JP2012525689A - レンズ及び印刷されたリフレクタ面を有する回路基板の製造方法並びにその方法により製造される回路基板 - Google Patents
レンズ及び印刷されたリフレクタ面を有する回路基板の製造方法並びにその方法により製造される回路基板 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000000576 coating method Methods 0.000 claims abstract description 68
- 239000011248 coating agent Substances 0.000 claims abstract description 64
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 238000005286 illumination Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 69
- 238000012545 processing Methods 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000007639 printing Methods 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000007641 inkjet printing Methods 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 238000003856 thermoforming Methods 0.000 claims description 2
- MZZSDCJQCLYLLL-UHFFFAOYSA-N Secalonsaeure A Natural products COC(=O)C12OC3C(CC1=C(O)CC(C)C2O)C(=CC=C3c4ccc(O)c5C(=O)C6=C(O)CC(C)C(O)C6(Oc45)C(=O)OC)O MZZSDCJQCLYLLL-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 239000000976 ink Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 239000011253 protective coating Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007649 pad printing Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920002994 synthetic fiber Polymers 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 206010039897 Sedation Diseases 0.000 description 1
- 206010042674 Swelling Diseases 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 230000036280 sedation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10106—Light emitting diode [LED]
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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Abstract
Description
1.全ての層2、3及び4(少なくとも層3)ははんだ耐性を有する必要がある。
2.三次元リフレクタを構成する下地層2又は複数の下地層2a乃至2cはエポキシ樹脂であることが可能である。
3.後のミラー層3(パラジウム等)が準備され、続いて、ミラーメッキにより、即ち、電気化学的に又はメッキによりコーティングされる。この場合、被覆層4が必ず必要である。
4.この被覆層4は、はんだ槽にも拘わらず、高い透明度が保たれる必要があり、これは、勿論、透明なはんだマスクラッカ、例えば、プロバイマー(probimer)(登録商標)であることが可能である。
5.放物線形状のリフレクタのために、LEDエミッタが、略焦点に位置付けられることが可能である。
6.更に、リフレクタは一般に、波長特有の反射を有するため、反射コーティング3のリフレクタ材料は色変換又は色変調をもたらすことも可能である。
Claims (15)
- 反射コーティングと1つ又はそれ以上の電導的に接続されたLEDとを有する回路基板の製造方法であって、前記反射コーティングは前記回路基板の面に印刷され、保護層としての透明な又は一部が透明な被覆層がインクジェット印刷により前記反射コーティングに印刷される、製造方法であり、
前記回路基板の前記面に、先ず、前記反射コーティングが塗布される前に、下地層が印刷により塗布され、前記反射コーティングが、金、銀等の貴金属を有する酸化物層として設計され、少なくとも1つのLED及び少なくとも1つの反射コーティングが備えられた回路基板の製造のために、次の処理ステップであって:
a)下地回路基板基材を露出して、前記LEDのための設置面を生成するための凹部を形成するように、上部導体層を露出するステップ;
b)前記LEDのための前記設置面に隣接して電導性結合面を配置するステップ;
c)前記上部導体層にはんだマスクを塗布するステップ;
d)前記下地層を一回又は複数回印刷するステップ;
e)インクジェット印刷により前記LED及び前記結合面のための前記設置面の周囲領域に前記反射コーティングを印刷するステップ;並びに
f)前記反射コーティングの少なくとも一部を覆う前記被覆層を印刷するステップ;
を有する製造方法。 - 前記下地層は三次元形状を有することを特徴とする、請求項1に記載の製造方法。
- 前記回路基板の積層処理中に、後に塗布される前記反射コーティングの場所において加圧プレートにより銅(導体層)の表面に三次元の凸部及び凹部が形成されることを特徴とする、請求項1又は2に記載の製造方法。
- 前記反射コーティングの形成のために、先ず、銀の層が、後続する銅を含むメッキによる塗布のためのプライマとして用いられることを特徴とする、請求項1乃至3の何れか一項に記載の製造方法。
- 前記反射コーティングは構造化露光により形成されることを特徴とする、請求項1乃至4の何れか一項に記載の製造方法。
- 前記反射コーティングは、メッキ又は湿式化学的処理による塗布の後に、平滑化されることを特徴とする、請求項1乃至5の何れか一項に記載の製造方法。
- 前記反射コーティングは、ポジ(凸状)形状又はネガ(凹状)形状に曲面化されることを特徴とする、請求項1乃至6の何れか一項に記載の製造方法。
- 前記回路基板は、加圧成形又は熱成形処理により、少なくとも前記反射コーティングの前記場所で三次元的に形状化される、請求項1乃至7の何れか一項に記載の製造方法。
- 前記反射コーティングの前記場所における前記回路基板の曲率は、機械的形状化であって、例えば、成形、スタンピング、ミリング又は他の機械的処理により得られる、請求項8に記載の製造方法。
- 前記反射コーティングの前記場所における前記回路基板の前記曲率は、インクジェット印刷の形式の塗布処理により得られることを特徴とする、請求項8又は9に記載の製造方法。
- 傾斜した壁を有する前記印刷された反射コーティング及び前記反射コーティング上に印刷された更なる層は同様に傾斜した壁を形成するように前記凹部の方に傾斜し、故に、全体としてミラーの傾斜した壁を構成することを特徴とする、請求項1乃至10の何れか一項に記載の製造方法。
- 前記壁の領域における印刷処理中に迅速に硬化するインクが移動され、故に、前記凹部の領域に備えられたLEDにおけるフォーカシング効果を有する傾斜した反射面が形成されることを特徴とする、請求項1乃至11の何れか一項に記載の製造方法。
- 少なくとも前記LEDが色変換層により覆われることを特徴とする、請求項1乃至12の何れか一項に記載の製造方法。
- 複数のLEDの各々が別個の色変換層により覆われることを特徴とする、請求項1乃至13の何れか一項に記載の製造方法。
- 請求項1乃至14の何れか一項に記載の方法により製造される回路基板であって、照明目的で光源を有し、前記回路基板の導体に電導的に接続された少なくとも1つのLEDを有し、前記光源の光が前記回路基板に備えられた少なくとも1つのリフレクタにより方向付けられた光に変換される、回路基板であり、前記反射コーティングは、非金属色素を有するインクを有する速乾性インク組成物を有することを特徴とする、回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009019412.6 | 2009-04-29 | ||
