CN201185508Y - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
- Publication number
- CN201185508Y CN201185508Y CNU2008203005346U CN200820300534U CN201185508Y CN 201185508 Y CN201185508 Y CN 201185508Y CN U2008203005346 U CNU2008203005346 U CN U2008203005346U CN 200820300534 U CN200820300534 U CN 200820300534U CN 201185508 Y CN201185508 Y CN 201185508Y
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- block
- bus plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
一种印刷电路板,其包括一信号层及一电源层,该信号层包括一流有振荡电流的连接区块,该电源层处于该信号层下侧,该电源层对应该连接区块设有一防止该连接区块的振荡电流干扰该电源层的隔离区块。该印刷电路板能防止信号层的振荡电流对电源层的干扰。
Description
技术领域
本实用新型涉及一种印刷电路板,特别是关于一种可防止信号层的振荡电流干扰电源层的印刷电路板。
背景技术
如图1所示,现有的印刷电路板10包括一信号层11、一电源层12及一接地层13。该信号层11处于该电源层12之上,该信号层11包括一连接区块112及一安置在该连接区块112上的开关元件111。该电源层12处于该接地层13之上,为了提供多个不同电压电源,该电源层被若干切割线隔成若干电压区域121、122、123,该连接区块112及该开关元件111处于该电压区域122正上方。
当该开关元件111处于工作状态时,其接受的为脉冲信号,该开关元件111在脉冲信号的影响下,不断地开通及闭合,造成流经该连接区块112的电流为振荡电流,使该连接区块112正下方的电压区域122的电压波动,从而影响该电压区域122的电压稳定性。
发明内容
鉴于以上内容,有必要提供一种可防止信号层的电流干扰电源层的印刷电路板。
一种印刷电路板,其包括一信号层及一电源层,该信号层包括一流有振荡电流的连接区块,该电源层处于该信号层下侧,该电源层对应该连接区块设有一防止该连接区块的振荡电流干扰该电源层的隔离区块。
相较于现有技术,所述印刷电路板的电源层对应该连接区块设有一隔离区块,当该连接区块中有振荡电流时,其产生的振荡干扰不会影响到电源层的电压。该印刷电路板能防止信号层的振荡电流对电源层的干扰。
附图说明
下面参照附图结合实施方式对本实用新型作进一步的描述。
图1是现有的印刷电路板分解示意图。
图2是本实用新型较佳实施例印刷电路板分解示意图。
图3是本实用新型较佳实施例印刷电路板正视图。
具体实施方式
请参阅图2,本实用新型较佳实施例印刷电路板20包括一信号层21、一电源层22及一接地层23。
该信号层21处于该电源层22之上,该信号层21包括一连接区块212及一布置在该连接区块212上的开关元件211。在本实施例中,该开关元件211为一MOS管。
该电源层22处于该接地层23之上,该电源层22被若干切割线隔离成若干电压区域221、222、223,该连接区块212及该开关元件211处于该电压区域222正上方,在该电压区域222中,该电源层22在该开关元件211的正下方设有一隔离区块224,该隔离区块224由一切割线225围绕而成,该切割线225将该电源层22以一定的宽度切割形成该隔离区块224,从而使该隔离区块224与该电压区域222无电性连接关系。
请一并参阅图2及图3,该连接区块212的正投影处在该隔离区块224中。当该开关元件211处于工作状态时,其接受的为脉冲信号,该开关元件211在脉冲信号的影响下,不断地开通及闭合,造成流经该连接区块212的电流为振荡电流,该连接区块212处于该电源层22的电压区域222的隔离区块224中,该振荡电流的干扰只影响该电源层22的隔离区块224,而隔离区块224与该电压区域222隔开,从而避免了该振荡电流影响到该电压区域222的电压稳定性。
在上述实施例中,该开关元件211可为其它接收脉冲信号的电子元件。该隔离区块224可与该连接区块212连接起来,有助于该连接区块212散热。可将接地层23对应于该电源层22的隔离区块224的区域以隔离线分割一隔离区块,防止接地层受到该开关元件211在工作状态时带来的干扰。
Claims (7)
1.一种印刷电路板,其包括一信号层及一电源层,该信号层包括一流有振荡电流的连接区块,该电源层处于该信号层下侧,其特征在于:该电源层对应该连接区块设有一防止该连接区块的振荡电流干扰该电源层的隔离区块。
2.如权利要求1所述的印刷电路板,其特征在于:该连接区块的正投影处在该隔离区块中。
3.如权利要求1所述的印刷电路板,其特征在于:该隔离区块是由一切割线围绕而成。
4.如权利要求1所述的印刷电路板,其特征在于:该电源层分为若干电压区域,该隔离区块分布在其中一电压区域。
5.如权利要求1所述的印刷电路板,其特征在于:该印刷电路板还包括一接地层,该接地层对应该电源层的隔离区块也设有一隔离区块。
6.如权利要求1所述的印刷电路板,其特征在于:该连接区块中布设有一接受脉冲信号的电子元件。
7.如权利要求6所述的印刷电路板,其特征在于:该电子元件为一开关元件。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008203005346U CN201185508Y (zh) | 2008-04-11 | 2008-04-11 | 印刷电路板 |
US12/180,233 US8072775B2 (en) | 2008-04-11 | 2008-07-25 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008203005346U CN201185508Y (zh) | 2008-04-11 | 2008-04-11 | 印刷电路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201185508Y true CN201185508Y (zh) | 2009-01-21 |
Family
ID=40273240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008203005346U Expired - Fee Related CN201185508Y (zh) | 2008-04-11 | 2008-04-11 | 印刷电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8072775B2 (zh) |
