JP2012106486A5 - - Google Patents
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- JP2012106486A5 JP2012106486A5 JP2011221797A JP2011221797A JP2012106486A5 JP 2012106486 A5 JP2012106486 A5 JP 2012106486A5 JP 2011221797 A JP2011221797 A JP 2011221797A JP 2011221797 A JP2011221797 A JP 2011221797A JP 2012106486 A5 JP2012106486 A5 JP 2012106486A5
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- JP
- Japan
- Prior art keywords
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- polymer
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- supported
- following formulas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000642 polymer Polymers 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 3
- 238000000926 separation method Methods 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 125000001174 sulfone group Chemical group 0.000 claims 2
- BVNWQSXXRMNYKH-UHFFFAOYSA-N 4-phenyl-2h-benzotriazole Chemical group C1=CC=CC=C1C1=CC=CC2=C1NN=N2 BVNWQSXXRMNYKH-UHFFFAOYSA-N 0.000 claims 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical group C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 150000001555 benzenes Chemical group 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- -1 condensed ring Chemical group 0.000 claims 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical group C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 125000000468 ketone group Chemical group 0.000 claims 1
- 125000005647 linker group Chemical group 0.000 claims 1
- 125000003375 sulfoxide group Chemical group 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011221797A JP5580800B2 (ja) | 2010-10-29 | 2011-10-06 | 積層体、およびその積層体の分離方法 |
| KR1020137012957A KR101452671B1 (ko) | 2010-10-29 | 2011-10-19 | 적층체, 및 그 적층체의 분리 방법 |
| PCT/JP2011/074048 WO2012056969A1 (ja) | 2010-10-29 | 2011-10-19 | 積層体、およびその積層体の分離方法 |
| US13/880,803 US9682532B2 (en) | 2010-10-29 | 2011-10-19 | Laminated body and method for separating laminated body |
| TW100138889A TWI462835B (zh) | 2010-10-29 | 2011-10-26 | 積層體及分離該積層體之方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010243147 | 2010-10-29 | ||
| JP2010243147 | 2010-10-29 | ||
| JP2011221797A JP5580800B2 (ja) | 2010-10-29 | 2011-10-06 | 積層体、およびその積層体の分離方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012106486A JP2012106486A (ja) | 2012-06-07 |
| JP2012106486A5 true JP2012106486A5 (show.php) | 2014-07-10 |
| JP5580800B2 JP5580800B2 (ja) | 2014-08-27 |
Family
ID=45993682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011221797A Active JP5580800B2 (ja) | 2010-10-29 | 2011-10-06 | 積層体、およびその積層体の分離方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9682532B2 (show.php) |
| JP (1) | JP5580800B2 (show.php) |
| KR (1) | KR101452671B1 (show.php) |
| TW (1) | TWI462835B (show.php) |
| WO (1) | WO2012056969A1 (show.php) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5864926B2 (ja) * | 2011-07-14 | 2016-02-17 | 東京応化工業株式会社 | 積層体、分離方法、及び製造方法 |
| US9576685B2 (en) | 2012-04-26 | 2017-02-21 | Ge-Hitachi Nuclear Energy Americas Llc | Fuel bundle for a liquid metal cooled nuclear reactor |
| JP6006569B2 (ja) * | 2012-07-23 | 2016-10-12 | 東京応化工業株式会社 | 積層体及び積層体の製造方法 |
| WO2014037829A1 (en) | 2012-09-05 | 2014-03-13 | Koninklijke Philips N.V. | Laser de-bond of carrier wafer from device wafer |
