JP2012248370A - Conductive silver paste - Google Patents
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Abstract
Description
本発明は、銀粉、エポキシ樹脂及び硬化剤を含有する、導電性銀ペーストに関する。 The present invention relates to a conductive silver paste containing silver powder, an epoxy resin and a curing agent.
画像表示装置における取り出し電極等、各種電子機器の導電層の材料として、金属粉末及び基体樹脂を含む導電性ペーストが用いられている（特許文献１等）。ここで、導電性ペーストの製造に用いられる金属としては、体積抵抗率が低いという観点から、銀が用いられている。 A conductive paste containing a metal powder and a base resin is used as a material for a conductive layer of various electronic devices such as an extraction electrode in an image display device (Patent Document 1, etc.). Here, silver is used as a metal used for manufacturing the conductive paste from the viewpoint of low volume resistivity.
また、電子機器の小型化が進む中、複数の導電層が非常に狭い間隔で配置されるよう回路が設計されており、このような高精細印刷をするためスクリーン印刷法が用いられている。ここで、スクリーン印刷は、通常、複数の基材に対して連続的に行われる工程であり、導電性ペーストが空気に触れている時間が比較的長いという特徴を有する。そのため、導電性ペーストに溶剤を用いる場合、従来、当該ペーストが空気に触れている間に揮発しにくいよう、高沸点の溶剤が使用される。また、硬化剤についても、塗布前のシェア熱により硬化してしまわないよう、硬化温度が比較的高いものが用いられる。しかし、これらの高沸点溶剤及び硬化温度の高い硬化剤を使用すると、熱硬化工程を高温で行う必要があるため、基材が損傷してしまうという問題がある。 In addition, as electronic devices become smaller in size, circuits are designed so that a plurality of conductive layers are arranged at very narrow intervals, and a screen printing method is used for such high-definition printing. Here, the screen printing is a process that is normally performed continuously on a plurality of substrates, and has a feature that the time during which the conductive paste is in contact with air is relatively long. Therefore, when a solvent is used for the conductive paste, a high boiling point solvent is conventionally used so that the paste is less likely to volatilize while being in contact with air. A curing agent having a relatively high curing temperature is also used so that the curing agent does not cure due to the shear heat before application. However, when these high-boiling solvents and curing agents having a high curing temperature are used, there is a problem that the base material is damaged because the thermosetting process needs to be performed at a high temperature.
一方、１３０℃以下といった比較的穏やかな硬化温度で使用できる硬化剤を用いた場合、基材への損傷を抑えるため短時間の乾燥・硬化工程に導電層を形成すると、抵抗値が高くなってしまうという問題があった。 On the other hand, when a curing agent that can be used at a relatively mild curing temperature such as 130 ° C. or lower is used, if a conductive layer is formed in a short drying / curing process in order to suppress damage to the substrate, the resistance value increases. There was a problem that.
また、スクリーン印刷での高精細印刷のためには導電性ペーストに一定以上の粘度が必要だが、高粘度の熱硬化性樹脂を用いる、チクソ剤を添加する等の方法をとると、高抵抗化を生じてしまう。また、銀の充填率を増やすことにより導電性ペーストの粘度を高めることもできるが、この方法だと、基材への密着性が大幅に悪化するという欠点がある。 In addition, for high-definition printing in screen printing, the conductive paste needs to have a certain viscosity or more. However, using a high-viscosity thermosetting resin or adding a thixotropic agent will increase the resistance. Will occur. Moreover, although the viscosity of an electrically conductive paste can also be raised by increasing the filling rate of silver, this method has the fault that the adhesiveness to a base material deteriorates significantly.
本発明は、一定の粘度を有しつつ、短時間の加熱工程で、充分に抵抗値が下がる導電性銀ペーストを提供することを課題とする。 An object of the present invention is to provide a conductive silver paste having a certain viscosity and having a sufficiently reduced resistance value in a short heating step.
