JP2012502504A5 - - Google Patents

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Publication number
JP2012502504A5
JP2012502504A5 JP2011526952A JP2011526952A JP2012502504A5 JP 2012502504 A5 JP2012502504 A5 JP 2012502504A5 JP 2011526952 A JP2011526952 A JP 2011526952A JP 2011526952 A JP2011526952 A JP 2011526952A JP 2012502504 A5 JP2012502504 A5 JP 2012502504A5
Authority
JP
Japan
Prior art keywords
thin film
film material
metastable species
silicon
deposition chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011526952A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012502504A (ja
Filing date
Publication date
Priority claimed from US12/209,699 external-priority patent/US8252112B2/en
Application filed filed Critical
Publication of JP2012502504A publication Critical patent/JP2012502504A/ja
Publication of JP2012502504A5 publication Critical patent/JP2012502504A5/ja
Pending legal-status Critical Current

Links

JP2011526952A 2008-09-12 2009-09-10 あらかじめ選択された中間生成物を介する高速薄膜蒸着 Pending JP2012502504A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/209,699 2008-09-12
US12/209,699 US8252112B2 (en) 2008-09-12 2008-09-12 High speed thin film deposition via pre-selected intermediate
PCT/US2009/056445 WO2010030729A2 (en) 2008-09-12 2009-09-10 High speed thin film deposition via pre-selected intermediate

Publications (2)

Publication Number Publication Date
JP2012502504A JP2012502504A (ja) 2012-01-26
JP2012502504A5 true JP2012502504A5 (enExample) 2012-10-25

Family

ID=42005730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011526952A Pending JP2012502504A (ja) 2008-09-12 2009-09-10 あらかじめ選択された中間生成物を介する高速薄膜蒸着

Country Status (6)

Country Link
US (1) US8252112B2 (enExample)
EP (1) EP2327087A2 (enExample)
JP (1) JP2012502504A (enExample)
KR (1) KR20110053349A (enExample)
CN (1) CN102150236A (enExample)
WO (1) WO2010030729A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9177756B2 (en) 2011-04-11 2015-11-03 Lam Research Corporation E-beam enhanced decoupled source for semiconductor processing
US8980046B2 (en) 2011-04-11 2015-03-17 Lam Research Corporation Semiconductor processing system with source for decoupled ion and radical control
US8900403B2 (en) 2011-05-10 2014-12-02 Lam Research Corporation Semiconductor processing system having multiple decoupled plasma sources
US9111728B2 (en) 2011-04-11 2015-08-18 Lam Research Corporation E-beam enhanced decoupled source for semiconductor processing
US8900402B2 (en) 2011-05-10 2014-12-02 Lam Research Corporation Semiconductor processing system having multiple decoupled plasma sources
CN103022178A (zh) * 2011-09-23 2013-04-03 吉富新能源科技(上海)有限公司 利用四氟化硅制作高效率微晶硅薄膜太阳能电池
US20130272928A1 (en) * 2012-04-12 2013-10-17 Devi Shanker Misra Apparatus for the deposition of diamonds by microwave plasma chemical vapour deposition process and substrate stage used therein
US10319872B2 (en) 2012-05-10 2019-06-11 International Business Machines Corporation Cost-efficient high power PECVD deposition for solar cells
WO2015005904A1 (en) 2013-07-09 2015-01-15 Halliburton Energy Services, Inc. Integrated computational elements with frequency selective surface
MX363171B (es) 2013-07-09 2019-03-13 Halliburton Energy Services Inc Elementos computacionales integrados con filtros espectrales distribuidos lateralmente.
EP2926116A4 (en) 2013-12-24 2016-11-30 Halliburton Energy Services Inc IN-SITU MONITORING OF THE MANUFACTURE OF INTEGRATED COMPUTER ELEMENTS
US9495505B2 (en) 2013-12-24 2016-11-15 Halliburton Energy Services, Inc. Adjusting fabrication of integrated computational elements
MX359927B (es) 2013-12-24 2018-10-16 Halliburton Energy Services Inc Fabricacion de capas criticas de elementos computacionales integrados.
EP2901135B1 (en) 2013-12-24 2016-08-24 Halliburton Energy Services, Inc. Real-time monitoring of fabrication of integrated computational elements
US11274365B2 (en) 2013-12-30 2022-03-15 Halliburton Energy Services, Inc. Determining temperature dependence of complex refractive indices of layer materials during fabrication of integrated computational elements
MX360943B (es) 2013-12-31 2018-11-13 Halliburton Energy Services Inc Fabricación de elementos informáticos integrados mediante el uso de un soporte de sustrato con forma que coincida con el perfil de la pluma de deposición.
MX359196B (es) 2014-02-14 2018-09-19 Halliburton Energy Services Inc Espectroscopía in situ para el monitoreo de la fabricación de elementos computacionales integrados.
EP2943774A4 (en) 2014-03-21 2016-05-11 Halliburton Energy Services Inc MONOLITHIC, BAND-LIMITED, INTEGRATED CALCULATION ELEMENTS
US9708908B2 (en) 2014-06-13 2017-07-18 Halliburton Energy Services, Inc. Integrated computational element with multiple frequency selective surfaces
CN104152864B (zh) * 2014-08-22 2016-11-16 中国科学院宁波材料技术与工程研究所 硅薄膜的制备方法
KR102075418B1 (ko) * 2015-04-14 2020-02-11 (주)디엔에프 니켈 함유 박막의 제조방법 및 이에 따라 제조된 니켈 함유 박막

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504518A (en) * 1982-09-24 1985-03-12 Energy Conversion Devices, Inc. Method of making amorphous semiconductor alloys and devices using microwave energy
US4883686A (en) * 1988-05-26 1989-11-28 Energy Conversion Devices, Inc. Method for the high rate plasma deposition of high quality material
US5192393A (en) * 1989-05-24 1993-03-09 Hitachi, Ltd. Method for growing thin film by beam deposition and apparatus for practicing the same
US5788778A (en) * 1996-09-16 1998-08-04 Applied Komatsu Technology, Inc. Deposition chamber cleaning technique using a high power remote excitation source
JP2000096239A (ja) * 1998-09-21 2000-04-04 Tokuyama Corp 誘導結合型プラズマcvd方法及びそのための誘導結合型プラズマcvd装置
US6313017B1 (en) * 1999-01-26 2001-11-06 University Of Vermont And State Agricultural College Plasma enhanced CVD process for rapidly growing semiconductor films
US6305314B1 (en) * 1999-03-11 2001-10-23 Genvs, Inc. Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
KR101050377B1 (ko) * 2001-02-12 2011-07-20 에이에스엠 아메리카, 인코포레이티드 반도체 박막 증착을 위한 개선된 공정
US20060219170A1 (en) * 2002-01-11 2006-10-05 Energy Conversion Devices, Inc. Pore cathode for the mass production of photovoltaic devices having increased conversion efficiency
US6787185B2 (en) * 2002-02-25 2004-09-07 Micron Technology, Inc. Deposition methods for improved delivery of metastable species
DE602004009341D1 (de) * 2003-07-25 2007-11-15 Lightwind Corp Verfahren und vorrichtung zur überwachung chemischer prozesse
US20080090022A1 (en) * 2006-10-12 2008-04-17 Energy Conversion Devices, Inc. High rate, continuous deposition of high quality amorphous, nanocrystalline, microcrystalline or polycrystalline materials

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