DE112014003356T8 - Silizium-Wafer-Wärmebehandlungsverfahren - Google Patents

Silizium-Wafer-Wärmebehandlungsverfahren Download PDF

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Publication number
DE112014003356T8
DE112014003356T8 DE112014003356.1T DE112014003356T DE112014003356T8 DE 112014003356 T8 DE112014003356 T8 DE 112014003356T8 DE 112014003356 T DE112014003356 T DE 112014003356T DE 112014003356 T8 DE112014003356 T8 DE 112014003356T8
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DE
Germany
Prior art keywords
heat treatment
silicon wafer
treatment process
wafer heat
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112014003356.1T
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English (en)
Other versions
DE112014003356T5 (de
DE112014003356B4 (de
Inventor
Wei Feng Qu
Fumio Tahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE112014003356T5 publication Critical patent/DE112014003356T5/de
Publication of DE112014003356T8 publication Critical patent/DE112014003356T8/de
Application granted granted Critical
Publication of DE112014003356B4 publication Critical patent/DE112014003356B4/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00—Single-crystal growth directly from the solid state
    • C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • C30B1/04—Isothermal recrystallisation
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02—Heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
    • H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
    • H01L21/164—Oxidation and subsequent heat treatment of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE112014003356.1T 2013-08-23 2014-06-26 Silizium-Wafer-Wärmebehandlungsverfahren Active DE112014003356B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013173248A JP5991284B2 (ja) 2013-08-23 2013-08-23 シリコンウェーハの熱処理方法
JP2013-173248 2013-08-23
PCT/JP2014/003416 WO2015025448A1 (ja) 2013-08-23 2014-06-26 シリコンウェーハの熱処理方法

Publications (3)

Publication Number Publication Date
DE112014003356T5 DE112014003356T5 (de) 2016-03-31
DE112014003356T8 true DE112014003356T8 (de) 2016-04-14
DE112014003356B4 DE112014003356B4 (de) 2022-09-29

Family

ID=52483248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014003356.1T Active DE112014003356B4 (de) 2013-08-23 2014-06-26 Silizium-Wafer-Wärmebehandlungsverfahren

Country Status (7)

Country Link
US (1) US9708726B2 (de)
JP (1) JP5991284B2 (de)
KR (1) KR102056840B1 (de)
CN (1) CN105324834B (de)
DE (1) DE112014003356B4 (de)
TW (1) TWI578400B (de)
WO (1) WO2015025448A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6036732B2 (ja) * 2014-03-18 2016-11-30 信越半導体株式会社 貼り合わせウェーハの製造方法
JP7361061B2 (ja) * 2017-01-11 2023-10-13 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ
JP6845020B2 (ja) * 2017-01-11 2021-03-17 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの熱処理方法
JP6971622B2 (ja) * 2017-05-10 2021-11-24 グローバルウェーハズ・ジャパン株式会社 半導体ウェハの製造方法及び半導体ウェハ
JP7287253B2 (ja) * 2019-11-28 2023-06-06 株式会社Sumco 熱処理ウェーハの製造方法、熱処理装置および熱処理ウェーハの製造装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548949B2 (ja) * 1987-09-01 1996-10-30 東芝セラミックス株式会社 半導体製造用構成部材
JPH10199948A (ja) * 1997-01-08 1998-07-31 Sumitomo Metal Ind Ltd 半導体用治具材料の評価方法
JPH10242254A (ja) * 1997-02-21 1998-09-11 Ado Matsupu:Kk 半導体製造用治具
JP4290551B2 (ja) * 2001-11-08 2009-07-08 株式会社ブリヂストン 炭化ケイ素焼結体治具の製造方法
US20040188319A1 (en) 2003-03-28 2004-09-30 Saint-Gobain Ceramics & Plastics, Inc. Wafer carrier having improved processing characteristics
KR100758965B1 (ko) * 2003-04-02 2007-09-14 가부시키가이샤 사무코 반도체 웨이퍼용 열처리 치구
WO2005031843A1 (ja) * 2003-09-29 2005-04-07 Hitachi Kokusai Electric Inc. 熱処理装置及び基板の製造方法
US7601227B2 (en) * 2005-08-05 2009-10-13 Sumco Corporation High purification method of jig for semiconductor heat treatment
JP2010177442A (ja) * 2009-01-29 2010-08-12 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 シリコンウェーハの製造方法

Also Published As

Publication number Publication date
JP5991284B2 (ja) 2016-09-14
KR20160046786A (ko) 2016-04-29
WO2015025448A1 (ja) 2015-02-26
CN105324834B (zh) 2017-09-29
US20160130718A1 (en) 2016-05-12
KR102056840B1 (ko) 2019-12-17
DE112014003356T5 (de) 2016-03-31
CN105324834A (zh) 2016-02-10
JP2015041738A (ja) 2015-03-02
TWI578400B (zh) 2017-04-11
US9708726B2 (en) 2017-07-18
DE112014003356B4 (de) 2022-09-29
TW201523736A (zh) 2015-06-16

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