JP2012248370A - 導電性銀ペースト - Google Patents

導電性銀ペースト Download PDF

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Publication number
JP2012248370A
JP2012248370A JP2011118200A JP2011118200A JP2012248370A JP 2012248370 A JP2012248370 A JP 2012248370A JP 2011118200 A JP2011118200 A JP 2011118200A JP 2011118200 A JP2011118200 A JP 2011118200A JP 2012248370 A JP2012248370 A JP 2012248370A
Authority
JP
Japan
Prior art keywords
curing agent
silver paste
conductive
epoxy resin
conductive silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011118200A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012248370A5 (enExample
Inventor
Marie Nishikawa
麻理衣 西川
Satoshi Shioda
聡 塩田
Mikiko Hojo
美貴子 北條
Takeshi Sato
武 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
DNP Fine Chemicals Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
DNP Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd, DNP Fine Chemicals Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2011118200A priority Critical patent/JP2012248370A/ja
Publication of JP2012248370A publication Critical patent/JP2012248370A/ja
Publication of JP2012248370A5 publication Critical patent/JP2012248370A5/ja
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2011118200A 2011-05-26 2011-05-26 導電性銀ペースト Pending JP2012248370A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011118200A JP2012248370A (ja) 2011-05-26 2011-05-26 導電性銀ペースト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011118200A JP2012248370A (ja) 2011-05-26 2011-05-26 導電性銀ペースト

Publications (2)

Publication Number Publication Date
JP2012248370A true JP2012248370A (ja) 2012-12-13
JP2012248370A5 JP2012248370A5 (enExample) 2014-05-01

Family

ID=47468643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011118200A Pending JP2012248370A (ja) 2011-05-26 2011-05-26 導電性銀ペースト

Country Status (1)

Country Link
JP (1) JP2012248370A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105469857A (zh) * 2015-12-28 2016-04-06 苏州华一新能源科技有限公司 一种用于氮化硅基底的银浆及其制备方法
CN113284644A (zh) * 2021-04-13 2021-08-20 广州市儒兴科技开发有限公司 一种异质结电池用银浆及其制备方法与应用
CN114496402A (zh) * 2022-02-15 2022-05-13 西安英诺维特新材料有限公司 一种用于触摸屏ito薄膜的快速固化uv银浆制备方法
CN114974655A (zh) * 2022-05-30 2022-08-30 深圳市首骋新材料科技有限公司 有机载体、导电浆料以及太阳能电池
KR20240013169A (ko) 2021-05-28 2024-01-30 가부시키가이샤 아데카 조성물, 경화물의 제조 방법, 및 경화물
CN119560211A (zh) * 2024-11-05 2025-03-04 东莞市通美电子科技有限公司 一种低温印刷导电银浆及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001107020A (ja) * 1999-10-12 2001-04-17 Matsushita Electric Ind Co Ltd 導電性接着剤
JP2005171170A (ja) * 2003-12-15 2005-06-30 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2005225980A (ja) * 2004-02-13 2005-08-25 Harima Chem Inc 導電性接着剤
JP2005264095A (ja) * 2004-03-22 2005-09-29 Kyoto Elex Kk 導電性樹脂組成物及び導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2009024149A (ja) * 2007-06-21 2009-02-05 Asahi Kasei Electronics Co Ltd 接着剤及び接合体
JP2009070677A (ja) * 2007-09-13 2009-04-02 Shoei Chem Ind Co 熱硬化型導電性ペースト

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001107020A (ja) * 1999-10-12 2001-04-17 Matsushita Electric Ind Co Ltd 導電性接着剤
JP2005171170A (ja) * 2003-12-15 2005-06-30 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2005225980A (ja) * 2004-02-13 2005-08-25 Harima Chem Inc 導電性接着剤
JP2005264095A (ja) * 2004-03-22 2005-09-29 Kyoto Elex Kk 導電性樹脂組成物及び導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2009024149A (ja) * 2007-06-21 2009-02-05 Asahi Kasei Electronics Co Ltd 接着剤及び接合体
JP2009070677A (ja) * 2007-09-13 2009-04-02 Shoei Chem Ind Co 熱硬化型導電性ペースト

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105469857A (zh) * 2015-12-28 2016-04-06 苏州华一新能源科技有限公司 一种用于氮化硅基底的银浆及其制备方法
CN113284644A (zh) * 2021-04-13 2021-08-20 广州市儒兴科技开发有限公司 一种异质结电池用银浆及其制备方法与应用
KR20240013169A (ko) 2021-05-28 2024-01-30 가부시키가이샤 아데카 조성물, 경화물의 제조 방법, 및 경화물
CN114496402A (zh) * 2022-02-15 2022-05-13 西安英诺维特新材料有限公司 一种用于触摸屏ito薄膜的快速固化uv银浆制备方法
CN114974655A (zh) * 2022-05-30 2022-08-30 深圳市首骋新材料科技有限公司 有机载体、导电浆料以及太阳能电池
CN119560211A (zh) * 2024-11-05 2025-03-04 东莞市通美电子科技有限公司 一种低温印刷导电银浆及其制备方法

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