JP2012522897A5 - - Google Patents
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- Publication number
- JP2012522897A5 JP2012522897A5 JP2012503952A JP2012503952A JP2012522897A5 JP 2012522897 A5 JP2012522897 A5 JP 2012522897A5 JP 2012503952 A JP2012503952 A JP 2012503952A JP 2012503952 A JP2012503952 A JP 2012503952A JP 2012522897 A5 JP2012522897 A5 JP 2012522897A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- alkylene
- group
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09005106 | 2009-04-07 | ||
| EP09005106.1 | 2009-04-07 | ||
| US25633309P | 2009-10-30 | 2009-10-30 | |
| US61/256,333 | 2009-10-30 | ||
| PCT/EP2010/053881 WO2010115717A1 (en) | 2009-04-07 | 2010-03-25 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012522897A JP2012522897A (ja) | 2012-09-27 |
| JP2012522897A5 true JP2012522897A5 (https=) | 2014-09-11 |
| JP5702359B2 JP5702359B2 (ja) | 2015-04-15 |
Family
ID=42935665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012503952A Active JP5702359B2 (ja) | 2009-04-07 | 2010-03-25 | サブミクロンの窪みの無ボイド充填用の抑制剤含有金属めっき組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US20120024711A1 (https=) |
| EP (1) | EP2417283B1 (https=) |
| JP (1) | JP5702359B2 (https=) |
| KR (1) | KR101720365B1 (https=) |
| CN (1) | CN102365396B (https=) |
| IL (1) | IL215018B (https=) |
| MY (1) | MY158203A (https=) |
| RU (1) | RU2529607C2 (https=) |
| SG (1) | SG174264A1 (https=) |
| TW (1) | TWI489011B (https=) |
| WO (1) | WO2010115717A1 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| SG10201404394QA (en) | 2009-07-30 | 2014-10-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filing |
| EP2547731B1 (en) | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2655457B1 (en) * | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2468927A1 (en) | 2010-12-21 | 2012-06-27 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US9243339B2 (en) * | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
| RU2015121797A (ru) | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| CN107531859B (zh) * | 2015-04-28 | 2020-02-14 | 罗门哈斯电子材料有限责任公司 | 作为电镀浴添加剂的双酸酐与二胺的反应产物 |
| ES2681836T3 (es) * | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| KR102566586B1 (ko) * | 2016-07-18 | 2023-08-16 | 바스프 에스이 | 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물 |
| JP7039601B2 (ja) | 2016-09-22 | 2022-03-22 | マクダーミッド エンソン インコーポレイテッド | マイクロエレクトロニクスにおける銅電着 |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US11926918B2 (en) | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US11459665B2 (en) * | 2017-12-20 | 2022-10-04 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| EP3781729B1 (en) * | 2018-04-20 | 2024-09-25 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| CN110284162B (zh) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | 一种光伏汇流焊带无氰碱性镀铜液及其制备方法 |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN114450438A (zh) | 2019-09-27 | 2022-05-06 | 巴斯夫欧洲公司 | 用于铜凸块电沉积的包含流平剂的组合物 |
| JP2023520530A (ja) | 2020-04-03 | 2023-05-17 | ビーエーエスエフ ソシエタス・ヨーロピア | ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| EP4179132B1 (en) | 2020-07-13 | 2024-09-25 | Basf Se | Composition for copper electroplating on a cobalt seed |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
| CN121693598A (zh) | 2023-08-03 | 2026-03-17 | 巴斯夫欧洲公司 | 用于在金属晶种上进行铜电镀的组合物 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| US4347108A (en) | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| US5051154A (en) | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| RU2103420C1 (ru) * | 1995-06-06 | 1998-01-27 | Калининградский государственный университет | Электролит блестящего меднения |
| DE19625991A1 (de) | 1996-06-28 | 1998-01-02 | Philips Patentverwaltung | Bildschirm mit haftungsvermittelnder Silikatschicht |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| JP3610434B2 (ja) * | 2002-02-06 | 2005-01-12 | 第一工業製薬株式会社 | 非イオン界面活性剤 |
| JP2003328179A (ja) * | 2002-05-10 | 2003-11-19 | Ebara Udylite Kk | 酸性銅めっき浴用添加剤及び該添加剤を含有する酸性銅めっき浴並びに該めっき浴を用いるめっき方法 |
| RU2237755C2 (ru) * | 2002-07-25 | 2004-10-10 | Калининградский государственный университет | Электролит меднения стальных деталей |
| US6833479B2 (en) | 2002-08-16 | 2004-12-21 | Cognis Corporation | Antimisting agents |
| JP3804788B2 (ja) * | 2002-11-18 | 2006-08-02 | 荏原ユージライト株式会社 | クローズド酸性銅めっきシステムおよびこれに利用される耐温性酸性銅めっき浴 |
| US20050072683A1 (en) | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
| US20050045485A1 (en) | 2003-09-03 | 2005-03-03 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method to improve copper electrochemical deposition |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2334831C2 (ru) * | 2006-10-31 | 2008-09-27 | Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" | Электролит меднения |
| CU23716A1 (es) * | 2008-09-30 | 2011-10-05 | Ct Ingenieria Genetica Biotech | Péptido antagonista de la actividad de la interleucina-15 |
-
2010
- 2010-03-25 RU RU2011144620/02A patent/RU2529607C2/ru not_active IP Right Cessation
- 2010-03-25 JP JP2012503952A patent/JP5702359B2/ja active Active
- 2010-03-25 WO PCT/EP2010/053881 patent/WO2010115717A1/en not_active Ceased
- 2010-03-25 US US13/257,716 patent/US20120024711A1/en not_active Abandoned
- 2010-03-25 KR KR1020117026530A patent/KR101720365B1/ko active Active
- 2010-03-25 MY MYPI2011004272A patent/MY158203A/en unknown
- 2010-03-25 CN CN201080015501.7A patent/CN102365396B/zh active Active
- 2010-03-25 SG SG2011064086A patent/SG174264A1/en unknown
- 2010-03-25 EP EP10710049.7A patent/EP2417283B1/en active Active
- 2010-04-06 TW TW099110627A patent/TWI489011B/zh active
-
2011
- 2011-09-07 IL IL215018A patent/IL215018B/en active IP Right Grant
-
2021
- 2021-05-25 US US17/329,459 patent/US20210317582A1/en not_active Abandoned
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