JP2012159422A5

JP2012159422A5 -

Info

Publication number: JP2012159422A5
Application number: JP2011019937A
Authority: JP
Filing date: 2011-02-01
Publication date: 2014-03-20
Anticipated expiration: 2031-02-01

Claims

A substrate having a first surface, a second surface facing the first surface, and a plurality of through holes each connecting the first surface and the second surface;
A plurality of conductive contact pins, each part of which is inserted into one of the plurality of through holes, and an IC socket,
The substrate is
A base material having the first surface, the second surface, and the plurality of through holes;
Wherein provided between the front Symbol first surface and the second surface in a plurality of states crossed through hole, and at least one dielectric layer having a dielectric constant higher than the substrate,
The first and second conductive layers sandwiching the dielectric layer along a direction from the first surface to the second surface of the base material, and the plurality of conductive contact pins,
A plurality of first conductive contact pins, each of which is inserted into one of the plurality of through holes, and a portion of which is electrically connected to the first conductive layer or the second conductive layer;
Each part is inserted into one of the plurality of through holes other than the through hole into which the plurality of first conductive contact pins are inserted , and the part is inserted into the first and second conductives. A plurality of second conductive contact pins not electrically connected to the layer; and
The IC device socket, wherein at least one of the first and second conductive layers is divided into two or more portions in the horizontal direction via an insulating region inserted therebetween .

The insulating region has a shape that extends until one surface thereof reaches the first surface of the base material, while the other surface facing the one surface reaches the second surface of the base material. 2. The IC device socket according to claim 1, further comprising:

3. The IC device socket according to claim 2, wherein at least a part of the insulating region is an air gap.

Any of the plurality of through holes is provided with a conductor member on an inner surface thereof, and the first conductive layer is connected to at least one of the plurality of first conductive contact pins via a corresponding conductor member. While being electrically connected, the second conductive layer is a contact pin other than the contact pin to which the first conductive layer is connected among the plurality of first conductive contact pins via a corresponding conductor member . The socket for an IC device according to claim 1, wherein the socket is electrically connected to any one of the above.

A body that supports the substrate, and a guide portion for placing an IC device to be inspected at a predetermined position on the substrate, and an IC device socket at a predetermined position of an inspection apparatus for inspecting the IC device The IC device socket according to claim 1, further comprising a body having a positioning portion for causing the IC device to move.