JP2017038125A5 - - Google Patents

Claims (14)

A substrate,
A first circuit portion connected to the substrate;
A second circuit portion connected to the substrate,
The first circuit unit includes:
A semiconductor circuit provided on the main surface of the semiconductor substrate;
A thin film circuit element disposed on the main surface side of the semiconductor substrate and having a conductive thin film;
The oscillation module, wherein the semiconductor circuit is provided between the thin film circuit element and an outer peripheral portion of the semiconductor substrate in a plan view. The first circuit portion includes a first insulating film provided to overlap the main surface and the semiconductor circuit,
2. The oscillation module according to claim 1, wherein the thin film circuit element is provided on a surface opposite to a surface in contact with the main surface of the first insulating film and at least one of the semiconductor circuits. The first circuit unit includes:
In plan view, have a external connection terminal to which the a position not overlapping with the thin film circuit elements with overlapping with the semiconductor circuit, and is disposed on the first insulating film,
The oscillation module according to claim 2, wherein the oscillation module is connected to the substrate via the external connection terminal . The first circuit unit includes:
A second insulating film covering at least the thin film circuit element;
In plan view, have a external connection terminal to which the a position not overlapping with the thin film circuit elements with overlapping with the semiconductor circuit, and is disposed on the second insulating film,
The oscillation module according to claim 2, wherein the oscillation module is connected to the substrate via the external connection terminal .   5. The oscillation module according to claim 1, wherein the semiconductor circuit includes a capacitive element, and the thin film circuit element includes an inductance circuit. 6.   The oscillation module according to claim 5, wherein the inductance circuit is a wiring arranged in a spiral shape in a plan view.   The oscillation module according to claim 5 or 6, wherein the semiconductor circuit includes a resistance circuit electrically connected to the inductance circuit.   The oscillation module according to claim 7, wherein a resistance value of the resistance circuit can be variably controlled.   The said 2nd circuit part contains the resistive element, the capacitive element, and amplifier which are electrically connected to the said inductance circuit, The Claim 1 thru | or 8 characterized by the above-mentioned. Oscillation module.   10. The oscillation module according to claim 1, wherein the first circuit unit and the second circuit unit include at least a Corbitz oscillation circuit. 11. A substrate,
A first circuit portion connected to the substrate;
A second circuit portion connected to the substrate;
A vibration element connected to at least one of the first circuit part and the second circuit part,
The first circuit unit includes:
A semiconductor circuit provided on the main surface of the semiconductor substrate;
A thin film circuit element disposed on the main surface side of the semiconductor substrate and having a conductive thin film;
The vibration device, wherein the semiconductor circuit is provided between the thin film circuit element and an outer peripheral portion of the first circuit portion in plan view.   The vibrating device according to claim 11, wherein the first circuit unit and the second circuit unit include at least a Corbitz oscillation circuit.   An electronic apparatus comprising the oscillation module according to claim 1.   A moving body comprising the oscillation module according to claim 1.