JP2012033615A5 - - Google Patents
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- JP2012033615A5 JP2012033615A5 JP2010170570A JP2010170570A JP2012033615A5 JP 2012033615 A5 JP2012033615 A5 JP 2012033615A5 JP 2010170570 A JP2010170570 A JP 2010170570A JP 2010170570 A JP2010170570 A JP 2010170570A JP 2012033615 A5 JP2012033615 A5 JP 2012033615A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- manufactured
- holes
- semiconductor device
- diced along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010170570A JP5521862B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置の製造方法 |
| US13/079,055 US8728866B2 (en) | 2010-07-29 | 2011-04-04 | Method for manufacturing semiconductor device |
| TW100111754A TWI446429B (zh) | 2010-07-29 | 2011-04-06 | 半導體裝置及其製造方法 |
| DE102011122918.7A DE102011122918B3 (de) | 2010-07-29 | 2011-07-13 | Halbleitervorrichtung |
| DE102011079105A DE102011079105A1 (de) | 2010-07-29 | 2011-07-13 | Halbleitervorrichtung und Verfahren zum Herstellen derselben |
| CN201110213254.8A CN102347243B (zh) | 2010-07-29 | 2011-07-28 | 半导体装置及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010170570A JP5521862B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012033615A JP2012033615A (ja) | 2012-02-16 |
| JP2012033615A5 true JP2012033615A5 (US20040106767A1-20040603-C00005.png) | 2013-07-04 |
| JP5521862B2 JP5521862B2 (ja) | 2014-06-18 |
Family
ID=45525895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010170570A Expired - Fee Related JP5521862B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置の製造方法 |
Country Status (5)
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428255B (zh) * | 2013-03-29 | 2019-02-15 | 日月光半导体制造股份有限公司 | 透光壳体及其制造方法与应用其的光学组件 |
| JP2015115446A (ja) | 2013-12-11 | 2015-06-22 | 株式会社東芝 | 半導体装置の製造方法 |
| JP6221736B2 (ja) * | 2013-12-25 | 2017-11-01 | 三菱電機株式会社 | 半導体装置 |
| JP6215755B2 (ja) | 2014-04-14 | 2017-10-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| TWI566288B (zh) * | 2014-07-14 | 2017-01-11 | 矽品精密工業股份有限公司 | 切割用載具及切割方法 |
| JP6314731B2 (ja) * | 2014-08-01 | 2018-04-25 | 株式会社ソシオネクスト | 半導体装置及び半導体装置の製造方法 |
| US10277271B2 (en) | 2015-07-28 | 2019-04-30 | Nippon Telegraph And Telephone Corporation | Optical module |
| KR102049724B1 (ko) | 2015-08-18 | 2019-11-28 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
| US10393532B2 (en) * | 2015-10-20 | 2019-08-27 | International Business Machines Corporation | Emergency responsive navigation |
| KR102494902B1 (ko) * | 2017-02-02 | 2023-02-01 | 쇼와덴코머티리얼즈가부시끼가이샤 | 전자 부품의 제조 방법, 가보호용 수지 조성물 및 가보호용 수지 필름 |
| JP2019192729A (ja) * | 2018-04-23 | 2019-10-31 | 株式会社村田製作所 | 半導体装置 |
| DE112018007677B4 (de) * | 2018-05-28 | 2023-10-12 | Mitsubishi Electric Corporation | Verfahren zur Herstellung eines Halbleitergerätes |
| JP7034105B2 (ja) | 2019-01-18 | 2022-03-11 | 三菱電機株式会社 | 電力用半導体装置の製造方法、電力用半導体装置および電力変換装置 |
| KR20210076292A (ko) | 2019-12-13 | 2021-06-24 | 삼성전자주식회사 | 반도체 패키지 |
| US11948893B2 (en) * | 2021-12-21 | 2024-04-02 | Qorvo Us, Inc. | Electronic component with lid to manage radiation feedback |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0544329A3 (en) | 1991-11-28 | 1993-09-01 | Kabushiki Kaisha Toshiba | Semiconductor package |
| JP2501279B2 (ja) | 1991-11-29 | 1996-05-29 | 株式会社東芝 | 半導体パッケ―ジ |
| JP2001024079A (ja) | 1999-07-05 | 2001-01-26 | Seiko Epson Corp | 電子部品の封止構造 |
| US7026223B2 (en) | 2002-03-28 | 2006-04-11 | M/A-Com, Inc | Hermetic electric component package |
| JP4342174B2 (ja) | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
| JP2005057136A (ja) | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP4312631B2 (ja) | 2004-03-03 | 2009-08-12 | 三菱電機株式会社 | ウエハレベルパッケージ構造体とその製造方法、及びそのウエハレベルパッケージ構造体から分割された素子 |
| JP4993848B2 (ja) * | 2004-05-28 | 2012-08-08 | 三洋電機株式会社 | 配線基材 |
| KR100594716B1 (ko) | 2004-07-27 | 2006-06-30 | 삼성전자주식회사 | 공동부를 구비한 캡 웨이퍼, 이를 이용한 반도체 칩, 및그 제조방법 |
| FR2879889B1 (fr) | 2004-12-20 | 2007-01-26 | United Monolithic Semiconduct | Boitier miniature hyperfrequence et procede de fabrication du boitier |
| JP2008532307A (ja) * | 2005-03-02 | 2008-08-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体パッケージ及び作成パッケージを製造する方法 |
| US7495462B2 (en) | 2005-03-24 | 2009-02-24 | Memsic, Inc. | Method of wafer-level packaging using low-aspect ratio through-wafer holes |
| JP2007005948A (ja) * | 2005-06-22 | 2007-01-11 | Alps Electric Co Ltd | 電子部品及びその製造方法 |
| US20070004079A1 (en) | 2005-06-30 | 2007-01-04 | Geefay Frank S | Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips |
| JP2007019107A (ja) * | 2005-07-05 | 2007-01-25 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| KR100752713B1 (ko) * | 2005-10-10 | 2007-08-29 | 삼성전기주식회사 | 이미지센서의 웨이퍼 레벨 칩 스케일 패키지 및 그제조방법 |
| US7393758B2 (en) * | 2005-11-03 | 2008-07-01 | Maxim Integrated Products, Inc. | Wafer level packaging process |
| KR100831405B1 (ko) | 2006-10-02 | 2008-05-21 | (주) 파이오닉스 | 웨이퍼 본딩 패키징 방법 |
| JP4860552B2 (ja) | 2007-06-08 | 2012-01-25 | 日本オプネクスト株式会社 | 半導体装置 |
| JP5344336B2 (ja) * | 2008-02-27 | 2013-11-20 | 株式会社ザイキューブ | 半導体装置 |
-
2010
- 2010-07-29 JP JP2010170570A patent/JP5521862B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-04 US US13/079,055 patent/US8728866B2/en active Active
- 2011-04-06 TW TW100111754A patent/TWI446429B/zh not_active IP Right Cessation
- 2011-07-13 DE DE102011079105A patent/DE102011079105A1/de not_active Withdrawn
- 2011-07-13 DE DE102011122918.7A patent/DE102011122918B3/de not_active Expired - Fee Related
- 2011-07-28 CN CN201110213254.8A patent/CN102347243B/zh not_active Expired - Fee Related