上記のような状況の下、本発明者らは、鋭意研究した結果、導電性銀ペーストの製造において、硬化剤の配合量を特定の範囲にしたところ、硬化剤の配合量が当該ペーストに含まれるエポキシ樹脂及び必要に応じて添加した溶剤に対し溶解し得るよりも多いにも関わらず、抵抗値の低い導電層を形成できることを見出した。 Under the circumstances as described above, as a result of intensive studies, the inventors have made the blending amount of the curing agent included in the paste when the blending amount of the curing agent is within a specific range in the production of the conductive silver paste. The present inventors have found that a conductive layer having a low resistance value can be formed even though the amount of the epoxy resin can be dissolved in the epoxy resin and the solvent added as necessary.
従って、本発明は、以下の項を提供する：
項１．銀粉、エポキシ樹脂及び硬化剤を含有し、かつ硬化剤の配合割合が、エポキシ樹脂１重量部に対して、0.2〜1.5重量部である、導電性銀ペースト。
Accordingly, the present invention provides the following sections:
Item 1. A conductive silver paste containing silver powder, an epoxy resin and a curing agent, and the blending ratio of the curing agent is 0.2 to 1.5 parts by weight with respect to 1 part by weight of the epoxy resin.
項２．銀粉の配合量が、エポキシ樹脂１００重量部に対し、2000〜4000重量部である、項１に記載の導電性銀ペースト。 Item 2. The electroconductive silver paste of claim | item 1 whose compounding quantity of silver powder is 2000-4000 weight part with respect to 100 weight part of epoxy resins.
項３．硬化剤が、アミン系硬化剤、尿素系硬化剤、酸無水物系硬化剤及び芳香剤アミン系硬化剤からなる群より選択される少なくとも一種である、項１又は２に記載の導電性銀ペースト。 Item 3. Item 3. The conductive silver paste according to item 1 or 2, wherein the curing agent is at least one selected from the group consisting of an amine curing agent, a urea curing agent, an acid anhydride curing agent, and an aromatic amine curing agent. .
項４．（１）基材に、項１〜３のいずれか１項に記載の導電性銀ペーストを塗布する工程、及び
（２）工程（１）で得られた塗膜を加熱硬化する工程
を含む、導電層の形成方法。
Item 4. (1) The process of apply | coating the electroconductive silver paste of any one of claim | item 1-3 to a base material, and (2) The process of heat-hardening the coating film obtained by process (1), A method for forming a conductive layer.
本発明に係る導電性銀ペーストは、によれば、スクリーン印刷よる高精細印刷に必要とされる一定の粘度を有しつつ、短時間の加熱工程で、充分に抵抗値が下がる導電性銀ペーストを提供することができる。 According to the conductive silver paste according to the present invention, the conductive silver paste has a certain viscosity required for high-definition printing by screen printing and has a sufficiently low resistance value in a short heating step. Can be provided.
本発明は、銀粉、エポキシ樹脂及び硬化剤を含有し、かつ硬化剤の配合割合が、エポキシ樹脂１重量部に対して、0.2〜1.5重量部である、導電性銀ペーストを提供する。 This invention provides the electroconductive silver paste which contains silver powder, an epoxy resin, and a hardening | curing agent, and the compounding ratio of a hardening | curing agent is 0.2-1.5 weight part with respect to 1 weight part of epoxy resins.
銀粉
銀粉としては、公知のものを使用することができ、例えば、平均粒径が１μｍ〜５μｍ程度の球状又はフレーク状の銀粉、平均粒径が０．０５μｍ〜０．５μｍ程度の銀微粒子等が挙げられる。また、平均一次粒子径が０．０５μｍ〜０．５μｍの銀微粒子が凝集してなる平均粒径が０．５μｍ〜５μｍの凝集状銀粉を用いてもよい。さらに、これらの平均粒径が異なる銀粉を混合して用いてもよい。
As the silver powder silver powder, known ones can be used, for example, spherical or flaky silver powder having an average particle diameter of about 1 μm to 5 μm, silver fine particles having an average particle diameter of about 0.05 μm to 0.5 μm, and the like. Can be mentioned. Further, an agglomerated silver powder having an average particle size of 0.5 μm to 5 μm formed by aggregation of silver fine particles having an average primary particle size of 0.05 μm to 0.5 μm may be used. Furthermore, you may mix and use these silver powder from which average particle diameter differs.
