JP7024040B2 - How to bond the board - Google Patents

Description

The present invention relates to the method of bonding the first substrate to the second substrate according to claim 1.

For many years in the semiconductor industry, substrates are aligned with each other and coupled to each other. Bonding, so-called bonding, is used to form a multi-layer board stack. In such a multi-layer board stack, functional units, especially memories, microprocessors, MEMS, etc., can be coupled to each other and thus combined with each other. This combination possibility makes it possible to realize a wide variety of applications.

The density of functional units is increasing year by year. With the development of technological development, the size of functional units is becoming smaller and smaller. Therefore, as the density increases, the number of functional units per substrate increases. This increase in quantity is primarily responsible for lowering component costs.

The disadvantage of increasingly miniaturized functional units is that it becomes increasingly difficult to achieve error-free, especially perfect superposition, especially along the junction interface of both boards, for all functional units.

That is, the biggest problem in today's alignment technology is not always present only when aligning two substrates, especially two wafers, with respect to each other based on the alignment mark, but at each point of the first substrate and the first. It is also present when the correlation with each point of the two substrates is formed without error, especially completely, and thus over the entire surface of the substrate. Experience has shown that the structures on the surface of each substrate after the bonding process are generally not congruent with each other. Therefore, the general, especially overall alignment of the two substrates and the subsequent bonding steps ensure complete congruence without error at any point on the surface of the substrate. Not always enough for this.

In the known prior art, there are two fundamental problems that hinder a simple overall alignment and the subsequent bonding process.

One is that the position of the structure of the first and / or second substrate generally deviates from the theoretical position. There can be multiple reasons for this deviation.

For example, it is possible that the actual structure manufactured has deviated from its ideal position due to an error in the manufacturing process, or at least a margin of error. An example of this would be the iterative use of lithography with a Step-And-Repeat process. In such a step-and-repeat process, each translational movement of the stamp results in a small but significant error in position.

Yet another, non-trivial reason would be the deformation of the substrate due to mechanical loads, especially thermal loads. The substrate has a predetermined temperature, for example, at the time of manufacturing the structure. This temperature is generally not maintained throughout the substrate process flow, but varies. Thermal expansion occurs as the temperature changes, resulting in a change in diameter in the most ideal cases and complex thermal deformation in the most unfavorable cases.

Two, just before contacting and just before the original bonding process, bond all structures without error, especially even if the two substrates are completely congruent, i.e. overlapping. It is possible to lose that congruence during the process. Therefore, the bonding process itself has a decisive effect on forming a substrate stack in which the structures are error-free and therefore completely congruent.

Third, the layers and structures placed on the substrate can create stresses within the substrate. The layer can be, for example, an insulating layer and the structure can be, for example, a through silicon via (TSV).

One of the most significant technical issues in permanent bonding of two boards is the alignment accuracy of the functional units between the individual boards. The boards can be aligned very accurately with each other by the alignment equipment, but distortion of the boards can occur during the bonding process itself. Due to the distortion thus generated, the functional units are not always properly aligned with each other in all positions. Alignment inaccuracies at specific points on the substrate can result in distortion, scaling errors, lens defects (magnification or reduction errors), and the like. In the semiconductor industry, all thematic areas related to such problems are included in the concept of "overlay". A corresponding overview of this subject can be found, for example, in Mack, Chris's Fundamental Principles of Optical Lithography-The Science of Microfabrication (Publisher WILEY, 2007, Reprint 2012).

Each functional unit is computer designed prior to the actual manufacturing process. For example, conductor paths, microchips, MEMS, or any other structure that can be manufactured using microcontroller system technology is also designed in a CAD (computer aided design) program. However, during the manufacture of functional units, it has been found that there is always a discrepancy between an ideal functional unit built in a computer and an actual functional unit built in a clean room. Differences can be primarily due to hardware limitations, that is, technical engineering issues, but often due to physical limitations as well. That is, the resolution accuracy of the structure manufactured by the photolithography process is limited by the size of the aperture of the photomask and the wavelength of the light beam used. Mask strain is transferred directly to the photoresist. Mechanical linear motors can only reach reproducible positions within specified tolerances. Therefore, it is no wonder that the functional units of the board cannot be exactly equal to the structures constructed in the computer. Therefore, all substrates already have a negligible one from the ideal state before the bonding process. Comparing the positions and / or shapes of the two functional units of the two boards facing each other, assuming that neither of the two boards is distorted by the coupling process, generally already in both functional units. It turns out that there is an incomplete match. This is because these functional units deviate from the ideal computer model due to the errors described above. The most frequent errors are in Figure 8 (http://commons.wikimedia.org/wiki/File:Overlaytypical model terms DE.svg. 24.05.2013 and Mack, Chris's Fundamental Principles of Optical Lithography-the Science of Illustrated in Microfabrication. Chichester (publisher WILEY, p. 312, 2007, reprint 2012). As shown in the drawings, overlay error can be roughly divided into overall overlay error and local overlay error, or symmetric overlay error and asymmetric overlay error. The overall overlay error is uniform and therefore location independent. The overall overlay error produces the same deviation between two functional units located facing each other, regardless of position. Typical overall overlay errors are the errors I. and II. Due to the translation or rotation of both substrates relative to each other. Translation or rotation of both boards causes a corresponding translational or rotational error on the boards for all functional units located facing each other. Local overlay errors are location-related and are primarily caused by elastic and / or plastic problems and / or preprocesses, especially the elasticity created by continuously propagating bonding waves. Caused by problems and / or plasticity problems and / or preprocessing. Of the overlay errors shown, errors III. And IV. Are referred to as "run-out" errors. This "runout" error is caused by distortion of at least one substrate, especially during the bonding process. Due to the distortion of at least one substrate, the functional unit of the first substrate is also distorted with respect to the functional unit of the second substrate. However, the errors I. and II. Can also be caused by the bonding process, but are usually significantly superimposed by the errors III and IV. Therefore, the errors I. and II. Are extremely difficult to detect or are measured. It will be difficult. This applies to state-of-the-art bonders, especially fusion bonders, that are capable of very precise corrections in the x and / or y and / or rotation directions.

In the known prior art, there are already facilities capable of reducing local strain at least partially. This is a local distortion correction by the use of active control elements (International Publication No. 2012/083978 (WO2012 / 083978A1)).

In the known prior art, there is a first solution for correcting the "runout" error. U.S. Patent Application Publication No. 20120077329 (US20120077329A1) states that the underlying substrate may not be positioned to obtain the desired alignment accuracy between the functional units of the two substrates during and after bonding. The method is described. As a result, the lower substrate is not placed under boundary conditions and can be freely bonded to the upper substrate during the bonding process. An important feature of the known prior art is, among other things, the flat positioning of one substrate, often with a vacuum device.

The "runout" error that occurs is usually amplified radiatively around the contact point and therefore increases from the contact point towards the circumferential surface. This is often a linearly increasing amplification of the "runout" error. Under special conditions, the "runout" error can also increase non-linearly.

Under particularly optimal conditions, the "runout" error can be detected not only by the corresponding instrument (European Patent No. 24638892 (EP2463892)), but also by a mathematical function. Since the "runout" error is translation and / or rotation and / or scaling between clearly defined points, the "runout" error is advantageously described by a vector function. In general, such a vector function is the function f: R ² → R ² , and is therefore a mapping rule that maps the two-dimensional definition range of position coordinates to the two-dimensional value range of the "runout" vector. An accurate mathematical analysis of the corresponding vector field has not yet been performed, but inferences about the functional characteristics are performed. The vector function has a large probability and is at least a Cn ⁿ ≧ 1 function, and is therefore continuously differentiable at least once. The divergence of the vector function is probably different from zero because the "runout" error increases from the contacting point towards the edge. Therefore, the vector field is a spring field with a high probability.

The "runout" error is best sought in relation to the structure. A "structure" is understood to be any element of the first or second substrate that should be correlated with the structure on the second or first substrate.
So the structure is, for example,
● Alignment marks ● Corners or edges, especially the corners and edges of functional units ● Contact pads, especially through silicon vias (TSV) or through polymer vias (TPV)
● Conductor path,
● Recesses, especially holes or depressions.

