JP2012028786A5 - - Google Patents

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Publication number
JP2012028786A5
JP2012028786A5 JP2011163940A JP2011163940A JP2012028786A5 JP 2012028786 A5 JP2012028786 A5 JP 2012028786A5 JP 2011163940 A JP2011163940 A JP 2011163940A JP 2011163940 A JP2011163940 A JP 2011163940A JP 2012028786 A5 JP2012028786 A5 JP 2012028786A5
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JP
Japan
Prior art keywords
integrated circuit
resistance
contact
determining
section
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JP2011163940A
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English (en)
Japanese (ja)
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JP2012028786A (ja
JP5901170B2 (ja
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Priority claimed from DE102010038453A external-priority patent/DE102010038453A1/de
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Publication of JP2012028786A publication Critical patent/JP2012028786A/ja
Publication of JP2012028786A5 publication Critical patent/JP2012028786A5/ja
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Publication of JP5901170B2 publication Critical patent/JP5901170B2/ja
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JP2011163940A 2010-07-27 2011-07-27 集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法 Active JP5901170B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010038453.4 2010-07-27
DE102010038453A DE102010038453A1 (de) 2010-07-27 2010-07-27 Lötstellenkontrolle

Publications (3)

Publication Number Publication Date
JP2012028786A JP2012028786A (ja) 2012-02-09
JP2012028786A5 true JP2012028786A5 (enExample) 2013-03-28
JP5901170B2 JP5901170B2 (ja) 2016-04-06

Family

ID=45471069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011163940A Active JP5901170B2 (ja) 2010-07-27 2011-07-27 集積回路および集積回路のコンタクト部とプリント基板の相応するコンタクト部との間の抵抗を求める方法

Country Status (3)

Country Link
US (1) US8810252B2 (enExample)
JP (1) JP5901170B2 (enExample)
DE (1) DE102010038453A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9635794B2 (en) 2012-02-20 2017-04-25 Trw Automotive U.S. Llc Method and apparatus for attachment of integrated circuits
US8957694B2 (en) * 2012-05-22 2015-02-17 Broadcom Corporation Wafer level package resistance monitor scheme
WO2023209856A1 (ja) * 2022-04-27 2023-11-02 日立Astemo株式会社 車載制御装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154546A (ja) * 1987-12-10 1989-06-16 Fujitsu Ltd 端子開放検出回路半導体装置
JP2977959B2 (ja) * 1991-07-12 1999-11-15 シチズン時計株式会社 半導体装置およびその測定方法
JP2825085B2 (ja) * 1996-08-29 1998-11-18 日本電気株式会社 半導体装置の実装構造、実装用基板および実装状態の検査方法
JP2004363146A (ja) * 2003-06-02 2004-12-24 Matsushita Electric Ind Co Ltd 回路基板に対する電子部品の接合品質評価用の検査チップとそれを用いた評価ツール及び評価方法
JP2005347469A (ja) * 2004-06-02 2005-12-15 Denso Corp 電子部品およびその半田付け検査システム
US20080218495A1 (en) * 2007-03-08 2008-09-11 Wintek Corporation Circuit capable of selectively operating in either an inspecting mode or a driving mode for a display
US8522051B2 (en) * 2007-05-07 2013-08-27 Infineon Technologies Ag Protection for circuit boards
JP5034781B2 (ja) * 2007-08-27 2012-09-26 富士通株式会社 半田バンプの高感度抵抗測定装置及び監視方法
JP2009065037A (ja) * 2007-09-07 2009-03-26 Yokogawa Electric Corp 半導体集積回路とその検査装置
JP5343555B2 (ja) * 2008-12-22 2013-11-13 富士通株式会社 半導体装置、及び、はんだ接合部破壊の検出方法

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