CN (1) | CN201185508Y (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201316895A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 可抑制電磁干擾的電路板 |
CN107318215A (zh) * | 2016-04-26 | 2017-11-03 | 鸿富锦精密电子(天津)有限公司 | 印刷电路板及应用该印刷电路板的电子装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3265669B2 (ja) * | 1993-01-19 | 2002-03-11 | 株式会社デンソー | プリント基板 |
US5761051A (en) * | 1994-12-29 | 1998-06-02 | Compaq Computer Corporation | Multi-layer circuit board having a supply bus and discrete voltage supply planes |
US5736796A (en) * | 1995-05-01 | 1998-04-07 | Apple Computer, Inc. | Printed circuit board having split voltage planes |
US5587887A (en) * | 1995-05-01 | 1996-12-24 | Apple Computer, Inc. | Printed circuit board having a configurable voltage supply |
JP2867985B2 (ja) * | 1996-12-20 | 1999-03-10 | 日本電気株式会社 | プリント回路基板 |
JP3926880B2 (ja) * | 1997-03-31 | 2007-06-06 | 富士通株式会社 | 多層プリント板 |
US6178311B1 (en) * | 1998-03-02 | 2001-01-23 | Western Multiplex Corporation | Method and apparatus for isolating high frequency signals in a printed circuit board |
US6084779A (en) * | 1998-10-02 | 2000-07-04 | Sigrity, Inc. | Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips |
JP2001168477A (ja) * | 1999-12-13 | 2001-06-22 | Fujitsu Ltd | プリント基板、プリント基板モジュール、及び電子機器 |
JP3925032B2 (ja) * | 2000-03-14 | 2007-06-06 | 富士ゼロックス株式会社 | プリント配線基板 |
JP2001332825A (ja) * | 2000-03-14 | 2001-11-30 | Fuji Xerox Co Ltd | 回路基板装置及び設計支援装置 |
US6798666B1 (en) * | 2000-12-29 | 2004-09-28 | Ncr Corporation | Introducing loss in a power bus to reduce EMI and electrical noise |
US6909052B1 (en) * | 2002-08-23 | 2005-06-21 | Emc Corporation | Techniques for making a circuit board with improved impedance characteristics |
US7176383B2 (en) * | 2003-12-22 | 2007-02-13 | Endicott Interconnect Technologies, Inc. | Printed circuit board with low cross-talk noise |
US7230835B1 (en) * | 2003-07-18 | 2007-06-12 | Cisco Technology, Inc. | Apparatus for reducing signal reflection in a circuit board |
TW595275B (en) * | 2003-11-05 | 2004-06-21 | Tatung Co | Low noise printed circuit board |
TWI255159B (en) * | 2004-11-03 | 2006-05-11 | Tatung Co Ltd | Low-noise multilayer printed-circuit board (PCB) |
TWI290449B (en) * | 2004-11-03 | 2007-11-21 | Tatung Co | Multi-layer printed circuit with low noise |
US7778039B2 (en) * | 2006-05-08 | 2010-08-17 | Micron Technology, Inc. | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise |
CN101090599B (zh) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
TW200810651A (en) * | 2006-08-09 | 2008-02-16 | Tatung Co Ltd | Low-noise multilayered PCB |
CN101188902B (zh) * | 2006-11-17 | 2011-08-24 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
-
2008
- 2008-04-11 CN CNU2008203005346U patent/CN201185508Y/zh not_active Expired - Fee Related
- 2008-07-25 US US12/180,233 patent/US8072775B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8072775B2 (en) | 2011-12-06 |
US20090255718A1 (en) | 2009-10-15 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090121 Termination date: 20100411 |