The "runout" error is generally position-related and, in a mathematical sense, is a displacement vector between a real point and an ideal point. The "runout" error is generally position related and is ideally represented by a vector field. In the following description, the "runout" error will be considered solely as a dot for ease of explanation, unless otherwise noted.

The "runout" error R is a combination of the two components.

The first component R1 describes an essential part of the "runout" error, i.e. a part due to a manufacturing error of the structure or distortion of the substrate. That is, the first component R1 is inherent in the substrate. In this case, the structure was properly manufactured at the first temperature, but the substrate also has an intrinsic "runout" error if it undergoes a temperature change to a second temperature by the bonding process. It should be noted that this may cause thermal expansion, which will distort the entire substrate and thus the structures present on the substrate. A temperature difference of only a few Kelvin, or even a tenth of Kelvin, is sufficient for such distortion to occur.

The second component R2 describes the extrinsic part of the "runout" error, i.e., the part caused only by the bonding process. This extrinsic part does not exist before the bonding process. This extrinsic portion specifically includes local and / or overall strain of the first and / or second substrate due to the forces acting between the substrates, and such forces cause the nanometer region. Deformation can be caused.

An object of the present invention is to provide a method for bonding two substrates so that the bonding accuracy can be improved at any position of the substrate as much as possible. A further object of the present invention is to present a method that makes it possible to form error-free, especially perfect congruence between the structures of two substrates.

This problem is solved by the feature according to claim 1. An advantageous development of the invention is described in the dependent claims. All combinations of at least two features described in the specification, claims, and / or drawings are also within the framework of the present invention. Within the stated value range, it is desirable that the values themselves within the listed range are also considered to be disclosed as limit values and can be claimed in any combination. Where a single or multiple method steps are feasible in different devices or modules, these method steps are disclosed separately as independent methods.

The idea underlying the present invention is to reduce the heating temperature _TH already during bonding, or to switch off the heater during bonding. The heating temperature _TH is used to generate a sufficient temperature for bonding, especially on the bonding surface of the substrate. Yet another important feature of the present invention is to release the position fixation of the substrate, especially during bonding, so that the substrate stack during bonding can be freely deformed. A further important feature of the third embodiment of the present invention is the ability to ventilate or pressurize the substrate stack, especially the interface of the substrate stack, during bonding.

Wafers are of particular consideration as the first and / or second substrate.

A characteristic process in the present invention during bonding, especially permanent bonding, preferably fusion bonding, is as concentric punctate contacting of both substrates as possible. In particular, the contacting of both substrates may be performed non-concentrically. Bonding waves propagating from non-concentric contact points reach different locations on the edge of the substrate at different times. Correspondingly, the complete mathematical and physical description of the bonding wave characteristics and the resulting "runout" error compensation is complicated. In particular, the contacting point is not located so far from the center of the substrate, so the effect that may be produced from this is negligible, at least at the edges. The distance between possible non-concentric contacting points and the center of the substrate is preferably less than 100 mm, preferably less than 10 mm, even more preferably less than 1 mm, and very preferably less than 0.1 mm. It is small, most preferably smaller than 0.01 mm. In the following, "connecting" generally means concentric contacting. "Center", in a broad sense, preferably means the geometric center point of the underlying ideal object, compensated for asymmetry as needed. That is, in an industrially general-purpose wafer with a notch, the center is the center point of a circle surrounding an ideal wafer without a notch. For industrially general purpose wafers with flats (flat chamfered surfaces), the center is the circular center point of the circle surrounding the ideal wafer without flats. Similar ideas apply to arbitrarily molded substrates. However, in special configurations, it can be beneficial for the "center" to mean the center of gravity of the substrate. To ensure accurate concentric point contacting, a central hole and an upper mounting device (board holder) with translationally movable pins within this hole are radially symmetrical. Equipped with a fixed position. It is also conceivable to use nozzles that use fluid, preferably gas, for pressurization instead of pins. Moreover, on the contrary, at least one of the two substrates, preferably the upper substrate, has a curvature imparted in the direction of the other substrate based on gravity, and thus in said translational approach, the corresponding first. The use of such elements is complete when a device is provided that allows the two boards to be translated into close proximity to each other under yet another precondition of automatically contacting the two boards at sufficiently small intervals. Can be made unnecessary.

A radiatingly symmetric position / hold is a comparable vacuum element capable of locating a provided vacuum hole, a circular vacuum lip or an upper substrate. The use of electrostatic mounting devices is also conceivable. A pin in the central hole provided in the upper substrate holder is used for controllable deflection of the positioned upper substrate.

In yet another embodiment according to the invention, the mounting device is such that the first and / or second substrate is curved in a concave and / or convex shape due to the generation of overpressure and / or negative pressure in the sample holder. Can be configured. For this purpose, the mounting device is preferably provided with a vacuum passage and / or a hollow space capable of fluid flow or exhaust. The use of nozzles for pinpoint pressurization can be omitted, among other things, in favor of the overall pressure built. According to the present invention, an embodiment of sealing the substrate and / or another embodiment of fixing the position of the edge of the substrate in particular can be considered. For example, if the mounting device is configured to create a negative pressure with respect to the external atmosphere, sealing at the edge of the substrate is sufficient. If an overpressure is formed inside the mounting device to bend the substrate outwards, i.e. convexly, the substrate is preferably positioned, especially mechanically, on the edge side. By applying negative pressure or overpressure to the substrate from the back side, it is possible to accurately set the curvature of the substrate.

After the contacting between the centers of both boards is performed, the position fixing of the upper board holder is gradually released in a particularly controlled state. The upper substrate falls downward on the one hand due to gravity and on the other hand due to the bonding force acting between the two substrates along the bonding wave. The upper substrate is coupled to the lower substrate in the radial direction from the center toward the side edges. In this way, a radiation-symmetrical bonding wave extending particularly from the center toward the side edge portion is formed in the present invention. During the bonding process, both substrates push gas, especially air, present between the substrates from the front of the bonding wave, thereby creating a bonding interface without gas inclusions. The upper substrate falls onto a kind of gas cushion when dropped.

The first / upper substrate is not subject to additional position fixation after the start of bonding at the bonding start site, i.e., apart from the position fixation at the bonding start site, can freely move and be distorted. Any circular segment that is infinitesimally small with respect to its radial thickness due to the bonding wave (wave) traveling in the present invention, the stress state generated at the bonding wave front, and the existing geometrical boundary conditions. Is also distorted. However, since the substrate is a rigid object, the strain is summed as a function of the distance from the center. This leads to a "runout" error to be eliminated by the method according to the invention and the apparatus according to the invention.

Accordingly, the present invention is a method for reducing or even avoiding "runout" errors between both bonded substrates during bonding, especially by thermodynamic and / or mechanical compensation mechanisms. And also the equipment. In addition, the invention deals with corresponding products manufactured using the apparatus according to the invention and the method according to the invention.

The "runout" error is particularly related to position on the substrate along the surface of the substrate. In particular, the "runout" error has been found to increase from the center of the substrate towards the periphery. Such radial symmetric runouts occur, especially when the substrates are fused together, the substrates are centered by pins, and the bonding waves of these substrates are autonomous after contacting. In particular, it propagates radially.

The "runout" error is particularly related to the bonding wave speed. In general, the faster the bonding wave speed, the greater the "runout" error. Therefore, according to the present invention, it is preferably slower than 100 mm / sec, preferably slower than 50 mm / sec, more preferably slower than 10 mm / sec, extremely preferably slower than 1 mm / sec, most preferably 0. A bonding wave speed is set that is slower than 1 mm / sec. In one particular embodiment according to the invention, the bonding wave velocity is detected by the measuring means.

