JP2012522897A5 - - Google Patents
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- Publication number
- JP2012522897A5 JP2012522897A5 JP2012503952A JP2012503952A JP2012522897A5 JP 2012522897 A5 JP2012522897 A5 JP 2012522897A5 JP 2012503952 A JP2012503952 A JP 2012503952A JP 2012503952 A JP2012503952 A JP 2012503952A JP 2012522897 A5 JP2012522897 A5 JP 2012522897A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- alkylene
- group
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09005106 | 2009-04-07 | ||
| EP09005106.1 | 2009-04-07 | ||
| US25633309P | 2009-10-30 | 2009-10-30 | |
| US61/256,333 | 2009-10-30 | ||
| PCT/EP2010/053881 WO2010115717A1 (en) | 2009-04-07 | 2010-03-25 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012522897A JP2012522897A (ja) | 2012-09-27 |
| JP2012522897A5 true JP2012522897A5 (enExample) | 2014-09-11 |
| JP5702359B2 JP5702359B2 (ja) | 2015-04-15 |
Family
ID=42935665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012503952A Active JP5702359B2 (ja) | 2009-04-07 | 2010-03-25 | サブミクロンの窪みの無ボイド充填用の抑制剤含有金属めっき組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US20120024711A1 (enExample) |
| EP (1) | EP2417283B1 (enExample) |
| JP (1) | JP5702359B2 (enExample) |
| KR (1) | KR101720365B1 (enExample) |
| CN (1) | CN102365396B (enExample) |
| IL (1) | IL215018B (enExample) |
| MY (1) | MY158203A (enExample) |
| RU (1) | RU2529607C2 (enExample) |
| SG (1) | SG174264A1 (enExample) |
| TW (1) | TWI489011B (enExample) |
| WO (1) | WO2010115717A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| WO2011012462A2 (en) | 2009-07-30 | 2011-02-03 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| EP2547731B1 (en) | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2468927A1 (en) | 2010-12-21 | 2012-06-27 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| RU2013158459A (ru) | 2011-06-01 | 2015-07-20 | Басф Се | Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US9243339B2 (en) * | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
| JP6411354B2 (ja) | 2012-11-09 | 2018-10-24 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平坦化剤を含む金属電気めっきのための組成物 |
| WO2016172851A1 (en) * | 2015-04-28 | 2016-11-03 | Rohm And Haas Electronic Materials Llc | Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| EP3141633B1 (en) * | 2015-09-10 | 2018-05-02 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| CN114059125A (zh) * | 2016-07-18 | 2022-02-18 | 巴斯夫欧洲公司 | 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物 |
| EP3516096A4 (en) | 2016-09-22 | 2020-10-21 | MacDermid Enthone Inc. | MICROELECTRONIC COPPER ELECTRODEPOSITION |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| KR102457310B1 (ko) * | 2016-12-20 | 2022-10-20 | 바스프 에스이 | 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물 |
| EP3679179B1 (en) | 2017-09-04 | 2023-10-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| KR102653074B1 (ko) * | 2017-12-20 | 2024-03-29 | 바스프 에스이 | 억제제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물 |
| JP2021522410A (ja) * | 2018-04-20 | 2021-08-30 | ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ | 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 |
| CN110284162B (zh) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | 一种光伏汇流焊带无氰碱性镀铜液及其制备方法 |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| IL296980A (en) | 2020-04-03 | 2022-12-01 | Basf Se | The composition for electrodeposition of copper bumps containing a polyaminoamide compensator |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| JP7781850B2 (ja) | 2020-07-13 | 2025-12-08 | ビーエーエスエフ ソシエタス・ヨーロピア | コバルトシード上の銅電気メッキ用組成物 |
| EP4409058B1 (en) | 2021-10-01 | 2025-11-05 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| EP4551742A1 (en) | 2022-07-07 | 2025-05-14 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| KR20250124348A (ko) | 2022-12-19 | 2025-08-19 | 바스프 에스이 | 구리 나노트윈 전착용 조성물 |
| KR20260046113A (ko) | 2023-08-03 | 2026-04-06 | 바스프 에스이 | 금속 시드 상의 구리 전기도금을 위한 조성물 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| US4347108A (en) | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| US5051154A (en) | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| RU2103420C1 (ru) * | 1995-06-06 | 1998-01-27 | Калининградский государственный университет | Электролит блестящего меднения |
| DE19625991A1 (de) | 1996-06-28 | 1998-01-02 | Philips Patentverwaltung | Bildschirm mit haftungsvermittelnder Silikatschicht |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| JP3610434B2 (ja) * | 2002-02-06 | 2005-01-12 | 第一工業製薬株式会社 | 非イオン界面活性剤 |
| JP2003328179A (ja) * | 2002-05-10 | 2003-11-19 | Ebara Udylite Kk | 酸性銅めっき浴用添加剤及び該添加剤を含有する酸性銅めっき浴並びに該めっき浴を用いるめっき方法 |
| RU2237755C2 (ru) * | 2002-07-25 | 2004-10-10 | Калининградский государственный университет | Электролит меднения стальных деталей |
| US6833479B2 (en) | 2002-08-16 | 2004-12-21 | Cognis Corporation | Antimisting agents |
| JP3804788B2 (ja) * | 2002-11-18 | 2006-08-02 | 荏原ユージライト株式会社 | クローズド酸性銅めっきシステムおよびこれに利用される耐温性酸性銅めっき浴 |
| US20050072683A1 (en) | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
| US20050045485A1 (en) | 2003-09-03 | 2005-03-03 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method to improve copper electrochemical deposition |
| TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| US20060213780A1 (en) * | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2334831C2 (ru) * | 2006-10-31 | 2008-09-27 | Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" | Электролит меднения |
| CU23716A1 (es) * | 2008-09-30 | 2011-10-05 | Ct Ingenieria Genetica Biotech | Péptido antagonista de la actividad de la interleucina-15 |
-
2010
- 2010-03-25 SG SG2011064086A patent/SG174264A1/en unknown
- 2010-03-25 CN CN201080015501.7A patent/CN102365396B/zh active Active
- 2010-03-25 RU RU2011144620/02A patent/RU2529607C2/ru not_active IP Right Cessation
- 2010-03-25 KR KR1020117026530A patent/KR101720365B1/ko active Active
- 2010-03-25 WO PCT/EP2010/053881 patent/WO2010115717A1/en not_active Ceased
- 2010-03-25 JP JP2012503952A patent/JP5702359B2/ja active Active
- 2010-03-25 MY MYPI2011004272A patent/MY158203A/en unknown
- 2010-03-25 US US13/257,716 patent/US20120024711A1/en not_active Abandoned
- 2010-03-25 EP EP10710049.7A patent/EP2417283B1/en active Active
- 2010-04-06 TW TW099110627A patent/TWI489011B/zh active
-
2011
- 2011-09-07 IL IL215018A patent/IL215018B/en active IP Right Grant
-
2021
- 2021-05-25 US US17/329,459 patent/US20210317582A1/en not_active Abandoned
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