JP2012159425A5

JP2012159425A5 -

Info

Publication number: JP2012159425A5
Application number: JP2011019951A
Authority: JP
Filing date: 2011-02-01
Publication date: 2014-03-20
Anticipated expiration: 2031-02-01

Claims

A substrate having a first surface, a second surface opposite to the first surface, and a plurality of through-holes each connecting the first surface and the second surface and having an inner surface provided with a conductive material When,
A plurality of conductive contact pins, each part of which is inserted into one of the plurality of through holes, and an IC socket,
The substrate is
A base material having the first surface, the second surface, and the plurality of through holes;
A dielectric layer provided between the first surface and the second surface of the base material in a state intersecting with the plurality of through holes, the dielectric layer having a higher dielectric constant than the base material;
A first conductor layer and a second conductor layer sandwiching the dielectric layer along a direction from the first surface to the second surface of the substrate;
The plurality of conductive contact pins are:
A plurality of first conductive contact pins, each part of which is inserted into any of the plurality of through holes, and a part of which is in contact with a corresponding conductive material;
Each part is inserted into one of the plurality of through holes other than the through hole into which the plurality of first conductive contact pins are inserted , and the part is not in contact with the corresponding conductive material. Or a plurality of second conductive contact pins, wherein the corresponding conductive material is in non-contact with the first and second conductive layers,
The first conductive layer is electrically connected to at least one of the plurality of first conductive contact pins through a corresponding conductive material, while the second conductive layer is connected through a corresponding conductive material. The plurality of first conductive contact pins are electrically connected to any one of the contact pins other than the contact pins connected to the first conductive layer ,
An IC device socket, wherein an area defined by an outermost periphery of at least one of the first and second conductor layers is smaller than an area defined by an outermost periphery of the first surface.

2. The IC device socket according to claim 1, wherein the outermost periphery of at least one of the first and second conductor layers is located at least 25 μm inside the outermost periphery of the first surface.

The capacitance between the first conductive layer and the second conductive layer is controlled by changing an area of an overlapping portion of the first conductive layer and the second conductive layer when the second surface is viewed from the first surface. The IC device socket according to claim 1.

A guide body for supporting the substrate, the guide unit for placing the IC device to be inspected at a predetermined position on the substrate, and the IC device socket at a predetermined position of the inspection apparatus for inspecting the IC device. The IC device socket according to claim 1, further comprising a guide body having a positioning portion for placement.