CN101238346B - 用于执行缺陷相关功能的计算机实现的方法 - Google Patents
用于执行缺陷相关功能的计算机实现的方法 Download PDFInfo
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- CN101238346B CN101238346B CN200680029267.7A CN200680029267A CN101238346B CN 101238346 B CN101238346 B CN 101238346B CN 200680029267 A CN200680029267 A CN 200680029267A CN 101238346 B CN101238346 B CN 101238346B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- User Interface Of Digital Computer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/146,342 | 2005-06-06 | ||
US11/146,342 US9037280B2 (en) | 2005-06-06 | 2005-06-06 | Computer-implemented methods for performing one or more defect-related functions |
PCT/US2006/022005 WO2006133233A2 (en) | 2005-06-06 | 2006-06-06 | Computer-implemented methods for performing defect-telated functions |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101238346A CN101238346A (zh) | 2008-08-06 |
CN101238346B true CN101238346B (zh) | 2014-09-03 |
Family
ID=37499067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680029267.7A Active CN101238346B (zh) | 2005-06-06 | 2006-06-06 | 用于执行缺陷相关功能的计算机实现的方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9037280B2 (ja) |
JP (2) | JP5318569B2 (ja) |
CN (1) | CN101238346B (ja) |
WO (1) | WO2006133233A2 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7310585B2 (en) * | 2005-05-12 | 2007-12-18 | International Business Machines Corporation | Method of inspecting integrated circuits during fabrication |
US8135204B1 (en) | 2007-09-21 | 2012-03-13 | Kla-Tencor Technologies Corp. | Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe |
JP5255953B2 (ja) * | 2008-08-28 | 2013-08-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び装置 |
WO2010091307A2 (en) | 2009-02-06 | 2010-08-12 | Kla-Tencor Corporation | Selecting one or more parameters for inspection of a wafer |
JP5719843B2 (ja) * | 2009-07-17 | 2015-05-20 | ケーエルエー−テンカー・コーポレーションKla−Tencor Corporation | 設計データおよび欠陥データを使用したスキャナ性能の比較およびマッチング |
KR101803119B1 (ko) * | 2010-06-30 | 2017-11-29 | 케이엘에이-텐코 코포레이션 | 웨이퍼 검사 또는 계측 구성을 위한 데이터 섭동 |
US9053390B2 (en) * | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
US9310316B2 (en) | 2012-09-11 | 2016-04-12 | Kla-Tencor Corp. | Selecting parameters for defect detection methods |
US8948494B2 (en) * | 2012-11-12 | 2015-02-03 | Kla-Tencor Corp. | Unbiased wafer defect samples |
TWI629469B (zh) * | 2013-05-14 | 2018-07-11 | 美商克萊譚克公司 | 用於整合之多遍檢測之方法、光罩檢測系統及非暫時性電腦可讀媒體 |
US9430824B2 (en) | 2013-05-14 | 2016-08-30 | Kla-Tencor Corporation | Machine learning method and apparatus for inspecting reticles |
US9255877B2 (en) * | 2013-05-21 | 2016-02-09 | Kla-Tencor Corporation | Metrology system optimization for parameter tracking |
US9816939B2 (en) | 2014-07-22 | 2017-11-14 | Kla-Tencor Corp. | Virtual inspection systems with multiple modes |
US9582869B2 (en) * | 2014-10-19 | 2017-02-28 | Kla-Tencor Corp. | Dynamic binning for diversification and defect discovery |
CN104485298A (zh) * | 2014-11-28 | 2015-04-01 | 上海华力微电子有限公司 | 检测采样系统及检测采样方法 |
US9835566B2 (en) * | 2015-03-03 | 2017-12-05 | Kla-Tencor Corp. | Adaptive nuisance filter |
JPWO2016153052A1 (ja) * | 2015-03-26 | 2018-01-18 | 大日本印刷株式会社 | フォトマスクの製造方法および検査装置 |
US9639645B2 (en) | 2015-06-18 | 2017-05-02 | Globalfoundries Inc. | Integrated circuit chip reliability using reliability-optimized failure mechanism targeting |
US9891275B2 (en) | 2015-06-24 | 2018-02-13 | International Business Machines Corporation | Integrated circuit chip reliability qualification using a sample-specific expected fail rate |
CN107015532B (zh) * | 2017-02-23 | 2018-03-09 | 惠科股份有限公司 | 显示面板在线质量检测方法及装置 |
US11668655B2 (en) | 2018-07-20 | 2023-06-06 | Kla Corporation | Multimode defect classification in semiconductor inspection |
CN113013048A (zh) * | 2021-02-24 | 2021-06-22 | 上海华力集成电路制造有限公司 | 晶圆缺陷检测方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5544256A (en) * | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
US6483938B1 (en) * | 1996-05-31 | 2002-11-19 | Texas Instruments Incorporated | System and method for classifying an anomaly |
CN1434981A (zh) * | 2000-04-25 | 2003-08-06 | 东京毅力科创株式会社 | 半导体器件检测系统 |
US6718526B1 (en) * | 2003-02-07 | 2004-04-06 | Kla-Tencor Corporation | Spatial signature analysis |
CN1521822A (zh) * | 2003-01-29 | 2004-08-18 | 力晶半导体股份有限公司 | 缺陷检测参数分析方法 |
