JP2013012525A5 - - Google Patents

Download PDF

Info

Publication number
JP2013012525A5
JP2013012525A5 JP2011143033A JP2011143033A JP2013012525A5 JP 2013012525 A5 JP2013012525 A5 JP 2013012525A5 JP 2011143033 A JP2011143033 A JP 2011143033A JP 2011143033 A JP2011143033 A JP 2011143033A JP 2013012525 A5 JP2013012525 A5 JP 2013012525A5
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
wiring portion
frame according
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011143033A
Other languages
English (en)
Japanese (ja)
Other versions
JP5793995B2 (ja
JP2013012525A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011143033A external-priority patent/JP5793995B2/ja
Priority to JP2011143033A priority Critical patent/JP5793995B2/ja
Priority to CN201280032343.5A priority patent/CN103620768A/zh
Priority to DE112012002724.8T priority patent/DE112012002724T5/de
Priority to US14/129,342 priority patent/US20140145193A1/en
Priority to PCT/JP2012/061272 priority patent/WO2013001905A1/ja
Publication of JP2013012525A publication Critical patent/JP2013012525A/ja
Publication of JP2013012525A5 publication Critical patent/JP2013012525A5/ja
Publication of JP5793995B2 publication Critical patent/JP5793995B2/ja
Application granted granted Critical
Priority to US15/195,466 priority patent/US20160307829A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011143033A 2011-06-28 2011-06-28 リードフレーム、及び、パワーモジュール Expired - Fee Related JP5793995B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011143033A JP5793995B2 (ja) 2011-06-28 2011-06-28 リードフレーム、及び、パワーモジュール
PCT/JP2012/061272 WO2013001905A1 (ja) 2011-06-28 2012-04-26 リードフレーム、及び、パワーモジュール
DE112012002724.8T DE112012002724T5 (de) 2011-06-28 2012-04-26 Leiterrahmen und Leistungsmodul
US14/129,342 US20140145193A1 (en) 2011-06-28 2012-04-26 Lead frame and power module
CN201280032343.5A CN103620768A (zh) 2011-06-28 2012-04-26 引线框架及功率组件
US15/195,466 US20160307829A1 (en) 2011-06-28 2016-06-28 Lead frame and power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011143033A JP5793995B2 (ja) 2011-06-28 2011-06-28 リードフレーム、及び、パワーモジュール

Publications (3)

Publication Number Publication Date
JP2013012525A JP2013012525A (ja) 2013-01-17
JP2013012525A5 true JP2013012525A5 (enExample) 2015-03-26
JP5793995B2 JP5793995B2 (ja) 2015-10-14

Family

ID=47423811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011143033A Expired - Fee Related JP5793995B2 (ja) 2011-06-28 2011-06-28 リードフレーム、及び、パワーモジュール

Country Status (5)

Country Link
US (2) US20140145193A1 (enExample)
JP (1) JP5793995B2 (enExample)
CN (1) CN103620768A (enExample)
DE (1) DE112012002724T5 (enExample)
WO (1) WO2013001905A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6001472B2 (ja) * 2013-02-12 2016-10-05 トヨタ自動車株式会社 半導体装置の製造方法
JP6001473B2 (ja) * 2013-02-12 2016-10-05 トヨタ自動車株式会社 半導体装置の製造方法
JP6114134B2 (ja) * 2013-07-29 2017-04-12 トヨタ自動車株式会社 リードフレーム、電力変換装置、半導体装置及び半導体装置の製造方法
EP3726575A1 (en) 2013-11-05 2020-10-21 Mitsubishi Electric Corporation A method of using a semiconductor module
US10361147B1 (en) 2018-06-28 2019-07-23 Ford Global Technologies, Llc Inverter power module lead frame with enhanced common source inductance
US11502045B2 (en) * 2019-01-23 2022-11-15 Texas Instruments Incorporated Electronic device with step cut lead
JP7479759B2 (ja) 2020-06-02 2024-05-09 三菱電機株式会社 半導体装置の製造方法、および、半導体装置
JP7589560B2 (ja) * 2021-01-15 2024-11-26 株式会社デンソー 電気機器と電気機器の製造方法
JP7292352B2 (ja) * 2021-11-02 2023-06-16 三菱電機株式会社 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法
JP7715022B2 (ja) * 2021-11-25 2025-07-30 三菱電機株式会社 半導体装置及び電力変換装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03280562A (ja) * 1990-03-29 1991-12-11 Hitachi Ltd リードフレーム及び半導体装置樹脂封止方法
US6225684B1 (en) * 2000-02-29 2001-05-01 Texas Instruments Tucson Corporation Low temperature coefficient leadframe
CN1265465C (zh) * 2001-04-04 2006-07-19 三菱电机株式会社 半导体器件
US7884454B2 (en) * 2005-01-05 2011-02-08 Alpha & Omega Semiconductor, Ltd Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
JP5232367B2 (ja) * 2006-07-12 2013-07-10 ルネサスエレクトロニクス株式会社 半導体装置
DE102007020618B8 (de) * 2007-04-30 2009-03-12 Danfoss Silicon Power Gmbh Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul

Similar Documents

Publication Publication Date Title
JP2013012525A5 (enExample)
JP2009302564A5 (enExample)
JP2013168652A5 (enExample)
EP2629329A3 (en) Semiconductor device and manufacturing method thereof
EP2779237A3 (en) A chip arrangement and a method for manufacturing a chip arrangement
CA2964421C (en) Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor
WO2007106487A3 (en) Methods of making qfn package with power and ground rings
EP2477242A3 (en) Light-emitting device package and method of manufacturing the same
PH12014000026A1 (en) Semiconductor component and method of manufacture
JP2013045974A5 (enExample)
WO2014083507A3 (en) Semiconductor structure and method for manufacturing a semiconductor structure
JP2012209396A5 (enExample)
JP2013219253A5 (enExample)
WO2012134710A8 (en) Semiconductor chip with supportive terminal pad
EP2597678A3 (en) Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
JP2016018931A5 (enExample)
EP2733729A3 (en) Semiconductor device and method for producing the same
EP2650917A3 (en) Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
JP2015103606A5 (enExample)
MY176915A (en) Method of forming an electronic package and structure
JP2014030321A5 (enExample)
JP2010287737A5 (enExample)
JP2009188150A5 (enExample)
WO2013156883A3 (en) A led grid device and a method of manufacturing a led grid device
WO2014049059A3 (de) Bauteilanordnung und verfahren zum herstellen von elektrischen bauteilen