JP2012046781A - 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 - Google Patents

高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 Download PDF

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JP2012046781A
JP2012046781A JP2010188148A JP2010188148A JP2012046781A JP 2012046781 A JP2012046781 A JP 2012046781A JP 2010188148 A JP2010188148 A JP 2010188148A JP 2010188148 A JP2010188148 A JP 2010188148A JP 2012046781 A JP2012046781 A JP 2012046781A
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substrate
copper plating
plating film
film
electroless
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JP2012046781A5 (https=
Inventor
Masabumi Shibahara
正文 柴原
Koji Honda
孝司 本田
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Hyogo Prefectural Government
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Hyogo Prefectural Government
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  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
JP2010188148A 2010-08-25 2010-08-25 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 Pending JP2012046781A (ja)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122448A (ja) * 2013-12-24 2015-07-02 住友電工プリントサーキット株式会社 フッ素樹脂基材、プリント配線板、生体情報測定デバイス及び人工臓器
CN106567114A (zh) * 2016-11-02 2017-04-19 华南理工大学 一种abs塑料表面喷涂活化的电镀方法
JP2018123261A (ja) * 2017-02-02 2018-08-09 株式会社電子技研 樹脂および樹脂の製造方法
JPWO2018147205A1 (ja) * 2017-02-13 2019-02-14 東洋炭素株式会社 めっきの前処理方法、めっき方法、めっき前処理物及びめっき物
CN113923893A (zh) * 2021-09-23 2022-01-11 华中科技大学 一种大气压下等离子体容性耦合放电镀铜的装置及方法
US11364714B2 (en) * 2013-10-11 2022-06-21 Sumitomo Electric Printed Circuits, Inc. Fluororesin base material, printed wiring board, and circuit module
CN115119393A (zh) * 2022-06-30 2022-09-27 河北光兴半导体技术有限公司 用于化学镀铜的自组装图案化陶瓷基板及其制备方法和应用
KR20230007497A (ko) 2020-07-27 2023-01-12 우시오덴키 가부시키가이샤 불소 수지의 표면 개질 방법, 표면 개질된 불소 수지의 제조 방법, 접합 방법, 표면 개질된 불소 수지를 갖는 재료, 및 접합체
JP2023145402A (ja) * 2022-03-28 2023-10-11 国立大学法人岩手大学 積層体の製造方法、積層体、プリント回路、デバイス回路、および電気電子機器

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US5945486A (en) * 1994-12-09 1999-08-31 Geo-Centers, Inc. Fluoropolymeric substrates with metallized surfaces and methods for producing the same
JP2007150221A (ja) * 2005-10-27 2007-06-14 Fujitsu Ltd 多層回路基板およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945486A (en) * 1994-12-09 1999-08-31 Geo-Centers, Inc. Fluoropolymeric substrates with metallized surfaces and methods for producing the same
JP2007150221A (ja) * 2005-10-27 2007-06-14 Fujitsu Ltd 多層回路基板およびその製造方法

