JP2012126999A5 - - Google Patents

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Publication number
JP2012126999A5
JP2012126999A5 JP2011270791A JP2011270791A JP2012126999A5 JP 2012126999 A5 JP2012126999 A5 JP 2012126999A5 JP 2011270791 A JP2011270791 A JP 2011270791A JP 2011270791 A JP2011270791 A JP 2011270791A JP 2012126999 A5 JP2012126999 A5 JP 2012126999A5
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JP
Japan
Prior art keywords
metal
bifluoride
semiconductor wafer
silver
acid
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Application number
JP2011270791A
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English (en)
Japanese (ja)
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JP2012126999A (ja
JP5868155B2 (ja
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Publication of JP2012126999A publication Critical patent/JP2012126999A/ja
Publication of JP2012126999A5 publication Critical patent/JP2012126999A5/ja
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Publication of JP5868155B2 publication Critical patent/JP5868155B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011270791A 2010-12-13 2011-12-12 半導体の電気化学エッチング Expired - Fee Related JP5868155B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42259710P 2010-12-13 2010-12-13
US61/422,597 2010-12-13

Publications (3)

Publication Number Publication Date
JP2012126999A JP2012126999A (ja) 2012-07-05
JP2012126999A5 true JP2012126999A5 (enExample) 2015-12-24
JP5868155B2 JP5868155B2 (ja) 2016-02-24

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ID=45497721

Family Applications (1)

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JP2011270791A Expired - Fee Related JP5868155B2 (ja) 2010-12-13 2011-12-12 半導体の電気化学エッチング

Country Status (7)

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US (2) US8603314B2 (enExample)
EP (1) EP2463410B1 (enExample)
JP (1) JP5868155B2 (enExample)
KR (1) KR20120065958A (enExample)
CN (1) CN102623324B (enExample)
SG (1) SG182081A1 (enExample)
TW (1) TWI493615B (enExample)

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CN110148581B (zh) * 2018-02-10 2022-05-17 姜富帅 一种金属-半导体的金属化工艺及方法
CN109770438B (zh) * 2019-03-25 2023-07-25 云南中烟工业有限责任公司 一种镀膜硅基电子烟雾化芯片及其制备方法
CN118825128A (zh) * 2024-06-27 2024-10-22 浙江省冶金产品质量检验站有限公司 一种用于增强晶硅太阳能电池电镀铜粘附力的表面处理方法

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