銀粉の配合量は、本発明の効果が得られる限り特に限定されないが、例えば、エポキシ樹脂１００重量部に対し、2000〜4000重量部が好ましく、2500〜3500重量部がより好ましい。導電性銀ペーストにおいては、銀粉はペーストに導電性を付与するが、硬化剤の移動経路を制限することによって硬化を長くしてしまうものと推測される。しかし、本発明においては、銀粉を上記範囲で配合することにより、充分な導電性を得られ、かつ比較的短時間で導電性銀ペーストが硬化されるため好ましい。 Although the compounding quantity of silver powder is not specifically limited as long as the effect of this invention is acquired, For example, 2000-4000 weight part is preferable with respect to 100 weight part of epoxy resins, and 2500-3500 weight part is more preferable. In the conductive silver paste, the silver powder imparts conductivity to the paste, but it is presumed that the curing will be prolonged by limiting the movement path of the curing agent. However, in the present invention, it is preferable to add silver powder in the above range since sufficient conductivity can be obtained and the conductive silver paste is cured in a relatively short time.
エポキシ樹脂
エポキシ樹脂としては、エポキシ基を分子中に２個以上含有する化合物が挙げられ、公知のものを用いることができる。エポキシ樹脂としては、液状エポキシ樹脂が好ましく、例えば、ビスフェノールＡ型エポキシ樹脂；ビスフェノールＦ型エポキシ樹脂；ビスフェノールＡＤ型エポキシ樹脂；フェノールノボラック型エポキシ樹脂；クレゾールノボラック型エポキシ樹脂等が挙げられる。これらのエポキシ樹脂は単独で、又は２種以上を混合して使用することができる。
Examples of the epoxy resin epoxy resin include compounds containing two or more epoxy groups in the molecule, and known ones can be used. The epoxy resin is preferably a liquid epoxy resin, and examples thereof include bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol AD type epoxy resin; phenol novolac type epoxy resin; cresol novolac type epoxy resin. These epoxy resins can be used alone or in admixture of two or more.
エポキシ樹脂の市販品としては、例えば、エピコート８０６、エピコート１２５５ＨＸ３０、エピコート１５２、エピコート８０７、エピコート８２８（ジャパンエポキシレジン株式会社製）、アデカレジンＥＰ−４１００、アデカレジンＥＰ−４９０１（旭電化工業株式会社製）、エピクロン８３０、およびエピクロン８４０（大日本インキ工業株式会社製）等が挙げられる。 Commercially available epoxy resins include, for example, Epicoat 806, Epicoat 1255HX30, Epicoat 152, Epicoat 807, Epicoat 828 (Japan Epoxy Resin Co., Ltd.), Adeka Resin EP-4100, Adeka Resin EP-4901 (Asahi Denka Kogyo Co., Ltd.) , Epicron 830, Epicron 840 (manufactured by Dainippon Ink & Chemicals, Inc.) and the like.
エポキシ樹脂の配合量は、本発明の効果が得られる限り特に限定されないが、例えば、導電性銀ペーストの重量に対して、0.5〜20重量％が好ましく、1〜15重量％がより好ましい。 Although the compounding quantity of an epoxy resin is not specifically limited as long as the effect of this invention is acquired, For example, 0.5-20 weight% is preferable with respect to the weight of an electroconductive silver paste, and 1-15 weight% is more preferable.