The "runout" error is particularly related to the gap between the two substrates just before the start of the (pre) bonding process. The spacing between the substrates is a function of position, especially as long as the upper first substrate is deformed by the deforming means with the _first force F1. In particular, the distance between the substrates is the largest at the edges. The smallest spacing is located in the region of the convex maximum value of the deformed substrate. Therefore, the shape of the deformed substrate also affects the "runout" error. The spacing between the substrates at the edges (board edge spacing D) is particularly less than 5 mm, preferably less than 2 mm, more preferably less than 1 mm, and extremely preferably less than 0.5 mm immediately before bonding. Is also small, most preferably set smaller than 0.1 mm. The spacing between the substrates below the convex maximum is particularly less than 1 mm, preferably less than 100 μm, more preferably less than 10 μm, very preferably less than 1 μm, just before bonding. Most preferably, it is set to be smaller than 100 nm. The "runout" error is particularly related to the type of sample holder and the type of position fixing / holding part of each substrate thus obtained. WO 2014/191033 (WO2014 / 191033A1) discloses multiple embodiments of preferred sample holders, with reference to this document. In the process of the present disclosure, it is extremely important to dissociate the substrate from the sample holder after the release of position fixation, especially after release of vacuum fixation. The surface roughness of the sample holder is selected as large as possible so that its waviness is as small as possible. The large surface roughness minimizes the contact points between the sample holder surface and the substrate. Therefore, separation of the substrate from the sample holder is performed with minimal energy cost. Waviness is preferably minimized to prevent the sample holder surface from forming a new source for "runout". In this regard, it should be noted that the description of waviness does not mean that the surface of the sample holder should not be curved as a whole.

Roughness is expressed as either average roughness, square roughness, or average roughness depth. The calculated value of the average roughness, the calculated value of the square roughness, and the calculated value of the average roughness depth are generally different even if the measurement path or the measurement surface is the same, but they are within the same digit number range. Therefore, the following numerical range for roughness should be understood as one of the values of average roughness, square roughness, or average roughness depth. The roughness is set to be particularly greater than 10 nm, preferably greater than 100 nm, still more preferably greater than 1 μm, extremely preferably greater than 10 μm, and most preferably greater than 100 μm. The "runout" error is particularly related to the temporal aspect. Since the bonding wave propagates so quickly, there is not enough time for the substrate materials to optimally bond to each other immediately after and / or during and / or immediately before the bonding wave. Therefore, controlling the bonding wave in relation to time can also be extremely important.

The "runout" error is particularly related to the process of loading the substrate onto the sample holder. The board may be distorted during board loading and position fixation, and this distortion is maintained by the position fixation and is incorporated into the board stack during (pre) bonding. Therefore, the substrate is carried onto the sample holder by the end effector with as little distortion as possible.

The "runout" error is particularly related to temperature differences and / or temperature fluctuations between the two substrates. Each substrate is fed to the bonding module from different process steps or different process modules. In these process modules, different processes may have been performed at different temperatures. Furthermore, the upper sample holder and the lower sample holder may have different structures, different configurations, and thus different physical properties, especially different thermal properties. For example, the thermal mass and / or thermal conductivity of each sample holder may be different from each other. As a result, the loading temperature will be different, or the temperature at the time of (pre) bonding will be different. Therefore, the sample holder for carrying out the process according to the invention is equipped with a heating and / or cooling system to allow accurate setting of the temperature of at least one (preferably both) substrates. In particular, it is conceivable to adjust the temperatures of both substrates to different values and apply heat to at least one of the two substrates to distort the substrate as a whole by heat. Thus, the substrate can be adapted to the desired initial state, especially to compensate for the component R1 of the "runout" error.

The "runout" error is particularly related to ambient pressure. The action of ambient pressure is described and disclosed in detail in WO2014 / 191033 (WO2014 / 191033A1). This document is referred to in this regard.

The "runout" error is particularly related to the symmetry of the system, so preferably as many (more preferably at least the majority) components as possible are symmetrically configured and / or arranged. In particular, the thickness of each substrate is different. Furthermore, layers of different materials with different mechanical properties can be provided on each substrate in different order, and this should be taken into consideration. Furthermore, one of the substrates is preferably deformed, while the other substrate is placed flat on the sample holder. All properties, parameters, and embodiments that result in asymmetry affect, among other things, "runout" errors. Some of these asymmetries are unavoidable. For example, the thickness of the board, the layers on the board, and the functional units are determined by the process and customer specifications. According to the present invention, it is attempted to significantly minimize, especially completely eliminate, "runout", especially by varying other modifiable parameters.

The "runout" error is particularly position related. The goal of the means according to the invention is, especially at any position, less than 10 μm, preferably less than 1 μm, even more preferably less than 100 nm, very preferably less than 10 nm, most preferably less than 1 nm. To maintain the "runout" error.

Sample Holder A sample holder that is preferably used for embodiments according to the present invention uses a fixed position. The position-fixing section is used to hold the substrate using a position-fixing force or a corresponding position-fixing pressure. The position fixing part is especially:
● Mechanical position fixing part, especially clamp or
● Vacuum fixing part, especially ○ Individually controllable vacuum passage or
○ A vacuum fixing part with a vacuum passage connected to each other, or
● Electric position fixing part, especially electrostatic position fixing part, or
● Magnetic position fixing part or
● Adhesive position fixing part, especially ○ Gel pack position fixing part, or
○ In particular, it can be a position fixing part having a controllable adhesive surface.

The fixed position is particularly electronically controllable. The vacuum fixing part is a preferred type of position fixing part. The vacuum fixation section preferably consists of a plurality of vacuum passages, which appear on the surface of the sample holder. The vacuum passages are preferably individually controllable. In a technically preferred application, several vacuum passages are integrated into each vacuum passage segment, where each vacuum passage segment is individually controllable, i.e. individually evacuable or inflatable. Each vacuum segment is preferably independent of the other vacuum segments. This provides a means of constructing individually controllable vacuum segments. The vacuum segment is preferably configured in a ring shape. This allows the substrate to be positioned radially symmetrically, especially from the inside to the outside, and / or dissociated from the sample holder, and vice versa.

Possible sample holders are International Publication No. 2014/191033 (WO2014 / 191033A1), International Publication No. 2013/023708 (WO2013 / 023708A1), International Publication No. 2012/079597 (WO2012 / 079597A1), and International Publication No. 2012. / 083978 (WO2012 / 083978A1). These documents are referred to in this regard.

Bonding Wave Monitoring According to the present invention, during at least one, preferably all process steps, the progress of the bonding wave or at least one state of the bonding wave is detected, whereby the progress of the bonding wave or the progress of the bonding wave at a predetermined time point is detected. It is advantageous to find at least one state of the bonding wave. For this purpose, it is particularly preferable to provide a measuring means having a camera. Monitoring is preferably:
● Performed using cameras, especially visual or infrared cameras, and / or ● conductivity measuring instruments.

When the bonding wave is specified using a camera, it is possible to detect the position of the bonding wave, particularly the progress of the bonding wave, at any time point. The camera is preferably an infrared camera that digitizes the data and sends it to the computer. Based on this, the computer allows the evaluation of digital data, in particular the location of the bonding wave, the size of the bonded surface, or the identification of yet another parameter.

Yet another means of monitoring the progress of a bonding wave is to measure the surface conductivity, which changes as the bonding wave progresses. To do this, the requirements for such measurements must be given. The measurement of surface conductivity is carried out, among other things, by the contacting of two electrodes at two positions facing each other on the substrate. In one particular embodiment according to the invention, the electrodes contact the edges of the substrate, but do not interfere with the bonding of the substrate at the edges. In a less preferred second embodiment of the invention, the electrodes are pulled back from the substrate before the bonding wave reaches the side edges of the substrate.

The process will be described below. These processes proceed, preferably in the order described, in particular as separate steps. Unless otherwise stated, process steps and disclosures can be diverted from one embodiment to another, respectively, where technically feasible for one of ordinary skill in the art. ..