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JPN6014029359; 柴原正文　他３名: '大気圧プラズマ処理によるポリテトラフルオロエチレンの表面改質' 表面技術 Ｖｏｌ．５８　Ｎｏ．７, 20070701, Ｐａｇｅ．４２０-４２４ *
JPN6014029360; ＰＲＩＳＳＡＮＡＲＯＯＮ　Ｗ　他３名: 'Ｅｌｅｃｔｒｏｐｏｌｙｍｅｒｉｚａｔｉｏｎ　ｏｆ　ＤＢＳＡ-ｄｏｐｅｄ　ｐｏｌｙｐｙｒｒｏｌｅ　ｆｉｌｍｓ　ｏｎ　ＰＴＦＥ　ｖｉａ　ａｎ　ｅｌｅｃｔｒｏｌｅｓｓ　ｃｏｐｐｅｒ　ｉｎｔｅｒｌａｙｅｒ' ＳＵＲＦＡＣＥ　ＡＮＤ　ＩＮＴＥＲＦＡＣＥ　ＡＮＡＬＹＳＩＳ Ｖｏｌ．３５　Ｎｏ．１２, 200312, Ｐａｇｅ．９７４-９８３ *
JPN6014029362; ＷＵ　Ｓ　他３名: 'Ｅｌｅｃｔｒｏｌｅｓｓ　Ｄｅｐｏｓｉｔｉｏｎ　ｏｆ　Ｃｏｐｐｅｒ　ｏｎ　Ｓｕｒｆａｃｅ　Ｍｏｄｉｆｉｅｄ　Ｐｏｌｙ（ｔｅｔｒａｆｌｕｏｒｏｅｔｈｙｌｅｎｅ）　Ｆｉｌｍｓ　ｆｒｏｍ　Ｇｒａｆｔ　Ｃｏｐｏ' Ｌａｎｇｍｕｉｒ Ｖｏｌ．１６　Ｎｏ．１１, 20000530, Ｐａｇｅ．５１９２-５１９８ *
JPN6014029364; ＣＨＥＮ　Ｊ-Ｒ，　ＷＡＫＩＤＡ　Ｔ: 'Ｓｔｕｄｉｅｓ　ｏｎ　ｔｈｅ　Ｓｕｒｆａｃｅ　Ｆｒｅｅ　Ｅｎｅｒｇｙ　ａｎｄ　Ｓｕｒｆａｃｅ　Ｓｔｒｕｃｔｕｒｅ　ｏｆ　ＰＴＦＥ　Ｆｉｌｍ　Ｔｒｅａｔｅｄ　ｗｉｔｈ　Ｌｏｗ　Ｔｅｍｐｅｒａｔｕｒｅ' Ｊｏｕｒｎａｌ　ｏｆ　Ａｐｐｌｉｅｄ　Ｐｏｌｙｍｅｒ　Ｓｃｉｅｎｃｅ Ｖｏｌ．６３　Ｎｏ．１３, 19970328, Ｐａｇｅ．１７３３-１７３９ *
JPN6014029365; ＺＨＡＮＧ　Ｍ　Ｃ　他３名: 'Ｅｌｅｃｔｒｏｌｅｓｓ　Ｐｌａｔｉｎｇ　ｏｆ　Ｃｏｐｐｅｒ　ａｎｄ　Ｎｉｃｋｅｌ　ｏｎ　Ｓｕｒｆａｃｅ-Ｍｏｄｉｆｉｅｄ　Ｐｏｌｙ（ｔｅｔｒａｆｌｕｏｒｏｅｔｈｙｌｅｎｅ）　Ｆｉｌｍｓ．' Ｊｏｕｒｎａｌ　ｏｆ　Ｔｈｅ　Ｅｌｅｃｔｒｏｃｈｅｍｉｃａｌ　Ｓｏｃｉｅｔｙ Ｖｏｌ．１４８　Ｎｏ．２, 200102, Ｐａｇｅ．Ｃ７１-Ｃ８０ *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11364714B2 (en) * 2013-10-11 2022-06-21 Sumitomo Electric Printed Circuits, Inc. Fluororesin base material, printed wiring board, and circuit module
JP2015122448A (ja) * 2013-12-24 2015-07-02 住友電工プリントサーキット株式会社 フッ素樹脂基材、プリント配線板、生体情報測定デバイス及び人工臓器
CN106567114A (zh) * 2016-11-02 2017-04-19 华南理工大学 一种abs塑料表面喷涂活化的电镀方法
JP2018123261A (ja) * 2017-02-02 2018-08-09 株式会社電子技研 樹脂および樹脂の製造方法
JPWO2018147205A1 (ja) * 2017-02-13 2019-02-14 東洋炭素株式会社 めっきの前処理方法、めっき方法、めっき前処理物及びめっき物
KR20230007497A (ko) 2020-07-27 2023-01-12 우시오덴키 가부시키가이샤 불소 수지의 표면 개질 방법, 표면 개질된 불소 수지의 제조 방법, 접합 방법, 표면 개질된 불소 수지를 갖는 재료, 및 접합체
US12215210B2 (en) 2020-07-27 2025-02-04 Ushio Denki Kabushiki Kaisha Fluorine resin surface modification method, surface-modified fluorine resin production method, joining method, material having surface-modified fluorine resin, and joined body
CN113923893A (zh) * 2021-09-23 2022-01-11 华中科技大学 一种大气压下等离子体容性耦合放电镀铜的装置及方法
CN113923893B (zh) * 2021-09-23 2023-10-20 华中科技大学 一种大气压下等离子体容性耦合放电镀铜的装置及方法
JP2023145402A (ja) * 2022-03-28 2023-10-11 国立大学法人岩手大学 積層体の製造方法、積層体、プリント回路、デバイス回路、および電気電子機器
CN115119393A (zh) * 2022-06-30 2022-09-27 河北光兴半导体技术有限公司 用于化学镀铜的自组装图案化陶瓷基板及其制备方法和应用

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