JP2011222809A5

JP2011222809A5 - Substrate relative position detection method, stacked device manufacturing method and detection device

Info

Publication number: JP2011222809A5
Application number: JP2010091372A
Authority: JP
Filing date: 2010-04-12
Publication date: 2013-07-18
Anticipated expiration: 2030-04-12

Claims

A substrate relative position detection method for detecting the relative position of a first substrate and a second substrate superimposed on each other, comprising:
Proximity for bringing a plurality of first conductive regions formed in a first period on the first substrate into proximity with a plurality of second conductive regions formed in a second period different from the first period on the second substrate Step and
Measuring an electrical property between the first conductive region and the second conductive region in each of a plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions;
Detecting the relative position of the first substrate and the second substrate based on the difference in the electrical characteristics among the plurality of combinations;
A substrate relative position detection method including:

The proximity step brings one of the plurality of first conductive regions into contact with any of the plurality of second conductive regions.
In the measurement step, in each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, electrical conduction between the first conductive region and the second conductive region is performed. The substrate relative position detection method according to claim 1, comprising detecting the presence or absence of the substrate.

In the measuring step, a DC voltage is input to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, and the output current is measured. The substrate relative position detection method according to claim 2, wherein the presence or absence of the electrical conduction is detected.

The proximity step holds the first substrate and the second substrate in a separated state,
In the measurement step, a capacitance between the first conductive region and the second conductive region is provided in each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The substrate relative position detection method according to claim 1, which detects

In the measuring step, an AC voltage is input to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, and the output current is measured. The substrate relative position detection method according to claim 4, wherein the capacitance is detected.

The proximity step may include any one of the plurality of first conductive regions and the plurality of second conductive regions through a dielectric layer provided on at least one of the plurality of first conductive regions and the plurality of second conductive regions. Contact with one of the areas,
In the measurement step, a capacitance between the first conductive region and the second conductive region is provided in each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The substrate relative position detection method according to claim 1, which detects

In the measuring step, an AC voltage is input to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, and the output current is measured. The substrate relative position detection method according to claim 6, wherein the capacitance is detected.

Before bringing the first substrate and the second substrate close to each other, the step of aligning the first substrate and the second substrate is further performed based on the outer shape of the first substrate and the outer shape of the second substrate. The substrate relative position detection method according to any one of claims 1 to 7, further comprising:

The substrate relative according to claim 8, wherein in the alignment step, the positional deviation between the first substrate and the second substrate is within a range equal to or less than one of the first period and the second period, whichever is larger. Position detection method.

Prior to the measurement step, the second substrate is formed at a position corresponding to a first large conductive region formed on the first substrate and larger than any of the plurality of first conductive regions and the first large conductive region. Measuring an electrical property between a second large conductive region formed and larger than any of the plurality of second conductive regions;
Detecting misalignment between the first substrate and the second substrate based on electrical characteristics between the first large conductive region and the second large conductive region;
A determination step of determining whether or not the positional deviation detected in the step of detecting the positional deviation is equal to or greater than one of the first period and the second period, whichever is larger;
The substrate relative position detection method according to any one of claims 1 to 9, further comprising

11. The substrate according to claim 10, further comprising a warning step of giving a warning when it is determined in the determination step that the positional deviation is equal to or greater than one of the first period and the second period, whichever is larger. Relative position detection method.

The measuring step includes: a plurality of third conductive regions formed on the first substrate so as to be arranged at a third period along a direction orthogonal to the direction in which the plurality of first conductive regions are arranged; In a plurality of combinations with a plurality of fourth conductive regions formed on the second substrate so as to be arranged in a fourth period different from the third period along a direction orthogonal to the direction in which the second conductive regions are arranged Further measure the electrical characteristics,
In the detecting step, a difference between the electrical characteristics between the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, and a plurality of third conductive regions of the plurality The relative position of a said 1st board | substrate and a said 2nd board | substrate is detected based on the difference of the said electrical property between the said some combination of any and any of the said 4th 4th electrically conductive area. Board relative position detection method.

