JP2010028601A5 - - Google Patents
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- JP2010028601A5 JP2010028601A5 JP2008189358A JP2008189358A JP2010028601A5 JP 2010028601 A5 JP2010028601 A5 JP 2010028601A5 JP 2008189358 A JP2008189358 A JP 2008189358A JP 2008189358 A JP2008189358 A JP 2008189358A JP 2010028601 A5 JP2010028601 A5 JP 2010028601A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- circuit pattern
- connection pads
- view
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
図５は、本発明にかかる発振器の背面に設ける面実装端子のパターン例を説明する図であり、図５（ａ）はセラミック基板の背面図、（ｂ）は同じくセラミック基板の断面図である。図５において、符号２３はセラミック基板１に形成されて図１で説明したＩＣチップ５のバンプ６を接続する接続パッドを有する回路パターンである。なお、この回路パターンに設ける上記の接続パッドや関連する回路パターンの表記は省略し、回路パターンを形成する導体として一括図示した。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008189358A JP5183340B2 (ja) | 2008-07-23 | 2008-07-23 | 表面実装型の発振器およびこの発振器を搭載した電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008189358A JP5183340B2 (ja) | 2008-07-23 | 2008-07-23 | 表面実装型の発振器およびこの発振器を搭載した電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010028601A JP2010028601A (ja) | 2010-02-04 |
| JP2010028601A5 true JP2010028601A5 (ja) | 2012-07-12 |
| JP5183340B2 JP5183340B2 (ja) | 2013-04-17 |
Family
ID=41733978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008189358A Expired - Fee Related JP5183340B2 (ja) | 2008-07-23 | 2008-07-23 | 表面実装型の発振器およびこの発振器を搭載した電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5183340B2 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8569876B2 (en) | 2006-11-22 | 2013-10-29 | Tessera, Inc. | Packaged semiconductor chips with array |
| US7791199B2 (en) | 2006-11-22 | 2010-09-07 | Tessera, Inc. | Packaged semiconductor chips |
| CN101675516B (zh) | 2007-03-05 | 2012-06-20 | 数字光学欧洲有限公司 | 具有通过过孔连接到前侧触头的后侧触头的芯片 |
| KR101588723B1 (ko) | 2007-07-31 | 2016-01-26 | 인벤사스 코포레이션 | 실리콘 쓰루 비아를 사용하는 반도체 패키지 공정 |
| US8796135B2 (en) | 2010-07-23 | 2014-08-05 | Tessera, Inc. | Microelectronic elements with rear contacts connected with via first or via middle structures |
| US8791575B2 (en) | 2010-07-23 | 2014-07-29 | Tessera, Inc. | Microelectronic elements having metallic pads overlying vias |
| US9640437B2 (en) | 2010-07-23 | 2017-05-02 | Tessera, Inc. | Methods of forming semiconductor elements using micro-abrasive particle stream |
| US8610259B2 (en) | 2010-09-17 | 2013-12-17 | Tessera, Inc. | Multi-function and shielded 3D interconnects |
| US8847380B2 (en) | 2010-09-17 | 2014-09-30 | Tessera, Inc. | Staged via formation from both sides of chip |
| KR101059490B1 (ko) | 2010-11-15 | 2011-08-25 | 테세라 리써치 엘엘씨 | 임베드된 트레이스에 의해 구성된 전도성 패드 |
| US8587126B2 (en) | 2010-12-02 | 2013-11-19 | Tessera, Inc. | Stacked microelectronic assembly with TSVs formed in stages with plural active chips |
| US8736066B2 (en) | 2010-12-02 | 2014-05-27 | Tessera, Inc. | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip |
| US8637968B2 (en) | 2010-12-02 | 2014-01-28 | Tessera, Inc. | Stacked microelectronic assembly having interposer connecting active chips |
| US8610264B2 (en) | 2010-12-08 | 2013-12-17 | Tessera, Inc. | Compliant interconnects in wafers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002151627A (ja) * | 2000-11-09 | 2002-05-24 | Hitachi Ltd | 半導体装置、その製造方法および実装方法 |
| JP2006019455A (ja) * | 2004-06-30 | 2006-01-19 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| JP2007067173A (ja) * | 2005-08-31 | 2007-03-15 | Kyocera Kinseki Corp | 電子部品 |
| JP2008072321A (ja) * | 2006-09-13 | 2008-03-27 | Tdk Corp | 電子部品 |
| JP4328347B2 (ja) * | 2006-11-10 | 2009-09-09 | ホシデン株式会社 | マイクロホン及びその実装構造 |
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2008
- 2008-07-23 JP JP2008189358A patent/JP5183340B2/ja not_active Expired - Fee Related
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