硬化剤
硬化剤としては、ジシアンジアミド、カルボン酸ヒドラジド、イミダゾール化合物等のアミン系硬化剤；３−（３，４−ジクロロフェニル）−１、１−ジメチル尿素等の尿素系硬化剤；無水フタル酸、無水メチルナジック酸、無水ピロメリット酸、無水ヘキサヒドロフタル酸等の酸無水物系硬化剤；ジアミノジフェニルメタン、ジアミノジフェニルスルフォン酸等の芳香族アミン系（アミンアダクト）硬化剤等が挙げられる。これらの硬化剤は、一種単独でも、２種以上を組合わせて使用してもよい。
Curing agent curing agents include amine curing agents such as dicyandiamide, carboxylic acid hydrazide, and imidazole compounds; urea curing agents such as 3- (3,4-dichlorophenyl) -1,1-dimethylurea; phthalic anhydride, anhydrous Examples include acid anhydride curing agents such as methyl nadic acid, pyromellitic anhydride, and hexahydrophthalic anhydride; aromatic amine-based (amine adduct) curing agents such as diaminodiphenylmethane and diaminodiphenylsulfonic acid. These curing agents may be used alone or in combination of two or more.
硬化剤としては、例えば、好ましくは80〜150℃、より好ましくは１２０〜１３０℃で硬化するものが好ましい。 As a hardening | curing agent, For example, Preferably what is hardened | cured at 80-150 degreeC, More preferably, 120-130 degreeC is preferable.
本発明は、硬化剤の配合量を、エポキシ樹脂１重量部に対して、０．３〜1.5重量部、好ましくは0.3〜0.8重量部とすることを特徴とする。かかる配合量は、液状エポキシ樹脂に溶解し得る限度を大きく超えているが、このような量の硬化剤を配合することにより、高精細印刷適性を有し、かつ低温での硬化でも短時間で抵抗値が減少するため、導電層の形成に非常に有効である。 The present invention is characterized in that the compounding amount of the curing agent is 0.3 to 1.5 parts by weight, preferably 0.3 to 0.8 parts by weight with respect to 1 part by weight of the epoxy resin. Such a blending amount greatly exceeds the limit that can be dissolved in the liquid epoxy resin, but by blending such a curing agent, it has high-definition printability and can be cured in a short time even at a low temperature. Since the resistance value decreases, it is very effective for forming the conductive layer.
溶剤
本発明の導電性銀ペーストには、溶剤を添加してもよい。かかる溶剤としては、特に限定されないが、酢酸ブチル、エチルセロソルブ、ブチルセロソルブ、ブチルセロソルブアセテート、ブタノール、テルピネオール、チキサノール、ジプロピレングリコール等が挙げられる。加熱硬化前に揮発しにくく、かつ加熱工程で速やかに揮発することが好ましいとの観点から、溶剤は、沸点が80〜300℃のものが好ましく、100〜250℃のものがより好ましい。溶剤を添加する場合、その配合量は、特に限定されないが、銀粉１重量部に対して、0.50重量部以下、より好ましくは0.05〜0.20重量部が好ましい。
Solvent A solvent may be added to the conductive silver paste of the present invention. Examples of such a solvent include, but are not limited to, butyl acetate, ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate, butanol, terpineol, thixanol, dipropylene glycol and the like. From the standpoint that it is difficult to volatilize before heating and it is preferable to volatilize quickly in the heating step, the solvent preferably has a boiling point of 80 to 300 ° C, more preferably 100 to 250 ° C. When adding a solvent, the compounding quantity is not specifically limited, However 0.50 weight part or less with respect to 1 weight part of silver powder, More preferably, 0.05-0.20 weight part is preferable.
熱可塑性樹脂
本発明の導電性銀ペーストには、熱可塑性樹脂を混合してもよい。かかる熱可塑性樹脂としては、特に限定されないが、アクリル樹脂、フェノキシ樹脂、ポリエステル樹脂、セルロース樹脂等が挙げられる。熱可塑性樹脂を添加する場合、その配合量は、特に限定されないが、エポキシ樹脂１重量部に対して、１０重量部以下、より好ましくは０．５〜３重量部が好ましい。
Thermoplastic Resin The conductive silver paste of the present invention may be mixed with a thermoplastic resin. The thermoplastic resin is not particularly limited, and examples thereof include an acrylic resin, a phenoxy resin, a polyester resin, and a cellulose resin. When adding a thermoplastic resin, the compounding quantity is although it does not specifically limit, 10 weight part or less with respect to 1 weight part of epoxy resins, More preferably, 0.5-3 weight part is preferable.
その他成分
本発明の導電性銀ペーストには、本発明の効果を損なわない程度に、重合禁止剤、酸化防止剤、分散剤、界面活性剤、光安定剤、レベリング剤、基板密着性向上等のための界面活性剤、滑り性向上のための滑剤、レオロジーコントロール剤等を適宜使用してもよい。
Other components The conductive silver paste of the present invention has a polymerization inhibitor, an antioxidant, a dispersant, a surfactant, a light stabilizer, a leveling agent, an improvement in substrate adhesion, etc. to the extent that the effects of the present invention are not impaired. Surfactants, lubricants for improving slipperiness, rheology control agents and the like may be used as appropriate.
本発明の導電性銀ペーストの粘度は、例えば、100〜2000Ｐａ．ｓが好ましく、300〜1500Ｐａ．ｓがより好ましい。ここで、導電性銀ペーストの粘度は、粘度計（B型）を用い、25℃で、回転数５ｒｐｍで測定することができる。本発明においては、上記範囲の粘度の導電性銀ペーストを用いることによって、高精細スクリーン印刷が可能となるため好ましい。 The viscosity of the conductive silver paste of the present invention is, for example, 100 to 2000 Pa.s. s is preferable, and 300 to 1500 Pa.s. s is more preferable. Here, the viscosity of the conductive silver paste can be measured using a viscometer (B type) at 25 ° C. and a rotation speed of 5 rpm. In the present invention, it is preferable to use a conductive silver paste having a viscosity in the above range because high-definition screen printing is possible.
導電層の形成方法
本発明の導電性銀ペーストは、上記各成分を混合することにより調製することができる。得られた本発明の導電性銀ペーストをスクリーン印刷法により基材に塗布し、加熱硬化することにより、導電層を形成することができる。
Method for Forming Conductive Layer The conductive silver paste of the present invention can be prepared by mixing the above components. A conductive layer can be formed by applying the obtained conductive silver paste of the present invention to a substrate by a screen printing method and curing by heating.
基材としては、電子機器の素子の基材として用いられているものを広く使用することができる。例えば、ＳＵＳ等の金属、ポリエステル、ポリイミド等の樹脂、ガラス等が挙げられる。また、本発明においては、基材には、上記金属、樹脂、ガラス等の上に導電層、絶縁層等を積層したものも含まれる。 As a base material, what is used as a base material of the element of an electronic device can be used widely. Examples thereof include metals such as SUS, resins such as polyester and polyimide, and glass. Moreover, in this invention, what laminated | stacked the conductive layer, the insulating layer, etc. on the said metal, resin, glass etc. is also contained in a base material.
本発明に係る導電性銀ペーストにおいては、エポキシ樹脂及び必要に応じて添加した溶剤に溶解し得るよりも多量の硬化剤が配合されているため、固体状の硬化剤が、一部未溶解の状態で導電性銀ペーストに混合されている。従来、硬化剤が未溶解の状態だと硬化剤と樹脂との接触面積が小さいため充分な硬化性が得られず、また硬化剤が溶解せずに固体状態で導電層に残ってしまうと、抵抗値上昇をもたらしてしまう。しかし、本発明の導電性銀ペーストにおいては、導電性銀ペーストは、低温かつ短時間でも充分に硬化し、かつ得られた導電層の抵抗値も充分に低かった。このように硬化剤が充分に機能したのは、常温で未溶解の硬化剤も加熱工程によりエポキシ樹脂中に溶解しつつこれを硬化しているためと推察される。 In the conductive silver paste according to the present invention, since a larger amount of curing agent is blended than can be dissolved in the epoxy resin and optionally added solvent, the solid curing agent is partially undissolved. In the state, it is mixed with the conductive silver paste. Conventionally, when the curing agent is in an undissolved state, the contact area between the curing agent and the resin is small, so that sufficient curability cannot be obtained, and the curing agent does not dissolve and remains in the conductive layer in a solid state. The resistance value will increase. However, in the conductive silver paste of the present invention, the conductive silver paste was sufficiently cured even at a low temperature for a short time, and the resistance value of the obtained conductive layer was sufficiently low. The reason why the curing agent functioned sufficiently in this way is presumed to be that the undissolved curing agent at room temperature was cured while being dissolved in the epoxy resin by the heating process.
