JP2012054578A5 - - Google Patents

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Publication number
JP2012054578A5
JP2012054578A5 JP2011227237A JP2011227237A JP2012054578A5 JP 2012054578 A5 JP2012054578 A5 JP 2012054578A5 JP 2011227237 A JP2011227237 A JP 2011227237A JP 2011227237 A JP2011227237 A JP 2011227237A JP 2012054578 A5 JP2012054578 A5 JP 2012054578A5
Authority
JP
Japan
Prior art keywords
circuit board
bare silicon
silicon chips
creating
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011227237A
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English (en)
Other versions
JP2012054578A (ja
Filing date
Publication date
Priority claimed from US09/295,081 external-priority patent/US6162663A/en
Application filed filed Critical
Publication of JP2012054578A publication Critical patent/JP2012054578A/ja
Publication of JP2012054578A5 publication Critical patent/JP2012054578A5/ja
Withdrawn legal-status Critical Current

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Claims (1)

  1. 複数の裸のシリコンチップが搭載された回路基板のための熱散逸構造を作成する方法であって、
    （ａ） 露出面を有する複数の裸のシリコンチップが搭載された回路板を設ける、
    （ｂ） 内面および外面を有し、平坦な部分の内面が回路板の裸のシリコンチップを帯びる側に面するようにすべく回路板への取付のためにサイズおよび形状が設定された実質的に平坦な部分を有する熱分散体を設ける、
    各ステップを含むことを特徴とする複数の裸のシリコンチップが搭載された回路基板のための熱散逸構造を作成する方法。
JP2011227237A 1999-04-20 2011-10-14 裸のシリコンチップを搭載した回路板からの熱の散逸 Withdrawn JP2012054578A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/295,081 US6162663A (en) 1999-04-20 1999-04-20 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US09/295,081 1999-04-20

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000613001A Division JP5084987B2 (ja) 1999-04-20 2000-04-19 裸のシリコンチップを搭載した回路板からの熱の散逸

Publications (2)

Publication Number Publication Date
JP2012054578A JP2012054578A (ja) 2012-03-15
JP2012054578A5 true JP2012054578A5 (ja) 2013-01-10

Family

ID=23136132

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000613001A Expired - Fee Related JP5084987B2 (ja) 1999-04-20 2000-04-19 裸のシリコンチップを搭載した回路板からの熱の散逸
JP2011227237A Withdrawn JP2012054578A (ja) 1999-04-20 2011-10-14 裸のシリコンチップを搭載した回路板からの熱の散逸

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2000613001A Expired - Fee Related JP5084987B2 (ja) 1999-04-20 2000-04-19 裸のシリコンチップを搭載した回路板からの熱の散逸

Country Status (9)

Country Link
US (1) US6162663A (ja)
EP (1) EP1171914B1 (ja)
JP (2) JP5084987B2 (ja)
KR (1) KR100742521B1 (ja)
AT (1) ATE337614T1 (ja)
DE (1) DE60030267T2 (ja)
MX (1) MXPA01010665A (ja)
TW (1) TW549011B (ja)
WO (1) WO2000063968A1 (ja)

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