Process According to First Embodiment of the Invention In the first process step of the first embodiment of the method according to the invention, one of the two substrates is placed on the first / upper sample holder. , And the second substrate is positioned and fixed on the second / lower sample holder. In this case, the substrate may be supplied manually, but preferably by a robot, that is, automatically. The upper sample holder preferably uses a deforming means for deforming the upper first substrate as intended, especially in a controllable manner, by the _first force F1. The upper sample holder has at least one opening in particular, and the transforming means, in particular the pin, is capable of mechanically deforming the upper first substrate through this opening. Such sample holders are preferably disclosed in International Publication No. 2013/023708 (WO2013 / 023708A1).

In the second process step, the deforming means, especially the pins, contact the back side of the upper first substrate to form some deformation, especially from the side of the deforming means (ie, from above), a deflection called a concave surface. The transforming means applies a first force F ₁ to the first substrate, particularly greater than 1 mN, preferably greater than 10 mN, even more preferably greater than 50 mN, very preferably greater than 100 mN, and particularly greater than 5000 mN. Add. This force is too weak to dissociate the upper first substrate from the sample holder, but is strong enough to form the deflection according to the present invention. The force preferably acts on the substrate in dots as much as possible. The force preferably acts on a very small area, as the punctate action does not actually exist. This area is particularly smaller than 1 cm ² , preferably smaller than 0.1 cm ² , more preferably smaller than 0.01 cm ² , and most preferably smaller than 0.001 cm ² . When acting on an area of 0.001 cm ² , the acting force is particularly greater than 1 MPa, preferably greater than 10 MPa, still more preferably greater than 50 MPa, and extremely preferably greater than 100 MPa, according to the present invention. Large, most preferably greater than 1000 MPa. These disclosed pressure ranges also apply to yet another aspect disclosed above.

In the third process step, the relative proximity of the two substrates is achieved, especially by bringing the sample holders closer together. Preferably the lower sample holder is lifted so that the lower second substrate is actively approached towards the upper first substrate. However, it is also conceivable to actively bring the upper sample holder closer to the lower sample holder, or to bring the two sample holders closer to each other at the same time. The proximity of the two substrates is particularly carried out until an interval of 1 μm to 2000 μm, preferably 10 μm to 1000 μm, more preferably 20 μm to 500 μm, and extremely preferably 40 μm to 200 μm. This spacing is defined as the smallest vertical distance between each surface point on the two substrates.

The first and / or second substrate is heated by heating means and / or cooled by cooling means prior to bonding or prebonding, or contacting, i.e. temperature controlled.

In the fourth process step, yet another force is applied to the upper first substrate. In the first embodiment according to the invention, of the transforming means, particularly greater than 100 mN, preferably greater than 500 mN, even more preferably greater than 1500 mN, very preferably greater than 2000 mN, most preferably greater than 3000 mN. A second force F ₂ is applied to the first substrate. By doing so, a first contacting between the upper first substrate and the lower second substrate is triggered or at least assisted. The calculation of the pressure that is preferred to be generated is re-performed by dividing the force by the assumed smallest area of 0.001 cm ² . In the fifth process step, the heating means, especially the heater of the lower sample holder, which is built and arranged in the lower sample holder, is switched off.

In the sixth process step, the propagation of the bonding wave in progress is monitored, among other things (see also "Monitoring the Bonding Wave" above). This monitoring tracks the progress of the bonding wave and thus the progress of the bonding process, especially longer than 1 second, preferably longer than 2 seconds, even more preferably longer than 3 seconds, and very preferably longer than 4 seconds. Most preferably follow for a period longer than 5 seconds. Instead of tracking / controlling the bonding process over a predetermined time interval, it is also possible to determine the tracking of the bonding wave with respect to the position of the bonding wave, especially the radial position. The tracking of the bonding process is such that the bonding wave is at least 0.1 times, preferably at least 0.2 times, more preferably at least 0.3 times, very preferably at least 0.4 times, most preferably the diameter of the substrate. It is carried out while being in a radial position corresponding to 0.5 times. If it is desirable to track the progress of the bond by measuring the surface conductivity, it is also possible to perform the bond progress as a percentage of the bonded or unbonded surfaces. .. In that case, the monitoring of the progress of bonding according to the present invention is particularly more than 1%, preferably more than 4%, more preferably more than 9%, extremely preferably more than 16%, most preferably 25% of the area. It is carried out until more are bonded. In an alternative form, monitoring is performed continuously.

Control of the process sequence is preferably carried out from monitoring within the range of the above values, based on specified / set or configurable values. From this, the first waiting time until the start of the next process step for the progress of the bonding wave is known.

In the seventh process step, in particular, the position fixing portion of the upper first sample holder is switched off. It is also conceivable to dissociate the upper first substrate by releasing the position fixing as intended. Especially in the case of a vacuum fixing part consisting of a plurality of individually controllable vacuum passages, the vacuum is released continuously from the center to the edge, so that the position fixing is released as intended. To. The seventh process step, among other things, begins at t1 when _one of the parameters of the measuring instrument reaches a defined / set or configurable value (see, among other things, the sixth process step).

Generally speaking or in other words, at time point t1 during bonding, the holding force F _H1 is reduced, especially until the _first substrate is dissociated from the first sample holder.

In the eighth process step, in particular, the propagation of the ongoing bonding wave is again or continuously monitored by the measuring means. This monitoring tracks the progress of the bonding wave and thus the progress of the bonding process, especially longer than 5 seconds, preferably longer than 10 seconds, even more preferably longer than 50 seconds, and very preferably longer than 75 seconds. Most preferably, it is tracked over a period longer than 90 seconds. Instead of tracking the bonding process over a predetermined time interval, it is also possible to measure the bonding wave tracking with respect to the position of the bonding wave, especially the radial position. In this case, the tracking of the bonding process is such that the bonding wave, in particular, is at least 0.3 times, preferably at least 0.4 times, more preferably at least 0.5 times, very preferably at least 0.6 times the diameter of the substrate. Most preferably carried out while present in a radial position corresponding to 0.7 times. If it is desirable that tracking of the progress of the bonding be possible by measuring the surface conductivity, the progress of the bonding can also be carried out by a percentage of the bonded or unbonded surfaces. Is. In that case, the monitoring of the progress of bonding according to the present invention is particularly more than 9%, preferably more than 16%, more preferably more than 25%, extremely preferably more than 36%, most preferably 49% of the area. It is carried out until more are bonded. In an alternative form, monitoring is performed continuously.

Control of the process sequence is preferably carried out from monitoring within the range of the above values, based on specified / set or configurable values. From this, the second waiting time until the start of the next process step for the progress of the bonding wave is known.

In the ninth process step, the use of the transforming means is stopped. If the transforming means is a pin, the pin is pulled back. If the transforming means is one or more nozzles, the fluid flow is blocked. If the transforming means is an electric and / or magnetic field, the electric and / or magnetic field is switched off. The ninth process step is started, among other things, when one of the parameters of the measuring means reaches a specified / set value or a configurable value (see especially the eighth process step).

In the tenth process step, in particular, the propagation of the ongoing bonding wave is monitored again or continuously. This monitoring tracks the progress of the bonding wave and thus the progress of the bonding process, especially longer than 5 seconds, preferably longer than 10 seconds, even more preferably longer than 50 seconds, and very preferably longer than 75 seconds. Most preferably, it is tracked over a period longer than 90 seconds. Instead of tracking the bonding process over a predetermined time interval, it is also possible to determine the tracking of the bonding wave with respect to the position of the bonding wave, especially the radial position. In this case, the tracking of the bonding process is such that the bonding wave is at least 0.6 times, preferably at least 0.7 times, more preferably at least 0.8 times, very preferably at least 0.9 times the diameter of the substrate. Performed while present in the corresponding radial position. If the substrate has an edge cross-sectional shape, the bonding process cannot be traced to the outermost edge. This is because about 3 to 5 mm is not bonded based on the cross-sectional shape of the edge. If it is desirable that tracking of the progress of the bonding be possible by measuring the surface conductivity, the progress of the bonding can also be carried out by a percentage of the bonded or unbonded surfaces. Is. In that case, the monitoring of the progress of bonding according to the present invention is particularly more than 36%, preferably more than 49%, more preferably more than 64%, extremely preferably more than 81%, and most preferably 100% of the area. It is carried out until (more) is bonded. In an alternative form, monitoring is performed continuously.

