JP2012526914A5 - - Google Patents
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- Publication number
- JP2012526914A5 JP2012526914A5 JP2012510292A JP2012510292A JP2012526914A5 JP 2012526914 A5 JP2012526914 A5 JP 2012526914A5 JP 2012510292 A JP2012510292 A JP 2012510292A JP 2012510292 A JP2012510292 A JP 2012510292A JP 2012526914 A5 JP2012526914 A5 JP 2012526914A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- coating solution
- coating
- region
- starting current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 21
- 238000000034 method Methods 0.000 claims 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 230000004913 activation Effects 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000011437 continuous method Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009022337A DE102009022337A1 (de) | 2009-05-13 | 2009-05-13 | Verfahren und Vorrichtung zur Behandlung eines Substrats |
| DE102009022337.1 | 2009-05-13 | ||
| PCT/EP2010/056555 WO2010130786A2 (de) | 2009-05-13 | 2010-05-12 | Verfahren und vorrichtung zur behandlung eines wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012526914A JP2012526914A (ja) | 2012-11-01 |
| JP2012526914A5 true JP2012526914A5 (enExample) | 2013-06-27 |
Family
ID=42979229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012510292A Pending JP2012526914A (ja) | 2009-05-13 | 2010-05-12 | ウェハを処理する方法及びデバイス |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20120052611A1 (enExample) |
| EP (1) | EP2430664A2 (enExample) |
| JP (1) | JP2012526914A (enExample) |
| KR (1) | KR20120018155A (enExample) |
| CN (1) | CN102439730B (enExample) |
| AU (1) | AU2010247404A1 (enExample) |
| CA (1) | CA2761459A1 (enExample) |
| DE (1) | DE102009022337A1 (enExample) |
| IL (1) | IL216309A0 (enExample) |
| MX (1) | MX2011011985A (enExample) |
| SG (1) | SG175365A1 (enExample) |
| TW (1) | TW201108449A (enExample) |
| WO (1) | WO2010130786A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009049565A1 (de) | 2009-10-09 | 2011-04-14 | Gebr. Schmid Gmbh & Co. | Verfahren und Anlage zur Metallisierung von Siliziumwafern |
| CN103418530B (zh) * | 2013-07-24 | 2015-12-23 | 南通大学 | 异型直接醇类燃料电池管状电极的涂覆方法及电极 |
| CN104555243A (zh) * | 2013-10-11 | 2015-04-29 | 宁夏琪凯节能设备有限公司 | 一种节能型胶带运输机 |
| US11791159B2 (en) * | 2019-01-17 | 2023-10-17 | Ramesh kumar Harjivan Kakkad | Method of fabricating thin, crystalline silicon film and thin film transistors |
| CN110528041A (zh) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | 用于晶元的电镀加工方法、晶元及线路板 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3017079A1 (de) * | 1980-05-03 | 1981-11-05 | Thyssen AG vorm. August Thyssen-Hütte, 4100 Duisburg | Vorrichtung zum elektroplattieren |
| GB2188774B (en) * | 1986-04-02 | 1990-10-31 | Westinghouse Electric Corp | Method of forming a conductive pattern on a semiconductor surface |
| JPH04314866A (ja) * | 1991-04-12 | 1992-11-06 | Hitachi Chem Co Ltd | プリント配線板における無電解めっき方法 |
| EP0542148B1 (de) | 1991-11-11 | 1997-01-22 | SIEMENS SOLAR GmbH | Verfahren zum Erzeugen feiner Elektrodenstruckturen |
| DE4311173A1 (de) * | 1992-04-03 | 1993-10-07 | Siemens Solar Gmbh | Verfahren zur stromlosen Abscheidung eines Metalls über einer Halbleiteroberfläche |
| DE4333426C1 (de) | 1993-09-30 | 1994-12-15 | Siemens Solar Gmbh | Verfahren zur Metallisierung von Solarzellen aus kristallinem Silizium |
| JPH08172271A (ja) * | 1994-12-15 | 1996-07-02 | Ebara Yuujiraito Kk | プリント基板のめっき方法 |
| JPH09246695A (ja) * | 1996-03-12 | 1997-09-19 | Katsuya Hiroshige | プリント基板等の銅パターンの表面処理方法及び装置 |
| US5833820A (en) * | 1997-06-19 | 1998-11-10 | Advanced Micro Devices, Inc. | Electroplating apparatus |
| TW424807U (en) * | 1998-05-06 | 2001-03-01 | Ke Jian Shin | Improved structure for rotatory conductive wheel |
| US6130150A (en) * | 1999-08-06 | 2000-10-10 | Lucent Technologies, Inc. | Method of making a semiconductor device with barrier and conductor protection |
| JP2002373996A (ja) * | 2001-04-11 | 2002-12-26 | Daido Steel Co Ltd | 太陽電池セルおよびその製造方法 |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
| DE102005038450A1 (de) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten |
| JP2007131940A (ja) * | 2005-10-12 | 2007-05-31 | Hitachi Chem Co Ltd | 無電解銅めっき方法 |
| DE102006033353B4 (de) * | 2006-07-19 | 2010-11-18 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
| DE102007038120A1 (de) | 2007-07-31 | 2009-02-05 | Gebr. Schmid Gmbh & Co. | Verfahren zur Beschichtung von Solarzellen sowie Vorrichtung hierfür |
-
2009
- 2009-05-13 DE DE102009022337A patent/DE102009022337A1/de not_active Withdrawn
-
2010
- 2010-05-12 KR KR1020117026951A patent/KR20120018155A/ko not_active Withdrawn
- 2010-05-12 JP JP2012510292A patent/JP2012526914A/ja active Pending
- 2010-05-12 WO PCT/EP2010/056555 patent/WO2010130786A2/de not_active Ceased
- 2010-05-12 CN CN201080020789.7A patent/CN102439730B/zh active Active
- 2010-05-12 CA CA2761459A patent/CA2761459A1/en not_active Abandoned
- 2010-05-12 SG SG2011078755A patent/SG175365A1/en unknown
- 2010-05-12 MX MX2011011985A patent/MX2011011985A/es not_active Application Discontinuation
- 2010-05-12 AU AU2010247404A patent/AU2010247404A1/en not_active Abandoned
- 2010-05-12 EP EP10720400A patent/EP2430664A2/de not_active Withdrawn
- 2010-05-13 TW TW099115342A patent/TW201108449A/zh unknown
-
2011
- 2011-11-10 IL IL216309A patent/IL216309A0/en unknown
- 2011-11-11 US US13/294,569 patent/US20120052611A1/en not_active Abandoned
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