JP2012068249A - 積層構造に少なくとも部分的に埋設された微細ばね、および、その製造方法 - Google Patents

積層構造に少なくとも部分的に埋設された微細ばね、および、その製造方法 Download PDF

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Publication number
JP2012068249A
JP2012068249A JP2011207768A JP2011207768A JP2012068249A JP 2012068249 A JP2012068249 A JP 2012068249A JP 2011207768 A JP2011207768 A JP 2011207768A JP 2011207768 A JP2011207768 A JP 2011207768A JP 2012068249 A JP2012068249 A JP 2012068249A
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Japan
Prior art keywords
fine spring
fine
spring
laminated structure
microspring
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JP2011207768A
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Japanese (ja)
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JP2012068249A5 (enExample
Inventor
Eugene M Chow
ユージン・エム・チャウ
Peeters Eric
エリック・ペーテルス
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Palo Alto Research Center Inc
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Palo Alto Research Center Inc
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Publication of JP2012068249A publication Critical patent/JP2012068249A/ja
Publication of JP2012068249A5 publication Critical patent/JP2012068249A5/ja
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    • G01R1/067—Measuring probes
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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