Control of the process sequence is preferably carried out from monitoring within the range of the above values, based on specified / set or configurable values. From this, the third waiting time until the start of the next process step for the progress of the bonding wave is known.

An example of the process sequence of the first embodiment is given below:
● Load the substrate ● Contact the pin to the wafer without starting bonding (100mN force on the wafer)
● Make the two wafers relatively close to each other (interval 40-200 μm)
● Apply force to the wafer to initiate fusion bonding between the two substrates (force of 1500-2800 mN)
● Stop the heater ● Wait until the bonding wave propagates sufficiently (typically 1-5 seconds) -First standby time ● Switch off (exhaust) the vacuum suction on the wafer surface (especially in both zones) at the same time)
● Wait for the bonding wave to propagate further (especially 2 to 15 seconds) -Third wait time ● Pull back the pin ● Wait for the bonding wave to propagate completely (especially 5 to 90 seconds) -Fourth wait time.

The individual method steps can be generalized by the general technical teachings described above.

Process according to the second embodiment of the present invention The process according to the second embodiment corresponds to the first to seventh process steps of the first embodiment.

In the eighth process step, in particular, the holding force of the lower second sample holder is reduced or the position fixation is switched off. It is also conceivable to dissociate the lower second substrate by releasing the position fixing as intended. Especially in the case of a vacuum fixing part consisting of a plurality of individually controllable vacuum passages, the vacuum is released continuously from the center to the edge, so that the position fixing is released as intended. To. The eighth process step according to the invention is an important process for reducing the "runout" error. According to the present invention, the lower / second substrate is adapted to the upper first substrate by reducing the holding force of the lower second sample holder or by switching off the position fixing portion. It is possible to make it. Unpositioning removes, so to speak, additional (mathematical and mechanical) boundary conditions that can limit the bonding process.

Generally speaking or in other words, at time t2 during bonding, the holding force F _H2 is reduced, especially until the _second substrate above the second sample holder is deformable.

The ninth process step corresponds to the eighth process step of the first embodiment.

In the tenth process step according to the invention, especially the already partially bonded second substrate is repositioned to the lower second sample holder. The tenth process step according to the invention is also an important process for reducing the "runout" error. Bonding progress is again limited by (mathematical and mechanical) boundary conditions by repositioning, especially by switching on vacuum suction again.

Generally speaking or in other words, the holding force _HF2 is increased at time point _t4 , especially after bonding.

The eleventh process step corresponds to the ninth process step according to the first embodiment, and the twelfth process step corresponds to the tenth process step according to the first embodiment.

In one very specific embodiment according to the present invention, the position fixing portion is switched off by the eighth process step and the position fixing portion is switched on again by the tenth process step before the end of the bonding process. Can be repeated multiple times. On the contrary, it is also possible to switch off and fix the position again in a spatially decomposed manner. According to the invention, this works in particular with the individually controllable vacuum passages or vacuum segments already described herein. That is, in the ideal case, the release or position fixing of the lower / second substrate is performed in a position-decomposable and / or time-decomposition manner.

An example of the process sequence of the second embodiment is given below:
● Loading the substrate ● Bringing the pin (deformation means) into contact with the wafer (especially the force of 100 mN on the wafer) -the first force of the pin ● The two wafers are relatively close to each other Allow (especially spacing 40-200 μm) -First spacing ● Press the wafer to initiate fusion bonding between the two substrates (especially 1500-2800 mN force) -Second force on the pin ● Stop the heater ● Wait until the bonding wave propagates sufficiently (especially 1 to 5 seconds) -First standby time ● Switch off (exhaust) vacuum adsorption for the upper wafer (especially both zones at the same time)
● Switch off (exhaust) vacuum suction for the lower wafer ● Wait for the bonding wave to propagate further (especially 2-15 seconds) -Third standby time ● Vacuum suction for the lower wafer Switch on-first vacuum ● pull back the pin ● wait for the bonding wave to propagate completely (especially 5 to 90 seconds) -fourth wait time.

The individual method steps can be generalized by the general technical teachings described above.

Process according to the third embodiment of the present invention The process according to the third embodiment corresponds to the first to ninth process steps of the second embodiment. In the ninth process step, each parameter is preferably set 10-40% smaller than in the second embodiment. By doing so, the waiting time to the tenth process step is shortened, and in the third embodiment, an additional waiting time is introduced or the second waiting time is divided.

In a tenth process step according to the invention, the space between the lower second sample holder and the lower / second substrate resting on it in an unfixed state. However, it is ventilated at a predetermined pressure. It should be understood that "pressure" in this case is absolute pressure. In this case, the absolute pressure of 1 bar corresponds to the atmospheric pressure. That is, in order to carry out the process according to the present invention, it is necessary to evacuate the chamber in advance and then open it to the atmosphere, that is, to ventilate it. By doing so, the free mobility of the substrate can be promoted, which further minimizes the strain on the first substrate. The pressure is particularly between 1 millibar and 1000 millibars, preferably 2.5 millibars to 800 millibars, more preferably 5 millibars to 600 millibars, very preferably 7.5 millibars to 400 millibars, most preferably between 10 millibars and 200 millibars. Is. In yet another embodiment according to the invention, it is conceivable that the embodiment according to the invention is carried out under atmospheric pressure up to the tenth process step, after which an overpressure is formed in the chamber by a compressor. In this case, the pressure is particularly 1 bar to 3 bar, preferably 1 bar to 2.5 bar, more preferably 1 bar to 2 bar, very preferably 1 bar to 1.5 bar, most preferably 1 bar to. It is between 1.2 bars.

In the eleventh process step, the propagation of the bonding wave in progress is monitored again or continuously by the measuring means. This monitoring tracks the progress of the bonding wave and thus the progress of the bonding process, especially longer than 1 second, preferably longer than 2 seconds, even more preferably longer than 5 seconds, and very preferably longer than 10 seconds. Most preferably follow for a period longer than 15 seconds. Instead of tracking the bonding process over a predetermined time interval, it is also possible to determine the tracking of the bonding wave with respect to the position of the bonding wave, especially the radial position. In this case, the tracking of the bonding process is such that the bonding wave, in particular, is at least 0.3 times, preferably at least 0.4 times, more preferably at least 0.5 times, very preferably at least 0.6 times the diameter of the substrate. Most preferably carried out while present in a radial position corresponding to 0.7 times. If it is desirable that the tracking of the progress of the bonding be measurable by measuring the surface conductivity, the progress of the bonding can also be carried out as a percentage of the bonded or unbonded surfaces. Is. In that case, the monitoring of the progress of bonding according to the present invention is particularly more than 9%, preferably more than 16%, more preferably more than 25%, extremely preferably more than 36%, most preferably 49% of the area. It is carried out until more are bonded. In an alternative form, monitoring is performed continuously.

Control of the process sequence is preferably carried out from monitoring within the range of the above values, based on specified / set or configurable values. From this, the first waiting time until the start of the next process step for the progress of the bonding wave is known.

In the twelfth process step according to the invention, especially the already partially bonded second substrate is repositioned to the lower second sample holder.

Generally speaking or in other words, the holding force _HF2 is increased at time point _t4 , especially after bonding.

The thirteenth process step corresponds to the ninth process step according to the first embodiment, and the fourteenth process step corresponds to the tenth process step according to the first embodiment.

