JP2012142549A - 薄型基板用支持体脱着設備及びその脱着方法 - Google Patents

薄型基板用支持体脱着設備及びその脱着方法 Download PDF

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Publication number
JP2012142549A
JP2012142549A JP2011165264A JP2011165264A JP2012142549A JP 2012142549 A JP2012142549 A JP 2012142549A JP 2011165264 A JP2011165264 A JP 2011165264A JP 2011165264 A JP2011165264 A JP 2011165264A JP 2012142549 A JP2012142549 A JP 2012142549A
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Japan
Prior art keywords
support
thin substrate
chuck
vacuum
thin
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Pending
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JP2011165264A
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English (en)
Japanese (ja)
Inventor
Yung-Soo Kim
キム・ユン・ス
Do-Sun Jeong
ジョン・ド・スン
Yong-Do Kwon
クォン・ヨン・ド
Jin-Gu Kim
キム・ジン・グ
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2012142549A publication Critical patent/JP2012142549A/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2011165264A 2010-12-29 2011-07-28 薄型基板用支持体脱着設備及びその脱着方法 Pending JP2012142549A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0137732 2010-12-29
KR1020100137732A KR101175918B1 (ko) 2010-12-29 2010-12-29 박형 기판용 지지체 탈부착 설비 및 그에 의한 탈착 방법

Publications (1)

Publication Number Publication Date
JP2012142549A true JP2012142549A (ja) 2012-07-26

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JP2011165264A Pending JP2012142549A (ja) 2010-12-29 2011-07-28 薄型基板用支持体脱着設備及びその脱着方法

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JP (1) JP2012142549A (zh)
KR (1) KR101175918B1 (zh)
TW (1) TW201230168A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021126580A1 (en) * 2019-12-17 2021-06-24 Uniqarta, Inc. Adhesive tapes for receiving discrete components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0839377A (ja) * 1994-07-29 1996-02-13 Ckd Corp 真空チャック装置からのワークの取り外し方法及びワークの取り外し装置
JP2009170761A (ja) * 2008-01-18 2009-07-30 Shin Etsu Polymer Co Ltd 基板体の貼着装置及び基板体の取り扱い方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674033B1 (ko) * 2004-01-30 2007-01-26 엘지전자 주식회사 증착 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0839377A (ja) * 1994-07-29 1996-02-13 Ckd Corp 真空チャック装置からのワークの取り外し方法及びワークの取り外し装置
JP2009170761A (ja) * 2008-01-18 2009-07-30 Shin Etsu Polymer Co Ltd 基板体の貼着装置及び基板体の取り扱い方法

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Publication number Publication date
TW201230168A (en) 2012-07-16
KR20120075851A (ko) 2012-07-09
KR101175918B1 (ko) 2012-08-22

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