JP2012238987A - 振動子の製造方法。 - Google Patents
振動子の製造方法。 Download PDFInfo
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- JP2012238987A JP2012238987A JP2011105924A JP2011105924A JP2012238987A JP 2012238987 A JP2012238987 A JP 2012238987A JP 2011105924 A JP2011105924 A JP 2011105924A JP 2011105924 A JP2011105924 A JP 2011105924A JP 2012238987 A JP2012238987 A JP 2012238987A
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 238000005520 cutting process Methods 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 238000003860 storage Methods 0.000 claims abstract description 18
- 238000004804 winding Methods 0.000 claims description 10
- 238000005304 joining Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 abstract description 49
- 230000002093 peripheral effect Effects 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000007689 inspection Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- -1 and for example Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011105924A JP2012238987A (ja) | 2011-05-11 | 2011-05-11 | 振動子の製造方法。 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011105924A JP2012238987A (ja) | 2011-05-11 | 2011-05-11 | 振動子の製造方法。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012238987A true JP2012238987A (ja) | 2012-12-06 |
| JP2012238987A5 JP2012238987A5 (enExample) | 2014-05-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011105924A Withdrawn JP2012238987A (ja) | 2011-05-11 | 2011-05-11 | 振動子の製造方法。 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012238987A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016015757A (ja) * | 2013-07-19 | 2016-01-28 | 日本電波工業株式会社 | 表面実装型水晶デバイス |
| JP2018164128A (ja) * | 2017-03-24 | 2018-10-18 | 京セラクリスタルデバイス株式会社 | 水晶デバイスの製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040934A (ja) * | 1998-07-23 | 2000-02-08 | Toyo Commun Equip Co Ltd | 圧電デバイスの閉蓋構造及び閉蓋方法 |
| JP2005294617A (ja) * | 2004-04-01 | 2005-10-20 | Kyocera Corp | 電子装置の製造方法 |
| JP2005353885A (ja) * | 2004-06-11 | 2005-12-22 | Seiko Epson Corp | 電子デバイスの製造方法 |
| JP2006129303A (ja) * | 2004-10-29 | 2006-05-18 | Kyocera Kinseki Corp | 圧電発振器の製造方法 |
| JP2008219836A (ja) * | 2007-03-08 | 2008-09-18 | Epson Toyocom Corp | 圧電デバイスの製造方法 |
-
2011
- 2011-05-11 JP JP2011105924A patent/JP2012238987A/ja not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040934A (ja) * | 1998-07-23 | 2000-02-08 | Toyo Commun Equip Co Ltd | 圧電デバイスの閉蓋構造及び閉蓋方法 |
| JP2005294617A (ja) * | 2004-04-01 | 2005-10-20 | Kyocera Corp | 電子装置の製造方法 |
| JP2005353885A (ja) * | 2004-06-11 | 2005-12-22 | Seiko Epson Corp | 電子デバイスの製造方法 |
| JP2006129303A (ja) * | 2004-10-29 | 2006-05-18 | Kyocera Kinseki Corp | 圧電発振器の製造方法 |
| JP2008219836A (ja) * | 2007-03-08 | 2008-09-18 | Epson Toyocom Corp | 圧電デバイスの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016015757A (ja) * | 2013-07-19 | 2016-01-28 | 日本電波工業株式会社 | 表面実装型水晶デバイス |
| JP2018164128A (ja) * | 2017-03-24 | 2018-10-18 | 京セラクリスタルデバイス株式会社 | 水晶デバイスの製造方法 |
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