JP2016171332A5 - - Google Patents
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- Publication number
- JP2016171332A5 JP2016171332A5 JP2016089114A JP2016089114A JP2016171332A5 JP 2016171332 A5 JP2016171332 A5 JP 2016171332A5 JP 2016089114 A JP2016089114 A JP 2016089114A JP 2016089114 A JP2016089114 A JP 2016089114A JP 2016171332 A5 JP2016171332 A5 JP 2016171332A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- silicon wafer
- polishing composition
- wafer polishing
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 37
- 238000005498 polishing Methods 0.000 claims description 26
- 150000002894 organic compounds Chemical class 0.000 claims description 13
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 9
- 229910052710 silicon Inorganic materials 0.000 claims 9
- 239000010703 silicon Substances 0.000 claims 9
- 125000003368 amide group Chemical group 0.000 claims 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 1
- 239000002245 particle Substances 0.000 description 10
- 230000002776 aggregation Effects 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 238000004220 aggregation Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 0 CC*[N+]([N-])N=C Chemical compound CC*[N+]([N-])N=C 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016089114A JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016089114A JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014129497A Division JP6185432B2 (ja) | 2014-06-24 | 2014-06-24 | シリコンウェーハ研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016171332A JP2016171332A (ja) | 2016-09-23 |
| JP2016171332A5 true JP2016171332A5 (enrdf_load_stackoverflow) | 2017-07-20 |
| JP6348927B2 JP6348927B2 (ja) | 2018-06-27 |
Family
ID=56984177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016089114A Active JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6348927B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6893835B2 (ja) * | 2017-06-23 | 2021-06-23 | 花王株式会社 | シリコンウェーハ用仕上げ研磨液組成物 |
| JP7103823B2 (ja) * | 2018-03-30 | 2022-07-20 | 株式会社フジミインコーポレーテッド | シリコンウェーハの研磨方法および研磨用組成物 |
| EP4503097A1 (en) | 2022-03-31 | 2025-02-05 | Fujimi Incorporated | Polishing composition |
| WO2024029457A1 (ja) | 2022-08-05 | 2024-02-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN117229717A (zh) * | 2023-08-23 | 2023-12-15 | 上海集成电路材料研究院有限公司 | 一种化学机械抛光液及其制备方法和用途 |
| CN117229716A (zh) * | 2023-08-23 | 2023-12-15 | 上海集成电路材料研究院有限公司 | 一种含吗啉环水溶性小分子的用途及化学机械抛光液 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101983868B1 (ko) * | 2011-10-24 | 2019-05-29 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 그것을 사용한 연마 방법 및 기판의 제조 방법 |
| JP2014041978A (ja) * | 2012-08-23 | 2014-03-06 | Fujimi Inc | 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法 |
| WO2014034425A1 (ja) * | 2012-08-31 | 2014-03-06 | 株式会社 フジミインコーポレーテッド | 研磨用組成物及び基板の製造方法 |
-
2016
- 2016-04-27 JP JP2016089114A patent/JP6348927B2/ja active Active
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