An example of the process sequence of the third embodiment is given below:
● Loading the substrate ● Contacting the pins to the wafer without initiating bonding (especially a force of 100 mN on the wafer) -First force of the pins ● Bringing the two wafers closer together (especially spacing) 40-200 μm)-First spacing ● Press the wafer to initiate fusion bonding between the two substrates (especially 1500-2800 mN force) -Second force of the pin ● Stop the heater ● Bonding wave Waits for sufficient propagation (especially 1-5 seconds) -First standby time ● Switch off (exhaust) vacuum adsorption for the upper wafer (especially both zones at the same time)
● Switch off (exhaust) vacuum suction for the lower wafer ● Wait for the bonding wave to propagate further (especially 1-10 seconds) -Second standby time ● Lower wafer and chuck (lower) Ventilate the space between the sample holder) at a given pressure (especially 10-200 millibars) for a given period-first pressure ● wait for the bonding wave to propagate further (especially 2-15 seconds). -Third standby time ● Switch on vacuum suction for the lower wafer-First vacuum ● Pull back the pin ● Wait for the bonding wave to propagate completely (especially 5 to 90 seconds) -Fourth Waiting time.

The individual method steps can be generalized by the general technical teachings described above.

Post-processing The described process can be continued, especially in additional process modules.

In the first possible continuation process, the formed substrate stack is inspected, especially in the instrumentation module. This test is especially:
● Alignment error, especially ○ Overall alignment error and / or
○ Runout error and / or
● Defects, especially ○ voids and / or
○ Bubbles and / or
○ Cracks,
Includes measurement of the junction interface to confirm.

If the inspection of the board stack has an unacceptable error, the board stack is preferably separated again. In this case, the separation is preferably carried out by the methods and devices disclosed in European Patent No. 2697823 (EP2697823B1) and WO 2013/091714 (WO2013 / 091714A1). These documents are referred to in this regard. Inspection of the joint interface is performed, among other things, prior to subsequent heat treatment.

In the second possible subsequent process, the formed substrate stack is heat treated. The heat treatment in particular strengthens the bonds formed between the substrates in the substrate stack. The heat treatment is carried out in particular at a temperature higher than 25 ° C., preferably higher than 100 ° C., more preferably higher than 250 ° C., very preferably higher than 500 ° C., and most preferably higher than 750 ° C. This temperature substantially corresponds to the heating temperature _TH . The bonded bonding strength formed is particularly greater than 1.0 J / m ² , preferably greater than 1.5 J / m ² , more preferably greater than 2.0 J / m ² , and most preferably 2.5 J / m 2. Greater than m ² . The heat treatment is preferably carried out under vacuum. The vacuum pressure is particularly less than 1 bar, preferably less than 800 mbar, even more preferably less than 10 ^-3 mbar, very preferably less than ^10-5 mbar, most preferably less than ^10-8 mbar. small.

However, it is also conceivable to carry out the heat treatment in a protective gas atmosphere. This is especially advantageous if the protective gas used facilitates heat transfer. The thermal conductivity of the protective gas is particularly higher than 0 W / (m · K), preferably higher than 0.01 W / (m · K), and even more preferably higher than 0.1 W / (m · K). Very preferably higher than 1 W / (m · K). The thermal conductivity of helium is, for example, between about 0.15 W / (m · K) and 0.16 W / (m · K). Protective gas is especially:
● Noble gases, especially helium, neon, argon, krypton, and / or xenon ● Molecular gases, especially carbon dioxide and / or nitrogen ● Any combination from the above gases.

Preferably, the substrate has substantially the same diameters D1 and D2. The diameters D1 and D2 differ from each other, especially less than 5 mm, preferably less than 3 mm, and even more preferably less than 1 mm.

In yet another, especially independent configuration of the invention, the deformation is carried out by mechanical actuation means and / or temperature control of the first and / or second mounting devices.

The deformation in the present invention can be more easily realized by fixing the position of the first mounting surface and / or the second mounting surface only within the range of the side wall of the first and / or the second substrate.

The results of the process according to the invention relate to a number of physical parameters that can be directly associated with the substrate or surrounding environment. The following description of this disclosure describes some of the most important parameters and their effect on the "runout" error. Parameters are roughly divided into single parameters and paired parameters. Single parameters cannot be associated with the symmetric side, especially the substrate. The pair parameters can have different values on one symmetric side, especially on the first substrate, on the opposite symmetric sides, especially on the second substrate. There is a first upper symmetric side and a second lower symmetric side. Examples of single parameters are bonding wave velocity v or gas (mixture) pressure p. Examples of pair parameters are substrate thicknesses d1 and d2.

In the following description, when the effect of pair parameters on bonding results is described, it is assumed that all other values of each pair parameter are preferably the same, unless otherwise stated. The following example is given as an example. When the effects of the thicknesses d1 and d2 of two different substrates on the bonding result are described, it is assumed that the elastic moduli E1 and E2 of both substrates are the same.

The goal is to minimize or completely eliminate "runout" errors, especially with time-related optimal curves calculated and / or experimentally determined. The "curved line" in this case is understood to be a less symmetric representation of the surface position of the substrate, that is, a one-dimensional function that maps the substrate surface as a function of position coordinates, especially radial coordinates. .. "Lower symmetry" is two-dimensional contacting between substrates that minimizes or completely eliminates "runout" errors based on the radial symmetry of both substrates. It means that it is enough to calculate the one-dimensional curved line in order to infer inductively. Simply put, the curved lines of the substrate can be described as being the surface of the substrate facing the bonding interface in particular. Preferably, the description of the curved line with respect to the first substrate also applies to the second substrate.

Curved lines, or substrate surfaces, are primarily affected by one or more of the following parameters, according to the invention.

The thicknesses d1 and d2 of the substrate are combined with the masses m1 and m2 of both substrates and thus the gravity G1 and G2 by the volumes V1 and V2 and the densities p1 and p2. The gravity G1 of the first substrate directly affects the acceleration behavior of the first upper substrate in the direction of the second lower substrate. When the lower position fixing part is switched off, gravity G2 is a measure of the inertial force of the second lower substrate, and thus the second lower substrate is along the bonding wave. It is a measure worthy of a force to move, a force to endure, or a force to stay in the direction opposite to the first upper substrate.

The elastic moduli E1 and E2 are measures for the rigidity of the substrate. The elastic moduli E1 and E2 have a decisive influence on the curved line, and therefore together define a function for making it possible to describe how the substrates move toward each other.

The forces F1 and F2 affect the area where both substrates are coupled to each other, especially at the center. Since point-like contacting exists only in the ideal case, it must always be assumed that the contacting of both substrates is performed in a planar manner in the center. The size of the surface is mainly set by the forces F1 and F2. The size of the contact surface is decisive for the boundary conditions.

The temperatures T1 and T2 of both substrates can affect the overall thermal expansion state of the substrates. Thereby, according to the present invention, it is possible to set how strongly the substrate is distorted by thermal expansion with respect to the reference temperature. Therefore, accurate temperature control of the upper and / or lower substrate is an important feature to fully compensate for "runout" as accurately as possible. Preferably, the temperatures of both substrates can be set differently. In particular, the substrate is in an expanded state in which the structures to be bonded to each other are congruent with each other, that is, the expanded state in which the "runout" error disappears (at the time of bonding, additional by the parameters already listed above). The temperature is set so that (assuming no "runout" error is built). The temperature required for this can be determined by measuring means and / or by experiment.

The gas (mixture) pressure p affects the resistance of the atmosphere to the substrates moving towards each other. The gas (mixture) pressure can have a direct effect on the bonding wave velocity v. In this regard, International Publication No. 2014/191033 (WO2014191033A1) will be referred to.

The holding forces F _H1 and F _H2 are used especially for fixing the position of the substrate before the original bonding process. The holding force F _H1 is a boundary condition for the first to sixth process steps, but loses the influence of the boundary condition that determines the curved line after the position fixing portion is switched off. Similarly, the holding force F _H2 is used as a boundary condition only when the lower position fixation is in operation. Therefore, in order to calculate based on the elasticity theory, it is necessary to appropriately create new boundary conditions from the seventh process step at the latest.

