JP2012164469A5 - - Google Patents

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Publication number
JP2012164469A5
JP2012164469A5 JP2011022735A JP2011022735A JP2012164469A5 JP 2012164469 A5 JP2012164469 A5 JP 2012164469A5 JP 2011022735 A JP2011022735 A JP 2011022735A JP 2011022735 A JP2011022735 A JP 2011022735A JP 2012164469 A5 JP2012164469 A5 JP 2012164469A5
Authority
JP
Japan
Prior art keywords
substrate
conductive contact
holes
contact pin
corresponding hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011022735A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012164469A (ja
JP6116112B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011022735A priority Critical patent/JP6116112B2/ja
Priority claimed from JP2011022735A external-priority patent/JP6116112B2/ja
Priority to PCT/US2012/023066 priority patent/WO2012106221A1/en
Priority to TW101103587A priority patent/TWI563753B/zh
Publication of JP2012164469A publication Critical patent/JP2012164469A/ja
Publication of JP2012164469A5 publication Critical patent/JP2012164469A5/ja
Application granted granted Critical
Publication of JP6116112B2 publication Critical patent/JP6116112B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011022735A 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット Expired - Fee Related JP6116112B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット
PCT/US2012/023066 WO2012106221A1 (en) 2011-02-04 2012-01-30 Ic device socket
TW101103587A TWI563753B (en) 2011-02-04 2012-02-03 Ic device socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015134651A Division JP6109247B2 (ja) 2015-07-03 2015-07-03 Ｉｃデバイス用ソケット

Publications (3)

Publication Number Publication Date
JP2012164469A JP2012164469A (ja) 2012-08-30
JP2012164469A5 true JP2012164469A5 (enrdf_load_stackoverflow) 2014-03-20
JP6116112B2 JP6116112B2 (ja) 2017-04-19

Family

ID=45809569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011022735A Expired - Fee Related JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット

Country Status (3)

Country Link
JP (1) JP6116112B2 (enrdf_load_stackoverflow)
TW (1) TWI563753B (enrdf_load_stackoverflow)
WO (1) WO2012106221A1 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
JP6520179B2 (ja) * 2015-02-13 2019-05-29 日本電産リード株式会社 中継コネクタ、及び基板検査装置
DE112016001535T5 (de) 2015-03-31 2018-03-08 Technoprobe S.P.A Sondenkarte für ein Testgerät von elektronischen Vorrichtungen mit verbesserten Filtereigenschaften
TWI620936B (zh) * 2017-02-22 2018-04-11 中華精測科技股份有限公司 積體電路之測試探針卡
CN109411937B (zh) * 2017-08-14 2021-09-21 富顶精密组件（深圳）有限公司 电连接器及其制造方法
JP2019090632A (ja) * 2017-11-13 2019-06-13 リード・エレクトロニクス株式会社 Ｉｃ検査装置
CN111742228B (zh) * 2019-01-31 2023-03-21 山一电机株式会社 检查用插座
CN112824912B (zh) * 2019-11-20 2024-12-27 嘉联益电子(昆山)有限公司 传输线测试模块与传输线测试方法
US12085587B2 (en) * 2021-01-23 2024-09-10 Essai, Inc. Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling
KR102787911B1 (ko) 2023-02-13 2025-03-28 주식회사 피엠티 반도체소자 테스트 소켓
AT18455U1 (de) * 2023-04-18 2025-04-15 Rainer Gaggl Dipl Ing Dr Vorrichtung zum elektrischen Prüfen von Halbleiterbauteilen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709990B2 (ja) * 1991-09-10 1998-02-04 日立電子エンジニアリング株式会社 Ｉｃテスターの測定治具
JPH0550365U (ja) * 1991-12-05 1993-07-02 日本合成ゴム株式会社 面状コネクター装置
JPH1167396A (ja) 1997-08-11 1999-03-09 Toshiba Chem Corp 端子ピッチ変換基板
JP2000082553A (ja) 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ｉｃ用ソケット
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
US6972958B2 (en) * 2003-03-10 2005-12-06 Hewlett-Packard Development Company, L.P. Multiple integrated circuit package module
JP4695447B2 (ja) * 2005-06-23 2011-06-08 株式会社日本マイクロニクス プローブ組立体およびこれを用いた電気的接続装置
JP2007080592A (ja) * 2005-09-12 2007-03-29 Fujitsu Component Ltd 半導体装置実装用ソケット
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP2008066076A (ja) * 2006-09-06 2008-03-21 Sumitomo Electric Ind Ltd 異方導電性シート，その形成方法，積層シート体および検査ユニット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP2011146334A (ja) * 2010-01-18 2011-07-28 Three M Innovative Properties Co コンタクトピンホルダ

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