JP2012004464A - 半導体装置、半導体装置の製造方法及び半導体装置の製造装置 - Google Patents

半導体装置、半導体装置の製造方法及び半導体装置の製造装置 Download PDF

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JP2012004464A
JP2012004464A JP2010139998A JP2010139998A JP2012004464A JP 2012004464 A JP2012004464 A JP 2012004464A JP 2010139998 A JP2010139998 A JP 2010139998A JP 2010139998 A JP2010139998 A JP 2010139998A JP 2012004464 A JP2012004464 A JP 2012004464A
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Prior art keywords
electrode
wire
capillary
semiconductor device
ball
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JP2010139998A
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English (en)
Japanese (ja)
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JP2012004464A5 (enExample
Inventor
Yuichi Sano
雄一 佐野
Takashi Imoto
孝志 井本
Naoto Takebe
直人 武部
Katsuhiro Ishida
勝広 石田
Tomomi Honda
友巳 本田
Yasushi Kumagai
靖 熊谷
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Toshiba Corp
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Toshiba Corp
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Priority to JP2010139998A priority Critical patent/JP2012004464A/ja
Priority to CN201110066789.7A priority patent/CN102290391B/zh
Priority to TW100109462A priority patent/TWI484613B/zh
Priority to US13/052,368 priority patent/US8237295B2/en
Publication of JP2012004464A publication Critical patent/JP2012004464A/ja
Publication of JP2012004464A5 publication Critical patent/JP2012004464A5/ja
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/2075—Diameter ranges larger or equal to 1 micron less than 10 microns
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    • H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Led Devices (AREA)
JP2010139998A 2010-06-18 2010-06-18 半導体装置、半導体装置の製造方法及び半導体装置の製造装置 Pending JP2012004464A (ja)

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CN201110066789.7A CN102290391B (zh) 2010-06-18 2011-03-18 半导体器件及其制造方法和制造装置
TW100109462A TWI484613B (zh) 2010-06-18 2011-03-18 半導體裝置、半導體裝置之製造方法及半導體裝置之製造設備
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JP2013143447A (ja) * 2012-01-10 2013-07-22 Toshiba Corp 半導体装置の製造方法およびボンディング装置
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