加熱硬化の温度としては、基材を損傷しない範囲で、例えば、80〜300℃、好ましくは100〜200℃の範囲で設定できる。硬化時間は、例えば、1〜60分、好ましくは5〜30分の範囲で設定できる。導電層の膜厚（乾燥時）としては、特に限定されないが、通常、1〜60μｍ、好ましくは5〜50μｍの範囲で適宜設定できる。その他のスクリーン印刷の条件としては、自体公知の条件を適宜採用することができる。 The temperature for heat curing can be set in a range that does not damage the substrate, for example, in the range of 80 to 300 ° C., preferably 100 to 200 ° C. The curing time can be set, for example, in the range of 1 to 60 minutes, preferably 5 to 30 minutes. Although it does not specifically limit as a film thickness (at the time of drying) of an electroconductive layer, Usually, 1-60 micrometers, Preferably it can set suitably in 5-50 micrometers. As other screen printing conditions, conditions known per se can be appropriately employed.
以下に、製造例、実施例、及び比較例を用いて本発明の具体的な実施形態を詳述するが、本発明は、以下の実施例に限定されるものではない。 Hereinafter, specific embodiments of the present invention will be described in detail using production examples, examples, and comparative examples, but the present invention is not limited to the following examples.
製造例１
平均粒径が2μｍの球状銀粉40ｇ、熱硬化性エポキシ樹脂エピクロン840（DIC株式会社製、1.3g）、硬化剤としてアミキュアMY-H（イミダゾール系硬化剤、味の素ファインテクノ株式会社製、0.6ｇ）を、溶剤エチルジグリコールアセテート（4.8g）とともに粗練りした後、三本ロールミルを用いて混錬することにより、導電性銀ペーストを得た。得られた導電性銀ペーストの粘度は、800Ｐａ・ｓであった。得られた導電性ペーストを１００ｍｍ×１００ｍｍのＰＥＴ基材にスクリーン印刷し、１３０℃で１５分間熱風乾燥オーブンで硬化して、硬化膜を作製した。
Production Example 1
40 g of spherical silver powder with an average particle diameter of 2 μm, thermosetting epoxy resin Epicron 840 (DIC Corporation, 1.3 g), and Amicure MY-H (imidazole curing agent, Ajinomoto Fine-Techno Corporation, 0.6 g) as a curing agent Was coarsely kneaded with a solvent ethyl diglycol acetate (4.8 g), and then kneaded using a three-roll mill to obtain a conductive silver paste. The viscosity of the obtained conductive silver paste was 800 Pa · s. The obtained conductive paste was screen-printed on a 100 mm × 100 mm PET substrate and cured in a hot air drying oven at 130 ° C. for 15 minutes to prepare a cured film.
製造例２〜３
硬化剤の配合量をそれぞれ0.75ｇ及び0.9gとする以外、製造例１と同様にして、導電性銀ペースト及びこれを用いた硬化膜を作製し、製造例２及び３とした。導電性銀ペーストの粘度は、それぞれ、1000Ｐａ・ｓ及び1400Ｐａ・ｓであった。
Production Examples 2-3
A conductive silver paste and a cured film using the same were prepared in the same manner as in Production Example 1 except that the blending amounts of the curing agents were 0.75 g and 0.9 g, respectively, and Production Examples 2 and 3 were obtained. The viscosity of the conductive silver paste was 1000 Pa · s and 1400 Pa · s, respectively.
