TWI563753B - Ic device socket - Google Patents

Ic device socket

Info

Publication number
TWI563753B
TWI563753B TW101103587A TW101103587A TWI563753B TW I563753 B TWI563753 B TW I563753B TW 101103587 A TW101103587 A TW 101103587A TW 101103587 A TW101103587 A TW 101103587A TW I563753 B TWI563753 B TW I563753B
Authority
TW
Taiwan
Prior art keywords
device socket
socket
Prior art date
Application number
TW101103587A
Other languages
English (en)
Chinese (zh)
Other versions
TW201244299A (en
Inventor
Yoshihisa Kawate
Yuichi Tsubaki
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201244299A publication Critical patent/TW201244299A/zh
Application granted granted Critical
Publication of TWI563753B publication Critical patent/TWI563753B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
TW101103587A 2011-02-04 2012-02-03 Ic device socket TWI563753B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022735A JP6116112B2 (ja) 2011-02-04 2011-02-04 Ｉｃデバイス用ソケット

Publications (2)

Publication Number Publication Date
TW201244299A TW201244299A (en) 2012-11-01
TWI563753B true TWI563753B (en) 2016-12-21

Family

ID=45809569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103587A TWI563753B (en) 2011-02-04 2012-02-03 Ic device socket

Country Status (3)

Country Link
JP (1) JP6116112B2 (enrdf_load_stackoverflow)
TW (1) TWI563753B (enrdf_load_stackoverflow)
WO (1) WO2012106221A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735794B (zh) * 2017-08-14 2021-08-11 英屬開曼群島商鴻騰精密科技股份有限公司 電連接器及其製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
JP6520179B2 (ja) * 2015-02-13 2019-05-29 日本電産リード株式会社 中継コネクタ、及び基板検査装置
DE112016001535T5 (de) 2015-03-31 2018-03-08 Technoprobe S.P.A Sondenkarte für ein Testgerät von elektronischen Vorrichtungen mit verbesserten Filtereigenschaften
TWI620936B (zh) * 2017-02-22 2018-04-11 中華精測科技股份有限公司 積體電路之測試探針卡
JP2019090632A (ja) * 2017-11-13 2019-06-13 リード・エレクトロニクス株式会社 Ｉｃ検査装置
CN111742228B (zh) * 2019-01-31 2023-03-21 山一电机株式会社 检查用插座
CN112824912B (zh) * 2019-11-20 2024-12-27 嘉联益电子(昆山)有限公司 传输线测试模块与传输线测试方法
US12085587B2 (en) * 2021-01-23 2024-09-10 Essai, Inc. Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling
KR102787911B1 (ko) 2023-02-13 2025-03-28 주식회사 피엠티 반도체소자 테스트 소켓
AT18455U1 (de) * 2023-04-18 2025-04-15 Rainer Gaggl Dipl Ing Dr Vorrichtung zum elektrischen Prüfen von Halbleiterbauteilen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
WO2011088308A1 (en) * 2010-01-18 2011-07-21 3M Innovative Properties Company Contact pin holder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709990B2 (ja) * 1991-09-10 1998-02-04 日立電子エンジニアリング株式会社 Ｉｃテスターの測定治具
JPH0550365U (ja) * 1991-12-05 1993-07-02 日本合成ゴム株式会社 面状コネクター装置
JPH1167396A (ja) 1997-08-11 1999-03-09 Toshiba Chem Corp 端子ピッチ変換基板
JP2000082553A (ja) 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ｉｃ用ソケット
US6972958B2 (en) * 2003-03-10 2005-12-06 Hewlett-Packard Development Company, L.P. Multiple integrated circuit package module
JP4695447B2 (ja) * 2005-06-23 2011-06-08 株式会社日本マイクロニクス プローブ組立体およびこれを用いた電気的接続装置
JP2007080592A (ja) * 2005-09-12 2007-03-29 Fujitsu Component Ltd 半導体装置実装用ソケット
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP2008066076A (ja) * 2006-09-06 2008-03-21 Sumitomo Electric Ind Ltd 異方導電性シート，その形成方法，積層シート体および検査ユニット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
TW555993B (en) * 2002-01-15 2003-10-01 Via Tech Inc Chip test device to test the chip using BGA package
WO2011088308A1 (en) * 2010-01-18 2011-07-21 3M Innovative Properties Company Contact pin holder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735794B (zh) * 2017-08-14 2021-08-11 英屬開曼群島商鴻騰精密科技股份有限公司 電連接器及其製造方法

Also Published As

Publication number Publication date
JP2012164469A (ja) 2012-08-30
WO2012106221A1 (en) 2012-08-09
TW201244299A (en) 2012-11-01
JP6116112B2 (ja) 2017-04-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees