JP2012142549A - Thin substrate support body attachment/removal equipment and attachment/removal methods of in the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide thin substrate support body attachment/removal equipment and attachment/removal methods of the same.SOLUTION: Thin substrate support body attachment/removal equipment includes a body 100, a cylinder 110 provided in the body 100 and driven in a vertical direction, a vacuum chamber 120 provided on the body 100, a vacuum chuck 130 connected on the cylinder 110 in the vacuum chamber 120 and in which a support body 10 is provided, a porous chuck 140 provided on a support base provided on the body part 100 and to which a thin substrate 30 is connected. This structure minimizes the damage to the thin substrate 30 in a process where the thin substrate 30 is attached to/removed from the support body 10.

Description

  The present invention relates to a support for detaching a substrate for a thin substrate and a method for detaching the same, and more specifically, a main body, a cylinder provided inside the main body and driven in the vertical direction, a vacuum chamber provided on the main body, An apparatus comprising: a vacuum chuck coupled to the cylinder in the vacuum chamber and provided with a support; and a porous chuck provided on a support base provided on the main body and coupled with a thin substrate. The present invention relates to an apparatus and a method for minimizing damage to the thin substrate in the process of detaching the thin substrate and the support.

  The manufacturing process for producing semiconductor elements includes a “pre-process” in which a chip is formed by processing a wafer substrate, an “assembly process” in which a lead wire is attached to the chip and a packaging operation is performed. It is roughly divided into “inspection process”.

  Among these, in the “assembly process” in which lead wires are attached to a finished wafer substrate for packaging, damage is likely to occur during the process of detaching the wafer substrate from the equipment support, particularly in the WLP process. .

  On the other hand, in general, a wafer substrate using silicon has been used, but recently, an organic material has been studied as a material for a thin substrate.

JP 2009-060039 A JP 2010-177034 A

  However, the semiconductor wafer substrate made of the organic material is more likely to be warped and damaged. Therefore, there is an inconvenience in the progress of the semiconductor process, and there is a need for a semiconductor wafer substrate support desorbing facility and its desorbing method for improving processability. As a result, in the WLP process, not only a wafer substrate but also a thin substrate can be used, and a substrate support attaching / detaching apparatus and method thereof are required.

  The present invention has been made in view of the above problems, and includes a main body, a cylinder provided inside the main body and driven in the vertical direction, a vacuum chamber provided on the main body, and an inside of the vacuum chamber. By using an apparatus constituted by a vacuum chuck coupled on the cylinder and provided with a support, and a porous chuck provided on a support base provided on the main body and coupled with a thin substrate. An object of the present invention is to provide an apparatus and method for minimizing damage to a thin substrate in the process of detaching the thin substrate and the support.

  In order to solve the above-described object, a support for attaching and detaching a thin substrate according to a preferred embodiment of the present invention includes a main body, a cylinder provided inside the main body and driven in the vertical direction, and a vacuum provided on the main body. A chamber, a vacuum chuck coupled on the cylinder and provided with a support in the vacuum chamber, and a porous chuck provided on a support base provided on the main body and coupled with a thin substrate. Consists of including.

  The porous chuck may include a porous material.

  The vacuum chuck may have a vacuum region on an upper surface thereof.

  The vacuum chuck may include an air injection port on one side of the upper surface thereof.

  In order to solve the above object, a thin substrate support removing method according to another preferred embodiment of the present invention is a method for removing a thin substrate coupled to a support supported by a vacuum chuck. And a step of mounting the substrate on a perforated chuck and sucking air, and a step of jetting air to separate the substrate and the support.

  The porous chuck may include a porous material.

  The vacuum chuck may have a vacuum region on an upper surface thereof.

  The vacuum chuck may include an air injection port on one side of the upper surface thereof.

  The step of separating the support and the substrate may further include a step of tilting the vacuum chuck from one side.

  According to the present invention, it is possible to minimize the warping and damage phenomenon of the thin substrate in the WLP process and to easily attach and detach the thin substrate.

