JP2012035336A5 - - Google Patents

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Publication number
JP2012035336A5
JP2012035336A5 JP2010174673A JP2010174673A JP2012035336A5 JP 2012035336 A5 JP2012035336 A5 JP 2012035336A5 JP 2010174673 A JP2010174673 A JP 2010174673A JP 2010174673 A JP2010174673 A JP 2010174673A JP 2012035336 A5 JP2012035336 A5 JP 2012035336A5
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JP
Japan
Prior art keywords
water
fixed abrasive
mass
processing liquid
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010174673A
Other languages
English (en)
Japanese (ja)
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JP2012035336A (ja
JP5420498B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2010174673A external-priority patent/JP5420498B2/ja
Priority to JP2010174673A priority Critical patent/JP5420498B2/ja
Priority to EP11814573.9A priority patent/EP2602058A4/en
Priority to CN201180036629.6A priority patent/CN103025486B/zh
Priority to KR1020137001523A priority patent/KR101788901B1/ko
Priority to PH1/2013/500021A priority patent/PH12013500021B1/en
Priority to PCT/JP2011/067457 priority patent/WO2012017947A1/ja
Priority to SG2012096475A priority patent/SG186486A1/en
Priority to TW100127516A priority patent/TWI522457B/zh
Publication of JP2012035336A publication Critical patent/JP2012035336A/ja
Publication of JP2012035336A5 publication Critical patent/JP2012035336A5/ja
Publication of JP5420498B2 publication Critical patent/JP5420498B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010174673A 2010-08-03 2010-08-03 固定砥粒ワイヤソー用水溶性加工液 Active JP5420498B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2010174673A JP5420498B2 (ja) 2010-08-03 2010-08-03 固定砥粒ワイヤソー用水溶性加工液
SG2012096475A SG186486A1 (en) 2010-08-03 2011-07-29 Aqueous processing solution for fixed abrasive grain wire saw
CN201180036629.6A CN103025486B (zh) 2010-08-03 2011-07-29 固结磨料线锯用水溶性加工液
KR1020137001523A KR101788901B1 (ko) 2010-08-03 2011-07-29 고정 지립 와이어 소용 수용성 가공액
PH1/2013/500021A PH12013500021B1 (en) 2010-08-03 2011-07-29 Water-soluble working fluid for fixed-abrasive wire saw
PCT/JP2011/067457 WO2012017947A1 (ja) 2010-08-03 2011-07-29 固定砥粒ワイヤソー用水溶性加工液
EP11814573.9A EP2602058A4 (en) 2010-08-03 2011-07-29 AQUEOUS PROCESSING SOLUTION FOR FIXED ABRASIVE GRAIN CUTTING CABLE
TW100127516A TWI522457B (zh) 2010-08-03 2011-08-03 固定研磨粒細線切割器用水溶性加工液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010174673A JP5420498B2 (ja) 2010-08-03 2010-08-03 固定砥粒ワイヤソー用水溶性加工液

Publications (3)

Publication Number Publication Date
JP2012035336A JP2012035336A (ja) 2012-02-23
JP2012035336A5 true JP2012035336A5 (enrdf_load_stackoverflow) 2013-07-25
JP5420498B2 JP5420498B2 (ja) 2014-02-19

Family

ID=45559447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010174673A Active JP5420498B2 (ja) 2010-08-03 2010-08-03 固定砥粒ワイヤソー用水溶性加工液

Country Status (8)

Country Link
EP (1) EP2602058A4 (enrdf_load_stackoverflow)
JP (1) JP5420498B2 (enrdf_load_stackoverflow)
KR (1) KR101788901B1 (enrdf_load_stackoverflow)
CN (1) CN103025486B (enrdf_load_stackoverflow)
PH (1) PH12013500021B1 (enrdf_load_stackoverflow)
SG (1) SG186486A1 (enrdf_load_stackoverflow)
TW (1) TWI522457B (enrdf_load_stackoverflow)
WO (1) WO2012017947A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012172117A (ja) * 2011-02-23 2012-09-10 Yushiro Chemical Industry Co Ltd 固定砥粒ワイヤソー用水溶性加工液
JP6039935B2 (ja) * 2012-06-29 2016-12-07 出光興産株式会社 水性加工液
JP6819619B2 (ja) * 2018-01-22 2021-01-27 信越半導体株式会社 ワーク切断方法及びワイヤソー
CN110497546A (zh) * 2019-08-26 2019-11-26 哈尔滨商业大学 游离-固结复合磨料多线切割硅片的方法及设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243482A (ja) * 1985-08-21 1987-02-25 Sanyo Chem Ind Ltd 研磨加工液
CN1057478A (zh) * 1990-06-22 1992-01-01 薛志纯 金属切削液
US5401428A (en) * 1993-10-08 1995-03-28 Monsanto Company Water soluble metal working fluids
JP3869520B2 (ja) * 1997-03-21 2007-01-17 株式会社ネオス ワイヤソー用水溶性切削液
JP2000296455A (ja) * 1999-04-09 2000-10-24 Tokyo Seimitsu Co Ltd 固定砥粒マルチワイヤソー
JP2001054850A (ja) 1999-08-11 2001-02-27 Osaka Diamond Ind Co Ltd 固定砥粒ワイヤーソーによる硬脆材料の切断加工法
JP2002096251A (ja) * 1999-09-17 2002-04-02 Sumitomo Special Metals Co Ltd 希土類合金の切断方法および切断装置
JP2001138205A (ja) * 1999-11-08 2001-05-22 Sumitomo Special Metals Co Ltd 希土類合金の切断方法および切断装置
JP2002167589A (ja) * 2000-11-30 2002-06-11 Nippon Shokubai Co Ltd 金属加工油剤
JP4497767B2 (ja) 2001-09-06 2010-07-07 ユシロ化学工業株式会社 固定砥粒ワイヤソー用水溶性加工液組成物
TW575660B (en) * 2001-09-07 2004-02-11 Dai Ichi Kogyo Seiyaku Co Ltd Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid
JP2008161992A (ja) * 2006-12-28 2008-07-17 Asahi Diamond Industrial Co Ltd 被加工部材の切断方法およびウェハの製造方法
JP4874853B2 (ja) * 2007-04-09 2012-02-15 Dowaホールディングス株式会社 焼結希土類磁石合金の切断法
JP5253765B2 (ja) * 2007-07-05 2013-07-31 株式会社Adeka ダイシング切削水用添加剤及びそれを使用した切削加工方法
US8157876B2 (en) * 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
US20090149359A1 (en) * 2007-12-10 2009-06-11 Hundley Lloyd E Formulation of a metal working fluid

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