JP2012186446A5 - - Google Patents

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Publication number
JP2012186446A5
JP2012186446A5 JP2012000142A JP2012000142A JP2012186446A5 JP 2012186446 A5 JP2012186446 A5 JP 2012186446A5 JP 2012000142 A JP2012000142 A JP 2012000142A JP 2012000142 A JP2012000142 A JP 2012000142A JP 2012186446 A5 JP2012186446 A5 JP 2012186446A5
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JP
Japan
Prior art keywords
dicing tape
workpiece
semiconductor wafer
expanding
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012000142A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012186446A (ja
JP5854215B2 (ja
Filing date
Publication date
Priority claimed from JP2012000142A external-priority patent/JP5854215B2/ja
Priority to JP2012000142A priority Critical patent/JP5854215B2/ja
Application filed filed Critical
Priority to KR1020120013859A priority patent/KR101843794B1/ko
Publication of JP2012186446A publication Critical patent/JP2012186446A/ja
Publication of JP2012186446A5 publication Critical patent/JP2012186446A5/ja
Publication of JP5854215B2 publication Critical patent/JP5854215B2/ja
Application granted granted Critical
Priority to KR1020170062855A priority patent/KR102063450B1/ko
Priority to KR1020180033136A priority patent/KR102102596B1/ko
Priority to KR1020190179457A priority patent/KR102105280B1/ko
Priority to KR1020200047391A priority patent/KR102225430B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012000142A 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法 Active JP5854215B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法
KR1020120013859A KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법
KR1020170062855A KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011031292 2011-02-16
JP2011031292 2011-02-16
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Publications (3)

Publication Number Publication Date
JP2012186446A JP2012186446A (ja) 2012-09-27
JP2012186446A5 true JP2012186446A5 (https=) 2015-03-19
JP5854215B2 JP5854215B2 (ja) 2016-02-09

Family

ID=47016199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012000142A Active JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Country Status (2)

Country Link
JP (1) JP5854215B2 (https=)
KR (4) KR102063450B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) * 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
JP4306359B2 (ja) * 2003-07-25 2009-07-29 株式会社東京精密 エキスパンド方法
EP1575081A1 (en) * 2002-10-28 2005-09-14 Tokyo Seimitsu Co.,Ltd. Expansion method and device
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP4471627B2 (ja) * 2003-11-06 2010-06-02 株式会社ディスコ ウエーハの分割方法
JP2005317732A (ja) * 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4777761B2 (ja) * 2005-12-02 2011-09-21 株式会社ディスコ ウエーハの分割方法
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2007226911A (ja) * 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147316A (ja) * 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP5378780B2 (ja) * 2008-12-19 2013-12-25 株式会社ディスコ テープ拡張方法およびテープ拡張装置
JP5791866B2 (ja) * 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置

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