USD893484S1 - Thermal control component - Google Patents
Thermal control component Download PDFInfo
- Publication number
- USD893484S1 USD893484S1 US29/673,181 US201829673181F USD893484S US D893484 S1 USD893484 S1 US D893484S1 US 201829673181 F US201829673181 F US 201829673181F US D893484 S USD893484 S US D893484S
- Authority
- US
- United States
- Prior art keywords
- control component
- thermal control
- design
- view
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in the figures show portions of the thermal control component that form no part of the claimed design.
Claims (1)
- The ornamental design for a thermal control component, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/673,181 USD893484S1 (en) | 2018-12-12 | 2018-12-12 | Thermal control component |
US29/746,237 USD954712S1 (en) | 2018-12-12 | 2020-08-12 | Thermal control component |
US29/838,660 USD995530S1 (en) | 2018-12-12 | 2022-05-13 | Thermal control component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/673,181 USD893484S1 (en) | 2018-12-12 | 2018-12-12 | Thermal control component |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/746,237 Division USD954712S1 (en) | 2018-12-12 | 2020-08-12 | Thermal control component |
Publications (1)
Publication Number | Publication Date |
---|---|
USD893484S1 true USD893484S1 (en) | 2020-08-18 |
Family
ID=71995443
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/673,181 Active USD893484S1 (en) | 2018-12-12 | 2018-12-12 | Thermal control component |
US29/746,237 Active USD954712S1 (en) | 2018-12-12 | 2020-08-12 | Thermal control component |
US29/838,660 Active USD995530S1 (en) | 2018-12-12 | 2022-05-13 | Thermal control component |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/746,237 Active USD954712S1 (en) | 2018-12-12 | 2020-08-12 | Thermal control component |
US29/838,660 Active USD995530S1 (en) | 2018-12-12 | 2022-05-13 | Thermal control component |
Country Status (1)
Country | Link |
---|---|
US (3) | USD893484S1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8039726B2 (en) * | 2005-05-26 | 2011-10-18 | General Electric Company | Thermal transfer and power generation devices and methods of making the same |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1230184A (en) | 1983-11-29 | 1987-12-08 | Toshiyuki Saito | Liquid cooling type high frequency solid state device |
US5390077A (en) | 1994-07-14 | 1995-02-14 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal baffle |
US6064572A (en) | 1996-11-27 | 2000-05-16 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
KR100317829B1 (en) | 1999-03-05 | 2001-12-22 | 윤종용 | Thermoelectric-cooling temperature control apparatus for semiconductor manufacturing process facilities |
US6162663A (en) | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
WO2001059363A1 (en) | 2000-02-10 | 2001-08-16 | Light And Sound Design, Inc. | Super cooler for a heat producing device |
US6505468B2 (en) | 2000-03-21 | 2003-01-14 | Research Triangle Institute | Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications |
US6820684B1 (en) | 2003-06-26 | 2004-11-23 | International Business Machines Corporation | Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader |
US20050045702A1 (en) | 2003-08-29 | 2005-03-03 | William Freeman | Thermoelectric modules and methods of manufacture |
US20080178920A1 (en) | 2006-12-28 | 2008-07-31 | Schlumberger Technology Corporation | Devices for cooling and power |
EP1959262A1 (en) | 2007-02-19 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Test of electronic devices using boards without sockets |
KR100899142B1 (en) | 2007-07-05 | 2009-05-27 | 삼성전자주식회사 | Test socket |
KR100918315B1 (en) | 2007-09-04 | 2009-09-18 | 한국생산기술연구원 | Cooling System For A Computer By Using A Thermoelectric Module |
US7832944B2 (en) | 2007-11-08 | 2010-11-16 | Finisar Corporation | Optoelectronic subassembly with integral thermoelectric cooler driver |
US20100053868A1 (en) | 2008-08-28 | 2010-03-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8904808B2 (en) | 2009-07-17 | 2014-12-09 | Sheetak, Inc. | Heat pipes and thermoelectric cooling devices |
US9134054B2 (en) | 2010-01-06 | 2015-09-15 | Novatrans Group Sa | Thermo-electric cooling system and method for cooling electronic devices |
TWI443883B (en) | 2010-11-29 | 2014-07-01 | Ind Tech Res Inst | Thermoelectric generator apparatus with high thermoelectric conversion efficiency |
US20120204577A1 (en) | 2011-02-16 | 2012-08-16 | Ludwig Lester F | Flexible modular hierarchical adaptively controlled electronic-system cooling and energy harvesting for IC chip packaging, printed circuit boards, subsystems, cages, racks, IT rooms, and data centers using quantum and classical thermoelectric materials |
KR101836163B1 (en) | 2011-04-27 | 2018-03-09 | 주식회사 케이엠더블유 | Apparatus for releasing heat through heat sink |
TWI432737B (en) | 2011-07-29 | 2014-04-01 | Atp Electronics Taiwan Inc | Test apparatus and method for testing operation performance of electronic module under specified temperature |
KR101183690B1 (en) | 2011-11-28 | 2012-09-17 | (주)이엔씨테크 | Hot/cold test equipment for nand flash memory |
US9360514B2 (en) | 2012-04-05 | 2016-06-07 | Board Of Regents, The University Of Texas System | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
US8766656B2 (en) | 2012-04-18 | 2014-07-01 | Silicon Turnkey Solutions Inc. | Systems and methods for thermal control |
US9317083B2 (en) | 2013-02-22 | 2016-04-19 | Skyera, Llc | Thermal regulation for solid state memory |
ITBS20130096A1 (en) | 2013-07-05 | 2015-01-06 | Francesco Zaglio | DEVICE FOR CONVERSION OF THERMAL ENERGY IN ELECTRICITY |
EA036930B1 (en) | 2015-07-23 | 2021-01-15 | Сифиид | Thermal control device and methods of use |
JP6290471B1 (en) * | 2017-02-16 | 2018-03-07 | 日本特殊陶業株式会社 | Electrochemical reaction cell and electrochemical reaction cell stack |
US20200194650A1 (en) | 2018-12-12 | 2020-06-18 | Micron Technology, Inc. | Dual thermoelectric component apparatus with thermal transfer component |
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2018
- 2018-12-12 US US29/673,181 patent/USD893484S1/en active Active
-
2020
- 2020-08-12 US US29/746,237 patent/USD954712S1/en active Active
-
2022
- 2022-05-13 US US29/838,660 patent/USD995530S1/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8039726B2 (en) * | 2005-05-26 | 2011-10-18 | General Electric Company | Thermal transfer and power generation devices and methods of making the same |
Non-Patent Citations (1)
Title |
---|
Unpublished U.S. Appl. No. 16/218,029, Scobee et al, filed Dec. 12, 2018, 48 pages. |
Also Published As
Publication number | Publication date |
---|---|
USD995530S1 (en) | 2023-08-15 |
USD954712S1 (en) | 2022-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |