USD893484S1 - Thermal control component - Google Patents

Thermal control component Download PDF

Info

Publication number
USD893484S1
USD893484S1 US29/673,181 US201829673181F USD893484S US D893484 S1 USD893484 S1 US D893484S1 US 201829673181 F US201829673181 F US 201829673181F US D893484 S USD893484 S US D893484S
Authority
US
United States
Prior art keywords
control component
thermal control
design
view
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/673,181
Inventor
Daniel G. Scobee
Aleksandr Semenuk
Aswin Thiruvengadam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to US29/673,181 priority Critical patent/USD893484S1/en
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCOBEE, Daniel G., SEMENUK, Aleksandr, THIRUVENGADAM, ASWIN
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT reassignment MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT SUPPLEMENT NO. 12 TO PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Priority to US29/746,237 priority patent/USD954712S1/en
Publication of USD893484S1 publication Critical patent/USD893484S1/en
Application granted granted Critical
Priority to US29/838,660 priority patent/USD995530S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a side perspective view of a thermal control component showing our claimed design.
FIG. 2 is a first side view of our claimed design.
FIG. 3 is a second side view of our claimed design.
FIG. 4 is a third side view of our claimed design.
FIG. 5 is a fourth side view of our claimed design.
FIG. 6 is a top view of our claimed design; and,
FIG. 7 is a bottom view of our claimed design.
The broken lines in the figures show portions of the thermal control component that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a thermal control component, as shown and described.
US29/673,181 2018-12-12 2018-12-12 Thermal control component Active USD893484S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/673,181 USD893484S1 (en) 2018-12-12 2018-12-12 Thermal control component
US29/746,237 USD954712S1 (en) 2018-12-12 2020-08-12 Thermal control component
US29/838,660 USD995530S1 (en) 2018-12-12 2022-05-13 Thermal control component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/673,181 USD893484S1 (en) 2018-12-12 2018-12-12 Thermal control component

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/746,237 Division USD954712S1 (en) 2018-12-12 2020-08-12 Thermal control component

Publications (1)

Publication Number Publication Date
USD893484S1 true USD893484S1 (en) 2020-08-18

Family

ID=71995443

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/673,181 Active USD893484S1 (en) 2018-12-12 2018-12-12 Thermal control component
US29/746,237 Active USD954712S1 (en) 2018-12-12 2020-08-12 Thermal control component
US29/838,660 Active USD995530S1 (en) 2018-12-12 2022-05-13 Thermal control component

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/746,237 Active USD954712S1 (en) 2018-12-12 2020-08-12 Thermal control component
US29/838,660 Active USD995530S1 (en) 2018-12-12 2022-05-13 Thermal control component

Country Status (1)

Country Link
US (3) USD893484S1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1230184A (en) 1983-11-29 1987-12-08 Toshiyuki Saito Liquid cooling type high frequency solid state device
US5390077A (en) 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US6064572A (en) 1996-11-27 2000-05-16 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
KR100317829B1 (en) 1999-03-05 2001-12-22 윤종용 Thermoelectric-cooling temperature control apparatus for semiconductor manufacturing process facilities
US6162663A (en) 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon
WO2001059363A1 (en) 2000-02-10 2001-08-16 Light And Sound Design, Inc. Super cooler for a heat producing device
US6505468B2 (en) 2000-03-21 2003-01-14 Research Triangle Institute Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications
US6820684B1 (en) 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader
US20050045702A1 (en) 2003-08-29 2005-03-03 William Freeman Thermoelectric modules and methods of manufacture
US20080178920A1 (en) 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
EP1959262A1 (en) 2007-02-19 2008-08-20 Eles Semiconductor Equipment S.P.A. Test of electronic devices using boards without sockets
KR100899142B1 (en) 2007-07-05 2009-05-27 삼성전자주식회사 Test socket
KR100918315B1 (en) 2007-09-04 2009-09-18 한국생산기술연구원 Cooling System For A Computer By Using A Thermoelectric Module
US7832944B2 (en) 2007-11-08 2010-11-16 Finisar Corporation Optoelectronic subassembly with integral thermoelectric cooler driver
US20100053868A1 (en) 2008-08-28 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8904808B2 (en) 2009-07-17 2014-12-09 Sheetak, Inc. Heat pipes and thermoelectric cooling devices
US9134054B2 (en) 2010-01-06 2015-09-15 Novatrans Group Sa Thermo-electric cooling system and method for cooling electronic devices
TWI443883B (en) 2010-11-29 2014-07-01 Ind Tech Res Inst Thermoelectric generator apparatus with high thermoelectric conversion efficiency
US20120204577A1 (en) 2011-02-16 2012-08-16 Ludwig Lester F Flexible modular hierarchical adaptively controlled electronic-system cooling and energy harvesting for IC chip packaging, printed circuit boards, subsystems, cages, racks, IT rooms, and data centers using quantum and classical thermoelectric materials
KR101836163B1 (en) 2011-04-27 2018-03-09 주식회사 케이엠더블유 Apparatus for releasing heat through heat sink
TWI432737B (en) 2011-07-29 2014-04-01 Atp Electronics Taiwan Inc Test apparatus and method for testing operation performance of electronic module under specified temperature
KR101183690B1 (en) 2011-11-28 2012-09-17 (주)이엔씨테크 Hot/cold test equipment for nand flash memory
US9360514B2 (en) 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US8766656B2 (en) 2012-04-18 2014-07-01 Silicon Turnkey Solutions Inc. Systems and methods for thermal control
US9317083B2 (en) 2013-02-22 2016-04-19 Skyera, Llc Thermal regulation for solid state memory
ITBS20130096A1 (en) 2013-07-05 2015-01-06 Francesco Zaglio DEVICE FOR CONVERSION OF THERMAL ENERGY IN ELECTRICITY
EA036930B1 (en) 2015-07-23 2021-01-15 Сифиид Thermal control device and methods of use
JP6290471B1 (en) * 2017-02-16 2018-03-07 日本特殊陶業株式会社 Electrochemical reaction cell and electrochemical reaction cell stack
US20200194650A1 (en) 2018-12-12 2020-06-18 Micron Technology, Inc. Dual thermoelectric component apparatus with thermal transfer component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Unpublished U.S. Appl. No. 16/218,029, Scobee et al, filed Dec. 12, 2018, 48 pages.

Also Published As

Publication number Publication date
USD995530S1 (en) 2023-08-15
USD954712S1 (en) 2022-06-14

Similar Documents

Publication Publication Date Title
USD862795S1 (en) Cartridge tube
USD851990S1 (en) Oven alignment part
USD900812S1 (en) User interface device
USD909092S1 (en) Pillow
USD917926S1 (en) Pillow
USD890185S1 (en) Joystick module
USD909790S1 (en) Pillow
USD830710S1 (en) Tiltable stool
USD836399S1 (en) Saucer
USD891960S1 (en) Flow monitor
USD832054S1 (en) Plate
USD949019S1 (en) Bottle
USD862233S1 (en) Jar
USD943149S1 (en) Vape
USD899561S1 (en) Bioelectrochemical reactor
USD932897S1 (en) Bottle
USD905907S1 (en) Wax heater
USD851540S1 (en) Drone
USD856981S1 (en) Waveguide for a loudspeaker
USD930941S1 (en) Manlift features
USD843770S1 (en) Collapsible box stove
USD874314S1 (en) Jewelry assembly with removable tile
USD885843S1 (en) Bowl
USD1018197S1 (en) Gas grate
USD828104S1 (en) Saucer

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY