JP2012039147A - 1つ又は複数の欠陥関連の機能を遂行するコンピュータ実行方法 - Google Patents
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- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
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Abstract
【解決手段】検査データ中のノイズを識別する一方法は、所定の数よりも少ない数の検査データの組の中で検出される事象を、ノイズとして識別する。欠陥をビン分類する一方法は、欠陥の特性、及び、これらの欠陥が検出された検査データの組に基づいて、これらの欠陥をグループにビン分類する。欠陥解析のために欠陥を選択する一方法は、これらの欠陥の互いの近接性、及び、グループ(1つ又は複数)により形成される空間シグネチャに基づいて、欠陥をこのグループ(1つ又は複数)にビン分類することを含む。欠陥解析のために欠陥を選択する別の方法は、欠陥解析のために、欠陥特性(1つ又は複数)のうち、もっとも多様なものを有する欠陥を選択することを含む。一方法は、試料のために生み出された検査データを、この試料のために生み出された欠陥レビューデータと組み合わせたものを使用して、この試料上の欠陥を分類することを含む。
【選択図】図2
Description
という用語は、検査やレビューなどのプロセスの変数をさすために、本明細書では取り替えて使用される。
Claims (4)
- 欠陥レビュー・プロセスの1つ又は複数のパラメータを選択するコンピュータ実施方法であって、
欠陥レビューのために選択された欠陥の1つ又は複数の特性を決定するステップと、
前記1つ又は複数の特性に基づいて、前記欠陥レビューのために、1プロセスの1つ又は複数のパラメータを選択して、1つ又は複数の異なるパラメータを用いて、前記欠陥の異なるタイプをレビューできるようにするステップと、
を含むコンピュータ実施方法。 - 前記1つ又は複数のパラメータが、1つ又は複数のデータ収集パラメータを含む請求項1に記載の方法。
- 前記1つ又は複数のパラメータが、1つ又は複数のデータ処理パラメータを含む請求項1に記載の方法。
- 前記1つ又は複数の特性に基づいて、前記欠陥タイプの1つ又は複数のために、1つ又は複数のサンプリング・パラメータを選択するステップをさらに含む請求項1に記載の方法。
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US11/146,342 | 2005-06-06 | ||
US11/146,342 US9037280B2 (en) | 2005-06-06 | 2005-06-06 | Computer-implemented methods for performing one or more defect-related functions |
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JP2011229550A Active JP5718786B2 (ja) | 2005-06-06 | 2011-10-19 | 1つ又は複数の欠陥関連の機能を遂行するコンピュータ実行方法 |
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JP (2) | JP5318569B2 (ja) |
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JP5255953B2 (ja) * | 2008-08-28 | 2013-08-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び装置 |
WO2010091307A2 (en) | 2009-02-06 | 2010-08-12 | Kla-Tencor Corporation | Selecting one or more parameters for inspection of a wafer |
KR101732750B1 (ko) * | 2009-07-17 | 2017-05-24 | 케이엘에이-텐코 코포레이션 | 설계 및 결함 데이터를 사용한 스캐너 성능 비교 및 매칭 |
JP5925199B2 (ja) * | 2010-06-30 | 2016-05-25 | ケーエルエー−テンカー コーポレイション | ウェーハ検査または計測設定のためのデータ擾乱 |
US9053390B2 (en) * | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
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WO2014186476A2 (en) * | 2013-05-14 | 2014-11-20 | Kla-Tencor Corporation | Integrated multi-pass inspection |
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US9891275B2 (en) | 2015-06-24 | 2018-02-13 | International Business Machines Corporation | Integrated circuit chip reliability qualification using a sample-specific expected fail rate |
CN107015532B (zh) * | 2017-02-23 | 2018-03-09 | 惠科股份有限公司 | 显示面板在线质量检测方法及装置 |
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US20060287751A1 (en) | 2006-12-21 |
JP5718786B2 (ja) | 2015-05-13 |
WO2006133233A2 (en) | 2006-12-14 |
WO2006133233A3 (en) | 2007-11-22 |
CN101238346B (zh) | 2014-09-03 |
CN101238346A (zh) | 2008-08-06 |
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US9037280B2 (en) | 2015-05-19 |
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