| JP6261508B2 (ja) * | 2012-09-28 | 2018-01-17 | 東京応化工業株式会社 | 積層体、積層体の分離方法、および分離層の評価方法 |
| JP6162976B2 (ja) * | 2013-02-26 | 2017-07-12 | 東京応化工業株式会社 | 基板の処理方法 |
| JP6114596B2 (ja) * | 2013-03-26 | 2017-04-12 | 富士フイルム株式会社 | 半導体装置製造用仮接合用積層体、および、半導体装置の製造方法 |
| JP6216727B2 (ja) * | 2014-05-08 | 2017-10-18 | 東京応化工業株式会社 | 支持体分離方法 |
| WO2016014648A2 (en) * | 2014-07-22 | 2016-01-28 | Brewer Science Inc. | Polyimides as laser release materials for 3-d ic applications |
| KR20170133345A (ko) * | 2015-03-30 | 2017-12-05 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 전자 디바이스 및 전자 디바이스의 제조 방법 |
| WO2017056662A1 (ja) * | 2015-09-28 | 2017-04-06 | Jsr株式会社 | 対象物の処理方法、仮固定用組成物、半導体装置及びその製造方法 |
| JP6524972B2 (ja) * | 2015-09-28 | 2019-06-05 | Jsr株式会社 | 対象物の処理方法、仮固定用組成物、半導体装置及びその製造方法 |
| DE102015118742A1 (de) | 2015-11-02 | 2017-05-04 | Ev Group E. Thallner Gmbh | Verfahren zum Bonden und Lösen von Substraten |
| JP2017103406A (ja) * | 2015-12-04 | 2017-06-08 | 株式会社ディスコ | ウエーハの加工方法 |
| HUE051753T2 (hu) * | 2017-01-26 | 2021-03-29 | Gross Leander Kilian | Eljárás és berendezés kompozit komponens különbözõ anyagrétegeinek szétválasztására |
| JP6743738B2 (ja) * | 2017-03-27 | 2020-08-19 | 信越化学工業株式会社 | 積層体及びその製造方法 |
| US10403598B2 (en) * | 2017-08-11 | 2019-09-03 | Micron Technology, Inc. | Methods and system for processing semiconductor device structures |
| JP6879158B2 (ja) * | 2017-10-03 | 2021-06-02 | 信越化学工業株式会社 | 半導体装置及びその製造方法、並びに積層体 |
| EP3706156A4 (en) | 2017-11-01 | 2021-12-15 | Nissan Chemical Corporation | LAMINATED BODY WITH NOVOLAK RESIN AS A COATING LAYER |
| JP7633592B2 (ja) | 2018-11-19 | 2025-02-20 | 日産化学株式会社 | 光照射剥離用接着剤組成物及び積層体並びに積層体の製造方法及び剥離方法 |
| US20220073801A1 (en) | 2018-12-27 | 2022-03-10 | Nissan Chemical Corporation | Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method |
| WO2021166905A1 (ja) | 2020-02-21 | 2021-08-26 | 日産化学株式会社 | 積層体及び剥離剤組成物 |
| EP4166324A4 (en) | 2020-06-15 | 2024-07-03 | Nissan Chemical Corporation | LAMINATE, RELEASE AGENT COMPOSITION AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE |
| EP4187575A4 (en) | 2020-07-22 | 2024-08-28 | Nissan Chemical Corporation | Multilayer body, release agent composition, and method for producing processed semiconductor substrate |
| EP4205967A4 (en) | 2020-08-27 | 2024-10-09 | Nissan Chemical Corporation | LAMINATE AND RELEASE AGENT COMPOSITION |
| JP7560991B2 (ja) | 2020-10-15 | 2024-10-03 | 日鉄ケミカル＆マテリアル株式会社 | 接着剤層形成用組成物、積層体の製造方法および処理方法 |
| JP7517942B2 (ja) | 2020-10-15 | 2024-07-17 | 日鉄ケミカル＆マテリアル株式会社 | 積層体の製造方法および処理方法、当該製造方法および処理方法で用いる感光性樹脂組成物 |
| WO2022210262A1 (ja) | 2021-03-31 | 2022-10-06 | 日産化学株式会社 | 積層体、剥離剤組成物及び加工された半導体基板の製造方法 |
| EP4310157A4 (en) | 2021-03-31 | 2025-12-03 | Nissan Chemical Corp | LAMINATE, ANTI-STICK AGENT COMPOSITION, AND METHOD FOR MANUFACTURING A MACHINED SEMICONDUCTOR SUBSTRATE |
| KR20220136129A (ko) | 2021-03-31 | 2022-10-07 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 접착제층 형성용 조성물, 적층체, 적층체의 제조 방법 및 적층체의 처리 방법 |
| US20240208179A1 (en) | 2021-03-31 | 2024-06-27 | Nissan Chemical Corporation | Laminate, release agent composition, and method for manufacturing processed semiconductor substrate |
| JP2023008789A (ja) * | 2021-07-02 | 2023-01-19 | 日鉄ケミカル＆マテリアル株式会社 | 接着剤層形成用組成物、積層体、積層体の製造方法および積層体の処理方法 |