A stacked device manufacturing method comprising: detecting relative positions of a plurality of substrates by the substrate relative position detection method according to any one of claims 1 to 12, and bonding the substrates based on the relative positions.

A detection device for detecting misalignment of the plurality of substrates aligned by the alignment device that aligns the plurality of substrates bonded to each other;
A first substrate on which a plurality of first conductive regions are formed at a first period;
A second substrate in which a plurality of second conductive regions are formed at a second period different from the first period;
A plurality of combinations of any one of the plurality of first conductive regions and any of the plurality of second conductive regions in a state in which the plurality of first conductive regions and the plurality of second conductive regions are close to each other A measurement unit that measures an electrical characteristic between the first conductive region and the second conductive region;
A detection unit that detects a relative position between the first substrate and the second substrate based on the difference in the electrical characteristics among the plurality of combinations;
A detection device comprising:

In each of the plurality of combinations of the plurality of first conductive regions and the plurality of second conductive regions, the measurement unit includes any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 14, which detects the presence or absence of electrical conduction between the two.

The measurement unit measures a current output by inputting a DC voltage to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 15, which detects the presence or absence of the electrical conduction.

The measurement unit is a capacitance between the first conductive region and the second conductive region in each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 14, which detects

The measurement unit is configured to measure an electric current by inputting an AC voltage to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 17, which detects the capacitance.

A dielectric layer is provided on at least one of the plurality of first conductive regions and the plurality of second conductive regions, and the plurality of first conductive regions and the plurality of second conductive regions are the dielectric layer. Is contacted via
The measurement unit is a capacitance between the first conductive region and the second conductive region in each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 14, which detects

The measurement unit is configured to measure an electric current by inputting an AC voltage to each of the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions. The detection device according to claim 19, which detects the capacitance.

A first large conductive area larger than any of the plurality of first conductive areas is formed on the first substrate,
In the second substrate, a second large conductive area larger than any of the plurality of second conductive areas is formed at a position corresponding to the first large conductive area.
The measurement unit measures an electrical characteristic between the first large conductive region and the second large conductive region;
21. The detection unit according to any one of claims 14 to 20, which detects a positional deviation between the first substrate and the second substrate based on electrical characteristics between the first large conductive region and the second large conductive region. The detection apparatus as described in a term.

22. The detection according to claim 21, further comprising: a determination unit that determines whether or not the positional deviation detected in the step of detecting the positional deviation is equal to or greater than one of the first period and the second period, whichever is larger. apparatus.

23. The detection device according to claim 22, further comprising: a warning unit that warns when the determination unit determines that the positional deviation is equal to or greater than any one of the first period and the second period, whichever is larger. .

In the first substrate, a plurality of third conductive regions are formed at a third period along a direction orthogonal to the direction in which the plurality of first conductive regions are arranged,
A plurality of fourth conductive regions arranged in a fourth period different from the third period are formed on the second substrate along a direction orthogonal to the direction in which the plurality of second conductive regions are arranged,
The measurement unit further measures electrical characteristics of a plurality of combinations of the plurality of third conductive regions and the plurality of fourth conductive regions;
The detection unit is configured to detect a difference in the electrical characteristic between the plurality of combinations of any of the plurality of first conductive regions and any of the plurality of second conductive regions, and any of the plurality of third conductive regions. The relative position of a said 1st board | substrate and a said 2nd board | substrate is detected based on the difference of the said electrical property between the said some combinations with any one of the some 4th electroconductive area | regions. Detection device.

A plurality of circuit patterns different from the plurality of first conductive regions are formed on the first substrate,
The circuit board according to any one of claims 14 to 24, wherein a plurality of circuit patterns corresponding to the plurality of circuit patterns of the first substrate, which are different from the plurality of second conductive regions, are formed on the second substrate. The detection device according to.