比較製造例１
硬化剤の配合量を0.3ｇとする以外、製造例１と同様にして、導電性銀ペースト及びこれを用いた硬化膜を作製した。導電性銀ペーストの粘度は、750Ｐａ・ｓであった。
Comparative production example 1
A conductive silver paste and a cured film using the same were prepared in the same manner as in Production Example 1 except that the amount of the curing agent was 0.3 g. The viscosity of the conductive silver paste was 750 Pa · s.
実施例及び比較例
得られた硬化膜について、体積抵抗値を以下のようにして測定した。結果を表１に示す。
Examples and Comparative Examples Volume resistance values of the cured films obtained were measured as follows. The results are shown in Table 1.
得られた硬化膜のうち、５ｍｍ×２５ｍｍのベタパターン印刷部について体積抵抗値を測定した。体積抵抗値の測定には、ロレスタＧＰ ＭＣＰ−Ｔ６１０型を用い四端子法にて測定した。 The volume resistance value was measured about the solid pattern printing part of 5 mm x 25 mm among the obtained cured films. The volume resistance value was measured by a four-terminal method using a Loresta GP MCP-T610 type.
表１に示されるように、製造例１〜３で得られた導電性銀ペーストは130℃、15分という比較的短い加熱時間で抵抗値の低い硬化膜を得ることができた。 As shown in Table 1, the conductive silver paste obtained in Production Examples 1 to 3 was able to obtain a cured film having a low resistance value in a relatively short heating time of 130 ° C. and 15 minutes.
これに対して比較製造例１で得られた導電性銀ペーストを用いた場合、130℃、15分で加熱して得られた硬化膜の抵抗値は非常に高かった。これは、上記加熱条件では、比較製造例１の導電性銀ペーストが充分に硬化していないためと推測される。従って、比較例の硬化膜は、その後の熱を受けることにより硬化が進んでしまうことが予測され、品質が不安定であるという欠点も有する。 On the other hand, when the conductive silver paste obtained in Comparative Production Example 1 was used, the resistance value of the cured film obtained by heating at 130 ° C. for 15 minutes was very high. This is presumably because the conductive silver paste of Comparative Production Example 1 was not sufficiently cured under the above heating conditions. Accordingly, the cured film of the comparative example is predicted to be cured by receiving subsequent heat, and has a defect that the quality is unstable.
Claims (4)
（２）工程（１）で得られた塗膜を加熱硬化する工程
を含む、導電層の形成方法。 (1) The process of apply | coating the electroconductive silver paste of any one of Claims 1-3 to a base material, and (2) The process of heat-hardening the coating film obtained at the process (1) is included. The formation method of a conductive layer.
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| JP2011118200A JP2012248370A (en) | 2011-05-26 | 2011-05-26 | Conductive silver paste |
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| CN105469857A (en) * | 2015-12-28 | 2016-04-06 | 苏州华一新能源科技有限公司 | Silver paste used for silicon nitride substrate and preparation method thereof |
| CN113284644A (en) * | 2021-04-13 | 2021-08-20 | 广州市儒兴科技开发有限公司 | Silver paste for heterojunction battery and preparation method and application thereof |
| CN114496402A (en) * | 2022-02-15 | 2022-05-13 | 西安英诺维特新材料有限公司 | Preparation method of fast curing UV silver paste for ITO film of touch screen |
| CN114974655A (en) * | 2022-05-30 | 2022-08-30 | 深圳市首骋新材料科技有限公司 | Organic vehicle, conductive paste and solar cell |
| KR20240013169A (en) | 2021-05-28 | 2024-01-30 | 가부시키가이샤 아데카 | Composition, method for producing cured product, and cured product |
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