JP2012159425A5 - - Google Patents

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Publication number
JP2012159425A5
JP2012159425A5 JP2011019951A JP2011019951A JP2012159425A5 JP 2012159425 A5 JP2012159425 A5 JP 2012159425A5 JP 2011019951 A JP2011019951 A JP 2011019951A JP 2011019951 A JP2011019951 A JP 2011019951A JP 2012159425 A5 JP2012159425 A5 JP 2012159425A5
Authority
JP
Japan
Prior art keywords
conductive
contact pins
holes
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011019951A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012159425A (ja
JP6157048B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011019951A priority Critical patent/JP6157048B2/ja
Priority claimed from JP2011019951A external-priority patent/JP6157048B2/ja
Priority to PCT/US2012/021504 priority patent/WO2012106103A1/en
Priority to TW101103129A priority patent/TWI545860B/zh
Publication of JP2012159425A publication Critical patent/JP2012159425A/ja
Publication of JP2012159425A5 publication Critical patent/JP2012159425A5/ja
Application granted granted Critical
Publication of JP6157048B2 publication Critical patent/JP6157048B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011019951A 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット Expired - Fee Related JP6157048B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011019951A JP6157048B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット
PCT/US2012/021504 WO2012106103A1 (en) 2011-02-01 2012-01-17 Socket for ic device
TW101103129A TWI545860B (zh) 2011-02-01 2012-01-31 用於積體電路裝置之插座

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011019951A JP6157048B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015180989A Division JP2016026295A (ja) 2015-09-14 2015-09-14 Ｉｃデバイス用ソケット

Publications (3)

Publication Number Publication Date
JP2012159425A JP2012159425A (ja) 2012-08-23
JP2012159425A5 true JP2012159425A5 (enrdf_load_stackoverflow) 2014-03-20
JP6157048B2 JP6157048B2 (ja) 2017-07-05

Family

ID=45554867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011019951A Expired - Fee Related JP6157048B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Country Status (3)

Country Link
JP (1) JP6157048B2 (enrdf_load_stackoverflow)
TW (1) TWI545860B (enrdf_load_stackoverflow)
WO (1) WO2012106103A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105137132B (zh) * 2015-09-28 2018-05-15 国网浙江省电力公司丽水供电公司 高压电容器外保护用熔断器监测支架及在线监视方法
US20180184517A1 (en) * 2016-12-22 2018-06-28 Google Llc Multi-layer ic socket with an integrated impedance matching network
US20200003802A1 (en) * 2018-07-02 2020-01-02 Powertech Technology Inc. Testing socket and testing apparatus
JP7452317B2 (ja) * 2020-08-05 2024-03-19 オムロン株式会社 ソケット、ソケットユニット、検査治具および検査治具ユニット

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297634A (ja) * 1993-04-19 1994-10-25 Toshiba Chem Corp 銅張積層板及び多層銅張積層板
JPH1141812A (ja) * 1997-07-23 1999-02-12 Hitachi Ltd 電力系統用自励式変換器の制御装置
JP3792445B2 (ja) * 1999-03-30 2006-07-05 日本特殊陶業株式会社 コンデンサ付属配線基板
US6558181B2 (en) * 2000-12-29 2003-05-06 Intel Corporation System and method for package socket with embedded power and ground planes
TWI277992B (en) * 2002-10-30 2007-04-01 Matsushita Electric Ind Co Ltd Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
CN1695408A (zh) * 2003-01-31 2005-11-09 富士通株式会社 多层印刷电路板、电子设备、安装方法
JP4259928B2 (ja) 2003-06-11 2009-04-30 株式会社リコー 移送物体検出装置，原稿読取装置および画像形成装置
JP2005310814A (ja) * 2004-04-16 2005-11-04 Alps Electric Co Ltd キャパシタ内蔵基板
JP2006165289A (ja) * 2004-12-08 2006-06-22 Alps Electric Co Ltd 中継基板
US7438581B1 (en) * 2005-05-16 2008-10-21 Myoungsoo Jeon Socket having printed circuit board body portion
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP4659087B2 (ja) * 2008-12-17 2011-03-30 パナソニック株式会社 差動平衡信号伝送基板

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