It is a front view which shows the support body removal | desorption equipment for thin substrates of this invention. It is a top view of the vacuum chuck of the support body removal | desorption apparatus for thin substrates of this invention, Comprising: It is a figure which shows a vacuum area | region. It is a top view of the vacuum chuck of the support body removal | desorption apparatus for thin substrates of this invention, Comprising: It is a figure which shows an air injection area | region. It is a top view which shows the state with which the support body and the reproduction | regeneration tape which were attached to the vacuum chuck of the support body removal | desorption apparatus for thin substrates of this invention were couple | bonded. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention. It is sectional drawing which shows the removal | desorption method using the support body removal | desorption apparatus for thin substrates of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Each embodiment shown below is given as an example so that those skilled in the art can sufficiently communicate the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, but can be embodied in other forms. In the drawings, the size and thickness of the device can be exaggerated for convenience. Like reference numerals refer to like elements throughout the specification.

  The terminology used herein is for the purpose of describing embodiments and is not intended to limit the invention. In this specification, the singular includes the plural unless specifically stated otherwise. As used herein, a component, step, operation, and / or element referred to as “comprising” does not exclude the presence or addition of one or more other components, steps, operations, and / or elements. I want you to understand.

  Hereinafter, with reference to the accompanying drawings, a thin substrate support detachment facility and a detachment method thereof according to a preferred embodiment of the present invention will be described.

[Thin substrate support desorption equipment]
FIG. 1 is a front view of a support for attaching and detaching a thin substrate according to the present invention. As shown in the figure, the equipment according to the present invention includes a main body 100, a cylinder 110, a vacuum chamber 120, a vacuum chuck 130, and a perforated chuck 140.

  Specifically, the support for attaching and detaching a thin substrate according to the present invention includes a main body 100, a cylinder 110 provided in the main body 100 and driven in the vertical direction, a vacuum chamber 120 provided on the main body 100, A vacuum chuck 130 provided on the cylinder 110 and provided with the support 10 in the vacuum chamber 120, and a porous chuck 140 provided on a support table provided on the main body 100 and connected with the thin substrate. Consists of.

  The main body 100 functions to support the thin substrate support / removal facility of the present invention.

  The cylinder 110 is provided inside the main body 100 and is driven in the vertical direction, whereby the vacuum chuck 130 coupled to the cylinder 110 is driven in the vertical direction, and the support 10 supported thereby is thin. Desorption from the substrate (not shown in FIG. 1) 30 can be performed smoothly.

  The support 10 improves the warpage phenomenon of the thin substrate in the apparatus of the present invention to facilitate the progress of the process, and can ensure the progress of the process such as metal, ceramics, and glass polymer. Any material can be used.

  Recycled tape (not shown in FIG. 1) 20 is attached to the support 10. The recycled tape 20 may be a recycled material that functions to connect the support 10 and the mask layer of the thin substrate 30 to each other and can be desorbed several times.

  The vacuum chamber 120 is provided in the main body 100 and functions to form a space so that the process of detaching the thin substrate 30 and the support 10 is performed in a vacuum state. In particular, bubbles at the interface are minimized during the adhesion process between the thin substrate 30 and the support 10.

  The vacuum chuck 130 is coupled to the cylinder 110 in the vacuum chamber 120 and is provided with a support 10 so that the thin substrate 30 and the support 10 can be vacuum-laminated in an adhesion process. Create a vacuum environment.

  Here, the vacuum chuck 130 is supported by a lower fixed frame 131 connected to the cylinder 110. The lower fixing frame 131 is formed with a through portion, and the vacuum chuck 130 is fixed by the penetration pin 132 passing through the through portion. A constant space 133 in which the penetrating pin 132 can move is present on one side of the penetrating portion, and the vacuum chuck 130 can be tilted.

  The porous chuck 140 is a member that is provided on a support base provided on the main body 100 and to which the thin substrate 30 is coupled. When the support 10 and the thin substrate 30 are attached, the porous chuck 140 The chuck 140 is separated from the thin substrate 30, and when the support 10 and the thin substrate 30 are detached, the perforated chuck 140 is attached to the thin substrate 30.

  The porous chuck 140 is preferably made of a porous material in order to minimize damage to the thin substrate 30.

  FIG. 2 a is a plan view showing a vacuum region of the vacuum chuck 130, and FIG. 2 b is a plan view showing an air injection region of the vacuum chuck 130.

  First, as shown in FIG. 2 a, a vacuum region 134 is formed on the upper surface of the vacuum chuck 130. As described above, vacuum laminating is performed through the vacuum region 134 in the attaching process of the support 10 and the thin substrate 30. Here, the vacuum region 134 is not limited thereto, and various modifications are possible and are obvious to those skilled in the art.