| EP4415023A4 (en) | 2021-10-29 | 2025-11-05 | Nissan Chemical Corp | LAMINATE, ANTI-ADHESIVE AGENT COMPOSITION AND PROCESS FOR MANUFACTURING TREATMENTED SEMICONDUCTIVE SUBSTRATE |
| KR20230147535A (ko) | 2022-04-14 | 2023-10-23 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 수지 조성물, 적층체의 제조 방법, 적층체 및 처리 방법 |
| WO2023234155A1 (ja) | 2022-06-02 | 2023-12-07 | 日産化学株式会社 | 光照射剥離用の接着剤組成物、積層体、及び加工された半導体基板の製造方法 |
| WO2023243475A1 (ja) | 2022-06-17 | 2023-12-21 | 日産化学株式会社 | 光照射剥離用の接着剤組成物、積層体、及び加工された半導体基板又は電子デバイス層の製造方法 |
| JPWO2023248872A1 (show.php) | 2022-06-20 | 2023-12-28 | ||
| TW202409750A (zh) | 2022-08-29 | 2024-03-01 | 日商日產化學股份有限公司 | 光照射剝離用之剝離劑組成物、積層體、及加工後之半導體基板之製造方法 |
| JPWO2024062974A1 (show.php) | 2022-09-22 | 2024-03-28 | ||
| JPWO2024128199A1 (show.php) | 2022-12-14 | 2024-06-20 | ||
| JPWO2024128279A1 (show.php) | 2022-12-15 | 2024-06-20 | ||
| KR20240103997A (ko) | 2022-12-27 | 2024-07-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | (메타)아크릴 공중합체 및 그 제조 방법 |
| KR20240104004A (ko) | 2022-12-27 | 2024-07-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 접착제층 형성용 조성물, 적층체, 접착제층의 제조 방법, 적층체의 제조 방법 및 적층체의 처리 방법 |
| EP4685840A1 (en) | 2023-03-23 | 2026-01-28 | Nissan Chemical Corporation | Release agent composition for photoirradiation release, layered product, and method for producing processed semiconductor substrate |
| JP2025004565A (ja) | 2023-06-26 | 2025-01-15 | 日鉄ケミカル＆マテリアル株式会社 | 接着剤層形成用組成物、積層体、積層体の製造方法および積層体の処理方法 |
| CN119529732A (zh) | 2023-08-31 | 2025-02-28 | 日铁化学材料株式会社 | 接着剂层形成用组合物、层叠体、层叠体的制造方法及处理方法 |
| KR20250148409A (ko) | 2024-03-28 | 2025-10-14 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | (메트)아크릴 공중합체, 접착제층 형성용 조성물, 적층체, 접착제층의 제조 방법, 적층체의 제조 방법 및 적층체의 처리 방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6372608B1 (en) | 1996-08-27 | 2002-04-16 | Seiko Epson Corporation | Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method |
| USRE38466E1 (en) | 1996-11-12 | 2004-03-16 | Seiko Epson Corporation | Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device |
| US6127199A (en) | 1996-11-12 | 2000-10-03 | Seiko Epson Corporation | Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device |
| JP3506357B2 (ja) | 1996-12-13 | 2004-03-15 | 東京応化工業株式会社 | リソグラフィー用下地材 |
| US5948847A (en) | 1996-12-13 | 1999-09-07 | Tokyo Ohka Kogyo Co., Ltd. | Undercoating composition for photolithographic patterning |
| JP2963945B2 (ja) * | 1997-05-08 | 1999-10-18 | 大塚化学株式会社 | ２，２’−ビス（６−ベンゾトリアゾリルフェノール）化合物 |
| JP2002226796A (ja) * | 2001-01-29 | 2002-08-14 | Hitachi Chem Co Ltd | ウェハ貼着用粘着シート及び半導体装置 |
| JP4565804B2 (ja) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
| US7534498B2 (en) | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
| JP5000112B2 (ja) * | 2005-09-09 | 2012-08-15 | 東京応化工業株式会社 | ナノインプリントリソグラフィによるパターン形成方法 |
| JP5063016B2 (ja) * | 2006-03-23 | 2012-10-31 | リンテック株式会社 | 粘着シート及び剥離シート |
-
2011
- 2011-10-06 JP JP2011221797A patent/JP5580800B2/ja active Active
- 2011-10-19 WO PCT/JP2011/074048 patent/WO2012056969A1/ja not_active Ceased
- 2011-10-19 US US13/880,803 patent/US9682532B2/en active Active
- 2011-10-19 KR KR1020137012957A patent/KR101452671B1/ko active Active
- 2011-10-26 TW TW100138889A patent/TWI462835B/zh active
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