JP2012062987A - 真空断熱材及びその製造方法 - Google Patents
真空断熱材及びその製造方法 Download PDFInfo
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- talc
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000012774 insulation material Substances 0.000 title abstract description 4
- 239000011162 core material Substances 0.000 claims abstract description 126
- 229910052623 talc Inorganic materials 0.000 claims abstract description 77
- 239000000454 talc Substances 0.000 claims abstract description 76
- 239000002734 clay mineral Substances 0.000 claims abstract description 65
- 239000000203 mixture Substances 0.000 claims abstract description 45
- 150000003112 potassium compounds Chemical class 0.000 claims abstract description 39
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims abstract description 30
- 239000005022 packaging material Substances 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910000027 potassium carbonate Inorganic materials 0.000 claims abstract description 15
- 235000011181 potassium carbonates Nutrition 0.000 claims abstract description 15
- 229910001868 water Inorganic materials 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 14
- 235000015497 potassium bicarbonate Nutrition 0.000 claims abstract description 10
- 239000011736 potassium bicarbonate Substances 0.000 claims abstract description 10
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims abstract description 10
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims description 65
- 239000007789 gas Substances 0.000 claims description 44
- 239000002994 raw material Substances 0.000 claims description 26
- 238000010304 firing Methods 0.000 claims description 16
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- 238000009461 vacuum packaging Methods 0.000 claims description 12
- 229940086066 potassium hydrogencarbonate Drugs 0.000 claims description 9
- 239000004088 foaming agent Substances 0.000 claims description 7
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims description 6
- 229910001950 potassium oxide Inorganic materials 0.000 claims description 6
- 125000003368 amide group Chemical group 0.000 claims description 3
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
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- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 3
- 235000019399 azodicarbonamide Nutrition 0.000 description 3
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
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- 229920002647 polyamide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
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- 229910052903 pyrophyllite Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 238000000352 supercritical drying Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
【解決手段】タルク族の粘土鉱物と、炭酸カリウム及び炭酸水素カリウムから選ばれるカリウム化合物と、水とを含む芯材用原料組成物を、所定形状に成形し、タルク族の粘土鉱物の融点よりも低い温度で焼成して、タルク族の粘土鉱物の層状構造がへき開して、その少なくとも一部が部分的に結合している多孔質焼成体からなる芯材を製造し、この芯材をガスバリヤー性の包材で真空包装して真空断熱材を製造する。
【選択図】図5
Description
また、タルクへき開物どうしが部分的に固相反応などにより結合しているので、多孔質焼成体をガスバリヤー性の包材で真空包装しても、カードハウス構造が崩れ難く、高空孔率状態が維持される。
また、真空断熱材が高温に曝されると、包材などからアウトガスが発生することがあるが、アウトガスが発生しても多孔質焼成体に吸着されるので、アウトガスの影響を受けにくく、包材内部の真空度が経時低下し難い。このため、長期にわたって優れた断熱性を維持できる。
まず、芯材の製造方法について説明する。
(実施例1)
タルク(平均粒径14μm)400gと、炭酸水素カリウム(平均粒径50μm)600gと、水200gと、アゾジカルボンアミド50gを混練し、芯材用原料組成物を調製した。この芯材用原料組成物を、厚さ5mmのシート状に圧延成形してグリーンシート(芯材用成形体)を得た。このグリーンシートを電気炉に入れ、900℃で焼成した。焼成したグリーンシート(焼成体)を真空乾燥機に入れ、150℃で2時間真空乾燥を行ったのち、真空乾燥機内で真空を保持したまま、室温まで冷却して芯材を製造した。得られた芯材の電子顕微鏡写真を図2〜5に示す。なお、図2は、芯材の500倍拡大図であり、図3は、図2の範囲aの2000倍拡大図であり、図4は、図3の範囲bの5000倍拡大図であり、図5は、図4の範囲cの10000倍拡大図である。
次に、得られた芯材を、ポリアミド、アルミ箔、ポリエチレンからなるラミネートフィルムを三方製袋したものに入れ、真空チャンバー内で10Pa以下に減圧して真空封止し、真空断熱材を作製した。
得られた真空断熱材の熱伝導率を、熱伝導率計(英弘精機HC−074)を用い、JIS−A1412に基づき、平均温度20〜60℃、温度差20℃の条件で測定した。結果を図6に示す。また、平均温度20℃での熱伝導率は、0.004W/mKであった。
実施例1において、アゾジカルボンアミドを添加しなかった以外は実施例1と同様にして、芯材用原料組成物を調製した。そして、該芯材用原料組成物を用いて実施例1と同様にして真空断熱材を製造した。
得られた真空断熱材の熱伝導率を、熱伝導率計(英弘精機HC−074)を用い、JIS−A1412に基づき、平均温度20〜60℃、温度差20℃の条件で測定した。結果を図6に示す。また、平均温度20℃での熱伝導率は、0.005W/mKであった。
実施例1において、芯材用原料組成物を成形型に投入し、型をプレスにて加圧成型して、グリーンシート(芯材用成形体)を得た。このグリーンシートを用いて実施例1と同様にして真空断熱材を製造した。
得られた真空断熱材の熱伝導率を、熱伝導率計(英弘精機HC−074)を用い、JIS−A1412に基づき、平均温度20℃、温度差20℃の条件で測定したところ、0.006W/mKであった。
ガラス繊維系芯材を、ポリアミド、アルミ箔、ポリエチレンからなるラミネートフィルムで、内圧10Pa以下に真空封止した真空断熱材(商品名「U−Vacua」、パナソニック株式会社製)の熱伝導率を、熱伝導率計(英弘精機HC−074)を用い、JIS−A1412に基づき、平均温度20〜60℃、温度差20℃の条件で測定した。結果を図6に示す。また、平均温度20℃での熱伝導率は、0.004W/mKであった。
一方、実施例1,2の真空断熱材は、雰囲気温度が増加しても、熱伝導率は殆ど変化が無く、高温環境下での断熱性に優れるものであった。
実施例1において、タルク(平均粒径14μm)と、炭酸水素カリウム(平均粒径50μm)とを、表1に示す割合で変化させて、試料1〜11の芯材用原料組成物を調製した。そして、該芯材用原料組成物を用いて実施例1と同様にして真空断熱材を製造した。
Claims (14)
- タルク族の粘土鉱物の層状構造がへき開して、その少なくとも一部が部分的に結合している多孔質焼成体を芯材とし、この芯材がガスバリヤー性の包材で真空包装されていることを特徴とする真空断熱材。
- 前記芯材が、タルク族の粘土鉱物を13〜59質量%、カリウム化合物を41〜87質量%含有する請求項1記載の真空断熱材。
- 前記カリウム化合物が、酸化カリウム、炭酸カリウム及び炭酸水素カリウムから選ばれる1種以上である、請求項2記載の真空断熱材。
- 前記芯材の真空包装された状態での嵩密度が、0.22〜1.98g/cm3である請求項1〜3のいずれか記載の真空断熱材。
- 前記芯材の真空包装された状態での芯材の空孔率が、45〜82%である請求項1〜4のいずれか記載の真空断熱材。
- 平均温度20℃における熱伝導率が、0.015W/mK以下である請求項1〜5のいずれか記載の真空断熱材。
- タルク族の粘土鉱物と、炭酸カリウム及び炭酸水素カリウムから選ばれるカリウム化合物と、水とを含む芯材用原料組成物を所定形状に成形し、前記タルク族の粘土鉱物の融点よりも低い温度で焼成して芯材を製造し、この芯材をガスバリヤー性の包材で真空包装することを特徴とする真空断熱材の製造方法。
- 前記タルク族の粘土鉱物として、平均粒径が1〜25μmのものを用いる請求項7に記載の真空断熱材の製造方法。
- 前記芯材用原料組成物として、固形分中に前記タルク族の粘土鉱物を10〜50質量%、前記カリウム化合物を50〜90質量%含有し、前記タルク族の粘土鉱物と前記カリウム化合物との合計100質量部に対して、水5〜20質量部含有するものを用いる請求項7又は8に記載の真空断熱材の製造方法。
- 前記芯材用原料組成物として、前記タルク族の粘土鉱物と前記カリウム化合物との合計100質量部に対して、アミド基及び/又はアゾ基を有する有機系発泡剤を1〜50質量部含有するものを用いる請求項7〜9のいずれかに記載の真空断熱材の製造方法。
- 前記芯材用原料組成物を、圧延成形した後焼成する請求項7〜10のいずれかに記載の真空断熱材の製造方法。
- 前記芯材用原料組成物を、700〜1000℃で焼成する請求項7〜11のいずれかに記載の真空断熱材の製造方法。
- 前記芯材の嵩密度が、真空包装前の状態で0.2〜1.8g/cm3であり、真空包装した後の状態で0.22〜1.98g/cm3である請求項7〜12のいずれかに記載の真空断熱材の製造方法。
- 前記芯材の空孔率が、真空包装前の状態で50〜90%であり、真空包装した後の状態で45〜82%である請求項7〜13のいずれかに記載の真空断熱材の製造方法。
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JP2012197189A (ja) * | 2011-03-18 | 2012-10-18 | Fuji Electric Co Ltd | 多孔質セラミックスの製造方法、及び真空断熱材 |
JP2014028716A (ja) * | 2012-07-31 | 2014-02-13 | Jgc Catalysts & Chemicals Ltd | 平板状結晶性アルミナ複合酸化物微粒子集合体、平板状結晶性アルミナ複合酸化物微粒子集合体からなる結晶性アルミナ複合酸化物粒子ならびに該平板状結晶性アルミナ複合酸化物微粒子集合体および該結晶性アルミナ複合酸化物粒子の製造方法 |
JP2015081676A (ja) * | 2013-10-24 | 2015-04-27 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 真空断熱材 |
WO2015093378A1 (ja) * | 2013-12-17 | 2015-06-25 | 三井化学株式会社 | 成形体及びその製造方法、α-オレフィン二量化用触媒、並びにα-オレフィン二量体の製造方法 |
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ES2762188T3 (es) * | 2011-02-08 | 2020-05-22 | Ceilook Sl | Composición cerámica |
JP5790325B2 (ja) | 2011-08-30 | 2015-10-07 | 富士電機株式会社 | 真空断熱材の製造方法 |
CN105352881B (zh) * | 2015-12-18 | 2019-03-15 | 青岛科瑞新型环保材料集团有限公司 | 一种真空绝热板及其老化测试系统 |
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