CN1770417A (zh) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | 缺陷检测及分类系统的数据分析方法 |
CN1822343A (zh) * | 2005-12-28 | 2006-08-23 | 良率国际贸易(上海)有限公司 | 半导体缺陷信号检测与统计系统及其方法 |
CN1877292A (zh) * | 2005-06-10 | 2006-12-13 | 联华电子股份有限公司 | 缺陷检测方法 |
CN101120329A (zh) * | 2004-10-12 | 2008-02-06 | 恪纳腾技术公司 | 用于分类样品上的缺陷的计算机实现的方法和系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03255292A (ja) | 1990-02-28 | 1991-11-14 | Yamamoto Suiatsu Kogyosho:Kk | ツバ出し成形鋼管の接続方法 |
US5991699A (en) * | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
JP3255292B2 (ja) * | 1996-03-19 | 2002-02-12 | 株式会社日立製作所 | プロセス管理システム |
JP3802716B2 (ja) * | 1999-09-17 | 2006-07-26 | 株式会社日立製作所 | 試料の検査方法及びその装置 |
US6445199B1 (en) * | 1999-12-14 | 2002-09-03 | Kla-Tencor Corporation | Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures |
WO2002049080A2 (en) * | 2000-12-15 | 2002-06-20 | Kla Tencor Corporation | Method and apparatus for inspecting a substrate |
JP2002303586A (ja) | 2001-04-03 | 2002-10-18 | Hitachi Ltd | 欠陥検査方法及び欠陥検査装置 |
WO2002095802A2 (en) | 2001-05-24 | 2002-11-28 | Test Advantage, Inc. | Methods and apparatus for semiconductor testing |
JP3904419B2 (ja) * | 2001-09-13 | 2007-04-11 | 株式会社日立製作所 | 検査装置および検査システム |
WO2003077291A1 (fr) | 2002-03-12 | 2003-09-18 | Olympus Corporation | Procede de fabrication de semi-conducteurs et dispositif d'usinage associe |
US7295695B1 (en) * | 2002-03-19 | 2007-11-13 | Kla-Tencor Technologies Corporation | Defect detection via multiscale wavelets-based algorithms |
AU2003247868A1 (en) * | 2002-07-15 | 2004-02-02 | Kla-Tencor Technologies Corp. | Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables |
JP3699960B2 (ja) | 2003-03-14 | 2005-09-28 | 株式会社東芝 | 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法 |
US7508973B2 (en) * | 2003-03-28 | 2009-03-24 | Hitachi High-Technologies Corporation | Method of inspecting defects |
US6952653B2 (en) | 2003-04-29 | 2005-10-04 | Kla-Tencor Technologies Corporation | Single tool defect classification solution |
US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
JP4260587B2 (ja) * | 2003-09-18 | 2009-04-30 | 株式会社日立ハイテクノロジーズ | パターン欠陥検査装置 |
US7208328B2 (en) * | 2004-03-16 | 2007-04-24 | Macronix International Co., Ltd. | Method and system for analyzing defects of an integrated circuit wafer |
US7171334B2 (en) * | 2004-06-01 | 2007-01-30 | Brion Technologies, Inc. | Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process |
WO2006006148A2 (en) * | 2004-07-12 | 2006-01-19 | Negevtech Ltd. | Multi mode inspection method and apparatus |
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2005
- 2005-06-06 US US11/146,342 patent/US9037280B2/en active Active
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2006
- 2006-06-06 JP JP2008515840A patent/JP5318569B2/ja active Active
- 2006-06-06 CN CN200680029267.7A patent/CN101238346B/zh active Active
- 2006-06-06 WO PCT/US2006/022005 patent/WO2006133233A2/en active Application Filing
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2011
- 2011-10-19 JP JP2011229550A patent/JP5718786B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5544256A (en) * | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
US6483938B1 (en) * | 1996-05-31 | 2002-11-19 | Texas Instruments Incorporated | System and method for classifying an anomaly |
CN1434981A (zh) * | 2000-04-25 | 2003-08-06 | 东京毅力科创株式会社 | 半导体器件检测系统 |
CN1521822A (zh) * | 2003-01-29 | 2004-08-18 | 力晶半导体股份有限公司 | 缺陷检测参数分析方法 |
US6718526B1 (en) * | 2003-02-07 | 2004-04-06 | Kla-Tencor Corporation | Spatial signature analysis |
CN101120329A (zh) * | 2004-10-12 | 2008-02-06 | 恪纳腾技术公司 | 用于分类样品上的缺陷的计算机实现的方法和系统 |
CN1770417A (zh) * | 2004-11-02 | 2006-05-10 | 力晶半导体股份有限公司 | 缺陷检测及分类系统的数据分析方法 |
CN1877292A (zh) * | 2005-06-10 | 2006-12-13 | 联华电子股份有限公司 | 缺陷检测方法 |
CN1822343A (zh) * | 2005-12-28 | 2006-08-23 | 良率国际贸易(上海)有限公司 | 半导体缺陷信号检测与统计系统及其方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006133233A3 (en) | 2007-11-22 |
JP5718786B2 (ja) | 2015-05-13 |
CN101238346A (zh) | 2008-08-06 |
WO2006133233A2 (en) | 2006-12-14 |
JP5318569B2 (ja) | 2013-10-16 |
US9037280B2 (en) | 2015-05-19 |
US20060287751A1 (en) | 2006-12-21 |
JP2012039147A (ja) | 2012-02-23 |
JP2008543113A (ja) | 2008-11-27 |
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