JP2012031504A5 - - Google Patents

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Publication number
JP2012031504A5
JP2012031504A5 JP2011045872A JP2011045872A JP2012031504A5 JP 2012031504 A5 JP2012031504 A5 JP 2012031504A5 JP 2011045872 A JP2011045872 A JP 2011045872A JP 2011045872 A JP2011045872 A JP 2011045872A JP 2012031504 A5 JP2012031504 A5 JP 2012031504A5
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JP
Japan
Prior art keywords
cooling
unit
enclosure
substrate
cooling means
Prior art date
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Application number
JP2011045872A
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English (en)
Japanese (ja)
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JP5220147B2 (ja
JP2012031504A (ja
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Priority to JP2011045872A priority Critical patent/JP5220147B2/ja
Priority claimed from JP2011045872A external-priority patent/JP5220147B2/ja
Publication of JP2012031504A publication Critical patent/JP2012031504A/ja
Publication of JP2012031504A5 publication Critical patent/JP2012031504A5/ja
Application granted granted Critical
Publication of JP5220147B2 publication Critical patent/JP5220147B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011045872A 2010-06-29 2011-03-03 冷却装置および加熱装置 Active JP5220147B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010147748 2010-06-29
JP2010147748 2010-06-29
JP2011045872A JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Publications (3)

Publication Number Publication Date
JP2012031504A JP2012031504A (ja) 2012-02-16
JP2012031504A5 true JP2012031504A5 (enExample) 2012-11-29
JP5220147B2 JP5220147B2 (ja) 2013-06-26

Family

ID=45351410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011045872A Active JP5220147B2 (ja) 2010-06-29 2011-03-03 冷却装置および加熱装置

Country Status (2)

Country Link
US (1) US20110315346A1 (enExample)
JP (1) JP5220147B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101988014B1 (ko) * 2012-04-18 2019-06-13 삼성디스플레이 주식회사 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치
KR101358805B1 (ko) * 2012-08-22 2014-02-07 에이피시스템 주식회사 냉각수 처리 장치, 방법 및 이를 적용한 기판 처리 장치
JP5849934B2 (ja) * 2012-11-16 2016-02-03 住友金属鉱山株式会社 真空成膜装置と真空成膜方法
US20140151360A1 (en) * 2012-11-30 2014-06-05 Wd Media, Inc. Heater assembly for disk processing system
JP6231399B2 (ja) * 2014-02-17 2017-11-15 キヤノンアネルバ株式会社 処理装置
JP7027057B2 (ja) * 2017-07-18 2022-03-01 株式会社アルバック 基板搬送装置
CN108203812B (zh) * 2018-01-25 2020-02-07 京东方科技集团股份有限公司 一种基板固定载具、蒸镀设备及蒸镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3021016B2 (ja) * 1990-10-04 2000-03-15 日本真空技術株式会社 基板冷却機構
US5181556A (en) * 1991-09-20 1993-01-26 Intevac, Inc. System for substrate cooling in an evacuated environment
JP3793273B2 (ja) * 1996-02-19 2006-07-05 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US5753092A (en) * 1996-08-26 1998-05-19 Velocidata, Inc. Cylindrical carriage sputtering system
JP2953395B2 (ja) * 1996-09-05 1999-09-27 日本電気株式会社 スパッタリング装置
US20060179848A1 (en) * 2005-02-14 2006-08-17 Asia Vital Component Co., Ltd. Radiator unit
US20070283709A1 (en) * 2006-06-09 2007-12-13 Veeco Instruments Inc. Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system
JP2010093293A (ja) * 2010-01-14 2010-04-22 Canon Anelva Corp 絶縁膜エッチング装置

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