The initial radii of curvature r10 and r20 are the initial radii of the substrate before carrying out the process according to the present invention. The initial radii of curvature r10, r20 are a function of position, but are particularly constant with respect to position. In a particular first embodiment according to the invention, the initial radius of curvature r10 of the second lower substrate is infinite. This is because the second lower substrate is placed flat at the beginning of the process according to the invention. In yet another particular second embodiment according to the invention, the initial radius of curvature r10 of the second lower substrate is a finite positive or negative constant depending on the constant convex or concave curvature. .. In this case, the second lower substrate is present in a convex or concave curved shape at the beginning of the process according to the invention. Such sample holders are described in WO 2014/191033 (WO2014191033A1), which is referred to in this regard. In particular, at least the initial radius of curvature r10 of the second lower substrate coincides with the surface of the second lower sample holder on which the second substrate is placed.

The radius of curvature r1 and r2 of both substrates along the bonding wave are the results of solving the equation based on the elastic theory in consideration of the above parameters. The radii of curvature r1 and r2 of the substrate are, among other things, a function of position and time.

The bonding wave velocity is the result of the above parameters.

Further advantages, features, and details of the present invention will become apparent with reference to the drawings from the following description of preferred embodiments.

FIG. 3 is a schematic cross-sectional view of the first process step of the first embodiment of the method according to the invention, not in scale. FIG. 3 is a schematic cross-sectional view of the second process step, not in scale. FIG. 3 is a schematic cross-sectional view of the third process step, not in scale. FIG. 3 is a schematic cross-sectional view of the fourth process step, not in scale. FIG. 3 is a schematic cross-sectional view of the fifth process step, not in scale. FIG. 6 is a schematic cross-sectional view of the sixth process step, not in scale. FIG. 3 is a schematic cross-sectional view of the seventh process step, not in scale. FIG. 3 is a schematic cross-sectional view of the eighth process step, not in scale. 9 is a schematic cross-sectional view of the ninth process step, not in scale. FIG. 3 is a schematic cross-sectional view of the tenth process step, not in scale. FIG. 3 is a schematic cross-sectional view of an additional process step of a third embodiment of the method according to the invention, not in scale. Schematic cross-sectional view of an optional additional process step that is not in scale. It is a schematic cross-sectional view of two substrates not according to the scale.

In the drawings, the same components and the components having the same function are indicated by the same reference numerals.

FIG. 1a shows a first process step. In the first process step, the first, especially the upper substrate 2, is positioned and fixed to the sample holder surface 1o of the first, especially the upper sample holder 1. The position fixing is carried out by the holding force _HF1 via the position fixing means 3.

The first sample holder 1 has a through opening, particularly a hole 4, which is particularly central. The through opening is used for penetrating and inserting the deforming means 6 (FIG. 1b) for deforming the first substrate 2.

In one advantageous embodiment not shown herein, the first sample holder 1 has a plurality of holes 5 through which the measuring means observes the progress of bonding. Can be done. The hole 5 is preferably a vertically long notch.

The second substrate 2'is loaded and positioned on the second, especially the lower sample holder 1'. The position fixing is carried out by the holding force _HF2 via the position fixing means 3'.

The position fixing means 3, 3'are preferably a vacuum fixing portion.

The sample holders 1 and 1'have, among other things, a heater 11 (heating means). In the drawings, for the sake of clarity, the heater 11 is shown schematically only in the second lower sample holder 1'.

All parameters or forces listed above that describe the properties of the substrates 2, 2'or affect the substrates 2, 2'are generally functions of position and / or time. Examples of parameters include temperatures T1 and T2 of both substrates 2, 2'. There is a temperature gradient as the temperature T1 or T2 can generally be location related. In this case it is advantageous to express the temperature as an explicit function of position and / or time. Examples of forces include two gravitational forces G1 and G2. These two gravitational forces G1 and G2 represent the total gravitational force acting on the substrates 2, 2'in the drawings. However, it is obvious to those skilled in the art that both substrates 2, 2'can be decomposed into infinitesimal (mass) portions dm, and that the influence of gravity can be applied to each of these mass portions dm. Gravity should therefore generally be expressed as a function of position and / or time.

Similar ideas apply for all other parameters and / or forces.

FIG. 1b shows a second process step according to the present invention. In the second process step, the deforming means 6, especially the pins, exerts pressure on the back side 2i of the first substrate 2 to cause the first substrate 2 to be deformed. In this case, the deformation of the first substrate 2 is carried out by the _first force F1.

In the process step of FIG. 1c, both sample holders 1, 1'and thus both substrates 2, 2'are relatively close to each other until a predetermined interval is obtained. This approach can be carried out during the second process step or before the second process step.

In the process step of FIG. 1d, the _second force F2 initiates bonding, especially prebonding. The second force F ₂ brings about further, especially infinitesimal, small deflections that bring the substrates 2, 2'closer together and finally contacting at the contact point 7.

The bonding wave, more particularly the bonding wave front 8, initiates propagation from the contact point 7 at the bonding wave velocity v, particularly radially symmetrically, preferably concentrically. The bonding wave velocity v can be varied during the course of further process steps, and thus this bonding wave velocity v can be defined as a function of position (or time). The bonding wave speed v can be influenced by various means.

In a further process step of FIG. 1e, the heaters 11 of the first and / or second sample holders 1, 1'are switched off, thereby heating the first and / or second substrates 2, 2'afterwards. Is interrupted. In a further process step of FIG. 1f, the bonding wavefront 8 is monitored by the measuring means 9, especially the optical system, preferably the infrared optical system. The measuring means 9 is a junction between the substrate backside 2i of the first substrate 2, more preferably both substrates 2, 2'through the holes 5 (at least one, preferably in a number consistent with the number of optical systems). The interface, and thus the bonding wavefront 8, is detected. The detection of the junction interface is carried out in the measuring means 9, which is particularly sensitive to electromagnetic radiation. It should be noted that this electromagnetic radiation can penetrate both substrates 2, 2'without being significantly attenuated. Preferably, the light source 12 is arranged above and / or below and / or inside the sample holder 1'. The electromagnetic radiation of the light source 12 irradiates and / or transmits the sample holder 1'and / or the substrate 2, 2', which can be detected by the measuring means 9. The image taken in this way is preferably a black-and-white image. It is possible to uniquely distinguish between the bonded region and the unbonded region by the difference in brightness. The transition region between the two regions is the bonding wave. By such measurement, it is possible to specify the position of the bonding wavefront 8, and it is also possible to obtain the bonding wave speed v, especially when a plurality of such positions are specified.

FIG. 1g shows a further seventh process step. In the seventh process step, the position fixing 3 of the first sample holder 1 is released by at least reducing the holding force F _H1 . When the position fixing portion 3 is a vacuum fixing portion, more preferably a vacuum fixing portion having a plurality of separately controllable vacuum segments (due to a plurality of holding forces _HF1 ), particularly from the inside to the outside. Dissociation is performed by switching off the plurality of vacuum segments as intended (or reducing one or more holding forces F _H1 as intended).

FIG. 1h shows a further process step. In this process step, the bonding wavefront 8 after being dissociated from the first substrate holder 1 is monitored by the measuring means 9.

FIG. 1i shows a further process step. In this process step, the action given by the transforming means 6 to the first substrate 2 is interrupted. If the transforming means 6 is a mechanical transforming means, especially if it is a pin, the interruption is performed by pulling it back. If a nozzle is used, the interruption is performed by blocking the flow of fluid. In the case of an electric and / or magnetic field, the interruption is performed by switching off the electric and / or magnetic field.

FIG. 1j shows a further process step. After this process step, both substrates 2, 2'are completely bonded to each other. In particular, in this process step, the measuring means 9 continues to monitor the bonding wavefront 8 (which is no longer shown because the bonding has already been completed in this process state) until the bonding is completed, at which time the first and first and the bonding are completed. The substrate stack 10 formed from the second substrates 2, 2'is in a completed state.

FIG. 2 shows an optional process step. In particular, in this process step, which is located after the process step of FIG. 1g, the holding force F _H2 of the second lower position fixing portion 3'of the second lower sample holder 1'is reduced. In particular, the holding force F _H2 is reduced to 0. That is, the position fixing is released. This allows, among other things, the second substrate 2'to be movable unimpeded, especially laterally along the lower sample holder surface 1o'.