  In addition, as shown in FIG. 2 b, an air injection port 135 is formed on the upper surface of the vacuum chuck 130. The air injection port 135 damages the thin substrate 30 by injecting air from the vacuum chuck 130 to the thin substrate 30 through the support 10 in the process of detaching the support 10 and the thin substrate 30. And to facilitate desorption. In the support 10, pores 11 as shown in FIG. 3 are formed so that the air coming out from the air injection port 135 passes therethrough.

  In particular, the air injection port 135 is provided only on one side of the vacuum chuck 130. In this case, air injection is performed only on the one side, and the vacuum chuck 130 is attached to and detached from the thin substrate 30 while being tilted. Therefore, damage to the thin substrate 30 is minimized and attachment / detachment is easily performed.

  On the other hand, as described above, the recycled tape 20 is attached to the upper portion of the support 10. As shown in FIG. 3, a certain open region 21 is formed on the recycled tape 20 so that the pores 11 provided in the support 10 are exposed.

[Thin substrate support removal method]
4a to 4f are cross-sectional views showing a desorption method using the thin substrate support desorption facility of the present invention.

  Prior to the desorption process, the attachment process, which is a prerequisite for this, will be described. First, the support 10 and the thin substrate 30 to which the recycled tape 20 is attached are mounted on the vacuum chuck 130 and the porous chuck 140, respectively (FIG. 4a). ).

  Subsequently, pressure is applied to the vacuum chuck 130 to vacuum laminate the support 10 to which the recycled tape 20 is attached and the thin substrate 30. Vacuum laminating is performed through a vacuum region 134 formed on the upper surface of the vacuum chuck 130 (FIG. 4b).

  Subsequently, the thin substrate 30 is separated from the porous chuck 140, and the thin substrate 30 is attached to the upper part of the support 10 to which the recycled tape 20 is attached (FIG. 4c). The thin substrate 30 is separated from the perforated chuck 140, and the thin substrate 30 is attached to the support 10 by the recycled tape 20 attached to the support 10, thereby completing the attaching process.

  Next, the desorption process of the present invention will be described. First, the thin substrate 30 is mounted on the porous chuck 140 and sucked (FIG. 4d). As described above, since the porous chuck 140 is made of a porous material, intake can be performed. Through such an intake process, the thin substrate 30 is well attached to the porous chuck 140, and the thin substrate 30 is easily detached from the support 10.

  Subsequently, air is ejected through the air ejection port 135 of the vacuum chuck 130 to separate the thin substrate 30 and the support 10 to which the regenerated tape 20 is attached, thereby completing the desorption process (FIG. 4e and FIG. 4). 4f). Since the vacuum chuck 130 includes an air injection port 135 on one side and air is injected from only one side through the air injection port 135, the vacuum chuck 130 is inclined from one side as shown in FIG. Desorption is easy without damage.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

DESCRIPTION OF SYMBOLS 10 Support body 20 Recycled tape 30 Thin substrate 100 Main body 110 Cylinder 120 Vacuum chamber 130 Vacuum chuck 140 Porous chuck

Claims (9)

The body,
A cylinder provided inside the main body and driven in the vertical direction;
A vacuum chamber provided on the body;
A vacuum chuck coupled to the cylinder in the vacuum chamber and provided with a support;
A porous chuck provided on a support base provided on the main body and to which a thin substrate is coupled;
Equipment for attaching and detaching a support for thin substrates.   2. The thin substrate support / removal facility according to claim 1, wherein the porous chuck contains a porous material.   The thin-film substrate support attaching / detaching facility according to claim 1, wherein the vacuum chuck has a vacuum region on an upper surface thereof.   The said vacuum chuck is a support body removal | desorption apparatus for thin substrates of Claim 1 which equips the upper surface with the air injection port. In a method for attaching and detaching a thin substrate coupled with a support supported by a vacuum chuck,
Mounting the substrate on a perforated chuck and sucking air;
Injecting air to separate the substrate and the support;
A method for detaching and supporting a thin substrate.   The thin substrate support removing method according to claim 5, wherein the porous chuck contains a porous material.   The thin substrate support removing method according to claim 5, wherein the vacuum chuck has a vacuum region on an upper surface thereof.   The thin substrate support removing method according to claim 5, wherein the vacuum chuck includes an air injection port on one side of an upper surface thereof.   6. The thin substrate support body detaching method according to claim 5, wherein the step of separating the support body and the substrate includes a step of tilting the vacuum chuck from one side.

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