DE102009019412A DE102009019412A1 (de) | 2009-04-29 | 2009-04-29 | Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren |
PCT/EP2010/002537 WO2010124825A1 (de) | 2009-04-29 | 2010-04-24 | Verfahren zur herstellung einer leiterplatte mit leds und gedruckter reflektorfläche sowie leiterplatte, hergestellt nach dem verfahren |
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JP2012525689A true JP2012525689A (ja) | 2012-10-22 |
JP2012525689A5 JP2012525689A5 (ja) | 2013-06-06 |
JP5889781B2 JP5889781B2 (ja) | 2016-03-22 |
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US (1) | US8887384B2 (ja) |
EP (1) | EP2425688A1 (ja) |
JP (1) | JP5889781B2 (ja) |
DE (1) | DE102009019412A1 (ja) |
WO (1) | WO2010124825A1 (ja) |
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US8184230B2 (en) * | 2009-05-08 | 2012-05-22 | Honeywell International Inc. | High efficiency backlight assembly for flat panel display assembly and method for the manufacture thereof |
AT12749U1 (de) * | 2011-04-01 | 2012-10-15 | Austria Tech & System Tech | Leiterplattenelement mit wenigstens einer led |
JP5946520B2 (ja) * | 2011-05-19 | 2016-07-06 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス装置及びオプトエレクトロニクス装置の製造方法 |
TWI518278B (zh) * | 2012-10-11 | 2016-01-21 | 隆達電子股份有限公司 | 燈具 |
KR102174819B1 (ko) * | 2014-06-25 | 2020-11-06 | 엘지디스플레이 주식회사 | 표시장치 |
CN106661255A (zh) | 2014-08-07 | 2017-05-10 | 沙特基础工业全球技术有限公司 | 用于热成型应用的导电多层片材 |
WO2017056005A1 (en) * | 2015-09-28 | 2017-04-06 | Sabic Global Technologies B.V. | Integrated transparent conductive films for thermal forming applications |
KR102435409B1 (ko) * | 2018-01-04 | 2022-08-24 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치 |
US20190312186A1 (en) * | 2018-04-09 | 2019-10-10 | Microsoft Technology Licensing, Llc | Side-Emitting LED with Increased Illumination |
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JP2007184425A (ja) * | 2006-01-06 | 2007-07-19 | Shinko Electric Ind Co Ltd | 発光装置及びその製造方法 |
JP2008507135A (ja) * | 2004-07-15 | 2008-03-06 | ゲルコアー リミテッド ライアビリティ カンパニー | 反射板を有するled照明システム |
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JP3801158B2 (ja) | 2002-11-19 | 2006-07-26 | セイコーエプソン株式会社 | 多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器 |
WO2005088736A1 (ja) | 2004-03-17 | 2005-09-22 | Japan Gore-Tex Inc. | 発光体用回路基板の製造方法、発光体用回路基板前駆体および発光体用回路基板、並びに発光体 |
JP4659421B2 (ja) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | 発光素子収納用パッケージの製造方法 |
KR101154801B1 (ko) * | 2004-12-03 | 2012-07-03 | 엔지케이 스파크 플러그 캄파니 리미티드 | 세라믹 기판 및 발광 소자 수납용 세라믹 패키지 |
JP4379386B2 (ja) * | 2005-06-23 | 2009-12-09 | セイコーエプソン株式会社 | 多層構造形成方法 |
CN101356245B (zh) | 2005-09-12 | 2013-02-13 | 电子影像公司 | 用于绘图应用的金属喷墨印刷系统 |
DE102005059524A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements |
JP2009525614A (ja) * | 2006-01-31 | 2009-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | コンプライアントなフォイル構造を有するled照明アセンブリ |
JP4828248B2 (ja) * | 2006-02-16 | 2011-11-30 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
JP5022795B2 (ja) * | 2007-07-09 | 2012-09-12 | 株式会社東芝 | 半導体受光素子およびその製造方法 |
JP2009065219A (ja) * | 2008-12-22 | 2009-03-26 | Panasonic Electric Works Co Ltd | 発光装置及びその製造方法 |
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JP2008507135A (ja) * | 2004-07-15 | 2008-03-06 | ゲルコアー リミテッド ライアビリティ カンパニー | 反射板を有するled照明システム |
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CN109075228A (zh) * | 2016-03-03 | 2018-12-21 | 奥斯兰姆奥普托半导体有限责任公司 | 连接载体、光电子器件和用于制造连接载体或光电子器件的方法 |
JP2019512165A (ja) * | 2016-03-03 | 2019-05-09 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 接続キャリア、オプトエレクトロニクス部品、および接続キャリアまたはオプトエレクトロニクス部品の製造方法 |
Also Published As
Publication number | Publication date |
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WO2010124825A4 (de) | 2011-04-14 |
US8887384B2 (en) | 2014-11-18 |
WO2010124825A1 (de) | 2010-11-04 |
US20120092867A1 (en) | 2012-04-19 |
EP2425688A1 (de) | 2012-03-07 |
DE102009019412A1 (de) | 2010-11-04 |
JP5889781B2 (ja) | 2016-03-22 |
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