP2011148288 A JP 2011148288A JP 2013016635 A5 JP2013016635 A5 JP 2013016635A5
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JP
Japan
Prior art keywords
substrate
mounting body
mounting
body support
contact
Prior art date
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Pending
Application number
JP2011148288A
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English (en)
Japanese (ja)
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JP2013016635A (ja
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Publication date
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Priority to JP2011148288A priority Critical patent/JP2013016635A/ja
Priority claimed from JP2011148288A external-priority patent/JP2013016635A/ja
Publication of JP2013016635A publication Critical patent/JP2013016635A/ja
Publication of JP2013016635A5 publication Critical patent/JP2013016635A5/ja
Pending legal-status Critical Current

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JP2011148288A 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法 Pending JP2013016635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011148288A JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011148288A JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2013016635A JP2013016635A (ja) 2013-01-24
JP2013016635A5 true JP2013016635A5 (enExample) 2014-08-14

Family

ID=47689021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011148288A Pending JP2013016635A (ja) 2011-07-04 2011-07-04 基板処理装置及び半導体装置の製造方法

Country Status (1)

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JP (1) JP2013016635A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015223807A1 (de) * 2015-12-01 2017-06-01 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht in einer Abscheidekammer, Vorrichtung zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht und Halbleiterscheibe mit epitaktischer Schicht

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186750B2 (ja) * 1999-12-09 2001-07-11 イビデン株式会社 半導体製造・検査装置用セラミック板
JP2003197722A (ja) * 2001-12-26 2003-07-11 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用治具及びこれを用いた熱処理用装置並びに半導体ウェーハ熱処理用治具の製造方法
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
JP2006186350A (ja) * 2005-12-02 2006-07-13 Sumitomo Electric Ind Ltd 基板加熱構造体および基板処理装置
JP2008108926A (ja) * 2006-10-26 2008-05-08 Bridgestone Corp ウェハ熱処理用治具
JP2010153467A (ja) * 2008-12-24 2010-07-08 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2009147383A (ja) * 2009-03-26 2009-07-02 Hitachi Kokusai Electric Inc 熱処理方法

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