JP2012169361A5 - - Google Patents

Download PDF

Info

Publication number
JP2012169361A5
JP2012169361A5 JP2011027606A JP2011027606A JP2012169361A5 JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5 JP 2011027606 A JP2011027606 A JP 2011027606A JP 2011027606 A JP2011027606 A JP 2011027606A JP 2012169361 A5 JP2012169361 A5 JP 2012169361A5
Authority
JP
Japan
Prior art keywords
substrate
stage
mirror finish
mirror
appearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011027606A
Other languages
English (en)
Japanese (ja)
Other versions
JP5950269B2 (ja
JP2012169361A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011027606A priority Critical patent/JP5950269B2/ja
Priority claimed from JP2011027606A external-priority patent/JP5950269B2/ja
Publication of JP2012169361A publication Critical patent/JP2012169361A/ja
Publication of JP2012169361A5 publication Critical patent/JP2012169361A5/ja
Application granted granted Critical
Publication of JP5950269B2 publication Critical patent/JP5950269B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011027606A 2011-02-10 2011-02-10 基板加工方法及び基板 Active JP5950269B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011027606A JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011027606A JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Publications (3)

Publication Number Publication Date
JP2012169361A JP2012169361A (ja) 2012-09-06
JP2012169361A5 true JP2012169361A5 (enExample) 2014-04-03
JP5950269B2 JP5950269B2 (ja) 2016-07-13

Family

ID=46973266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011027606A Active JP5950269B2 (ja) 2011-02-10 2011-02-10 基板加工方法及び基板

Country Status (1)

Country Link
JP (1) JP5950269B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014013107A1 (de) 2013-10-08 2015-04-09 Siltectra Gmbh Neuartiges Waferherstellungsverfahren
DE102015000449A1 (de) 2015-01-15 2016-07-21 Siltectra Gmbh Festkörperteilung mittels Stoffumwandlung
US11407066B2 (en) 2014-01-15 2022-08-09 Siltectra Gmbh Splitting of a solid using conversion of material
JP6298695B2 (ja) * 2014-04-16 2018-03-20 信越ポリマー株式会社 原盤製造方法及び原盤
JP2016035965A (ja) * 2014-08-01 2016-03-17 リンテック株式会社 板状部材の分割装置および板状部材の分割方法
EP4234156B1 (de) 2014-11-27 2025-10-29 Siltectra GmbH Laserbasiertes trennverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128204B2 (ja) * 2000-09-13 2008-07-30 浜松ホトニクス株式会社 レーザ加工方法
JP2005294656A (ja) * 2004-04-02 2005-10-20 Sharp Corp 基板製造方法及び基板製造装置
JP2010021398A (ja) * 2008-07-11 2010-01-28 Disco Abrasive Syst Ltd ウェーハの処理方法
JP2010155259A (ja) * 2008-12-26 2010-07-15 Seiko Epson Corp 溝形成方法
KR101769158B1 (ko) * 2009-04-07 2017-08-17 하마마츠 포토닉스 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
JP5398332B2 (ja) * 2009-04-16 2014-01-29 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置
JP5456382B2 (ja) * 2009-06-17 2014-03-26 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置

Similar Documents

Publication Publication Date Title
JP2012169363A5 (enExample)
JP2012169361A5 (enExample)
JP2012109357A5 (enExample)
JP2011216780A5 (enExample)
JP2013161820A5 (enExample)
JP2010283371A5 (enExample)
JP2014237545A5 (enExample)
JP2009260295A5 (ja) 半導体基板の作製方法
MY185237A (en) Semiconductor wafer with a layer of al:ga1-zn and process for producing it
JP2015518270A5 (enExample)
JP2011527769A5 (enExample)
EP2490047A3 (en) Optical member, method of manufacturing the same, and optical system using the same
JP2012054540A5 (ja) Ｓｏｉ基板の作製方法
JP2009302409A5 (enExample)
WO2013049142A3 (en) Apparatus and method for speckle reduction in laser processing equipment
RU2011142149A (ru) Способ и устройство для шлифования непрерывно-литого изделия
SG154390A1 (en) Wafer processing method for processing wafer having bumps formed thereon
CA3028263C (fr) Procede de fabrication d'une piece en superalliage a base de nickel contenant de l'hafnium
JP2012119669A5 (enExample)
RU2012127801A (ru) Способ изготовления защищенной от образования следов матовой керамики
JP2010040643A5 (enExample)
JP2009194374A5 (ja) Ｓｏｉ基板の作製方法
JP2016503961A5 (enExample)
JP2011524812A5 (enExample)
JP2009217193A5 (enExample)