In yet another advantageous embodiment, the second substrate 2'is lifted from the second lower sample holder 1', especially until locally lifted. This is caused especially by applying pressure from the second sample holder 1'to the second substrate 2'.

Gravity G2 counteracts the lifting of the second substrate 2'during the entire duration of the bonding process and thus affects the contacting of both substrates 2 and 2'and thus the "run-out".

FIG. 3 shows an optional process step according to the present invention. In this process step, the chamber in which the process according to the invention is proceeding is ventilated before the fully bonded substrate stack 10 is formed. This ventilation is used specifically to control the progression of the bonding wavefront 8. A detailed description of the means of influence is disclosed in WO 2014/191033 (WO2014 / 191033A1), which is referred to in this regard. Ventilation is carried out by gas or gas mixture. Ventilation in particular is carried out by opening the valve to the ambient atmosphere, whereby the chamber is ventilated by the ambient gas (mixture). Instead of ventilating the ambient atmosphere, it is possible to overpressure the chamber with a gas or gas mixture.

FIG. 4 is a schematic cross-sectional view of two substrates 2, 2'not in scale, and these two substrates 2, 2'are defined by a number of parameters. The substrate surfaces 2o and 2o'correspond to the curved lines of the first upper substrate 2 or the second lower substrate 2'at a predetermined time point. The substrate surfaces 2o and 2o'are mainly defined by the above parameters. The shapes of the substrate surfaces 2o, 2o'change as a function of time during the bonding process according to the present invention.

1,1'Sample holder 1o, 1o'Sample holder surface 2,2' Substrate 2o, 2o' Substrate surface 2i Substrate back side 3,3' Position fixing part 4 Hole part 5 Hole part 6 Deformation means 7 Contact point 8 Bonding wave front 9 Measuring means 10 Board stack 11 Heater 12 Light source F ₁ , F ₂ force F _H1 , F _H2 Holding force v Bonding wave speed _TH Heating temperature T1, T2 Board temperature E1, E2 Board elastic modulus d1, d2 Board thickness V1, V2 Board volume m1, m2 Board mass p1, p2 Board density G1, G2 Board gravity r1, r2 Board curvature radius r10, r20 Board initial curvature radius D Board edge spacing

Claims (15)

A device for bonding the first substrate (2) and the second substrate (2').
The device comprises a measuring means (9), wherein the measuring means (9) is provided.
Between the contacts of the first and second substrates (2, 2'), the unbonded surface of the first and second substrates (2, 2') or the first and second substrates (2). 2,') Detect the percentage amount of bonded surface,
Through the detected percentage amount, the progress of the bonding wave between the first and second substrates (2, 2') is monitored, and the bonding wave can be controlled .
The device is
A first sample holder (1) configured to hold the first substrate (2) by a first holding force _HF1 and a first sample holder (1).
A second sample holder (1') configured to hold the second substrate (2') by a second holding force _HF2 , and a second sample holder (1').
Further prepare
At least one of the first holding force F _H1 and the second holding force F _H2 is reduced to 0 in order to control the bonding wave.
The first and second sample holders (1, 1') are subjected to the first and second substrates (2) by the vacuum applied from the first and second sample holders (1, 1'), respectively. 2') are fixed to the first and second sample holders (1, 1'), respectively.
The vacuum applied from the first and second sample holders (1, 1') gives the first holding force F _H1 and the second holding force F _H2 , respectively, and the first and second holding forces F H2. The substrate (2, 2') is fixed to the first and second sample holders (1, 1'), respectively.
The vacuum is reduced, the first holding force _HF1 is reduced, the dissociation of the first substrate (2) from the first sample holder (1) is controlled, and / or the second. The holding force F _H2 is reduced to control the dissociation of the second substrate (2') from the second sample holder (1').
The heating temperature TH on the surface of the second sample holder (1') _is reduced during bonding.
device. The measuring means (9) is further configured to detect the state of the bonding wave.
The device according to claim 1. The measuring means (9) comprises a conductivity measuring means configured to detect the percentage amount and monitor the progress.
The device according to claim 1. The measuring means (9) detects at least one of the position of the bonding wave and the size of the bonding area between the first and second substrates (2, 2'), and monitors the progress of the bonding wave. Further equipped with at least one of an optical system and a camera configured to.
The device according to claim 1. The progress of the bonding wave is monitored over a period of more than 1 second.
The device according to claim 4 . The progression of the bonding wave is monitored via a radial position of the bonding wave that corresponds to at least 0.1 times the diameter of each of the first and second substrates (2, 2').
The device according to claim 4 . The bonding wave is controlled in consideration of the value obtained by the measuring means (9).
The device according to claim 1. The bonding wave is controlled by releasing the fixing means as intended by continuously releasing the vacuum.
The device according to claim 1. The measuring means (9) is further configured to monitor the progress until the percentage amount is greater than 1%.
The device according to claim 1. The measuring means (9) is further configured to monitor the progress until the percentage amount is greater than 4%.
The device according to claim 1. The measuring means (9) is further configured to monitor the progress until the percentage amount is greater than 9%.
The device according to claim 1. The measuring means (9) is further configured to monitor the progress until the percentage amount is greater than 16%.
The device according to claim 1. The measuring means (9) is further configured to monitor the progress until the percentage amount is greater than 25%.
The device according to claim 1. A device for bonding a first substrate (2) and a second substrate (2') on the respective contact surfaces of both substrates (2, 2'), wherein the device is a first sample holder. (1), a second sample holder (1'), and a measuring means (9) are provided.
The first sample holder (1) attaches the first substrate (2) to the first by the first holding force _HF1 applied by the first vacuum of the first sample holder (1). It is configured to hold on the surface of the sample holder (1) of
The second sample holder (1') holds the second substrate (2') by the second holding force _HF2 applied by the second vacuum of the second sample holder (1'). It is configured to hold on the surface of the second sample holder (1').
The measuring means (9) is
Between the contacts of the first and second substrates (2, 2'), the unbonded surface of the first and second substrates (2, 2') or the first and second substrates (2). 2,') Detect the percentage amount of bonded surface,
Through the detected percentage amount, the progress of the bonding wave between the first and second substrates (2, 2') is monitored, and the bonding wave can be controlled.
Is configured as
At least one of the first holding force F _H1 and the second holding force F _H2 is reduced to 0 in order to control the bonding wave.
The first vacuum is reduced, the first holding force F _H1 is reduced, the dissociation of the first substrate (2) from the first sample holder (1) is controlled, and / or said. The second vacuum is reduced, the second holding force F _H2 is reduced, and the dissociation of the second substrate (2') from the second sample holder (1') is controlled.
The heating temperature TH on the surface of the second sample holder (1') _is reduced during bonding.
device. It is a method for bonding the first substrate (2) and the second substrate (2'), and the above method is
A step of initiating contact between the first substrate (2) and the second substrate (2'),
With the step of detecting the percentage amount of the unbonded surface of the contacted first and second substrates (2, 2') or the bonded surface of the contacted first and second substrates (2, 2'). ,
A step of monitoring the progress of the bonding wave between the contacted first and second substrates (2, 2') through the detected percentage amount and enabling control of the bonding wave.
A step of holding the first substrate (2) by the first sample holder (1) by the first holding force _FH1 and a step of holding the first substrate (2) by the first sample holder (1).
The step of holding the second substrate (2') by the second sample holder (1') by the second holding force _HF2 , and
A step of reducing at least one of the first holding force F _H1 and the second holding force F _H2 to 0 in order to control the bonding wave.
The first vacuum contained in the first sample holder ( 1 ) is reduced, the retention of the first substrate ( 2) in contact by the first sample holder ( 1) is reduced, and /. Alternatively, the second vacuum contained in the second sample holder (1') is reduced to reduce the retention of the contacted second substrate (2') by the second sample holder (1'). In the meantime, the step of controlling the bonding wave and
A step of reducing the heating temperature TH of the surface of the second sample holder (1') _during bonding, and
How to include.

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