JP2012004464A5 - - Google Patents

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Publication number
JP2012004464A5
JP2012004464A5 JP2010139998A JP2010139998A JP2012004464A5 JP 2012004464 A5 JP2012004464 A5 JP 2012004464A5 JP 2010139998 A JP2010139998 A JP 2010139998A JP 2010139998 A JP2010139998 A JP 2010139998A JP 2012004464 A5 JP2012004464 A5 JP 2012004464A5
Authority
JP
Japan
Prior art keywords
semiconductor element
electrode
main surface
upper side
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010139998A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012004464A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010139998A priority Critical patent/JP2012004464A/ja
Priority claimed from JP2010139998A external-priority patent/JP2012004464A/ja
Priority to CN201110066789.7A priority patent/CN102290391B/zh
Priority to TW100109462A priority patent/TWI484613B/zh
Priority to US13/052,368 priority patent/US8237295B2/en
Publication of JP2012004464A publication Critical patent/JP2012004464A/ja
Publication of JP2012004464A5 publication Critical patent/JP2012004464A5/ja
Pending legal-status Critical Current

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JP2010139998A 2010-06-18 2010-06-18 半導体装置、半導体装置の製造方法及び半導体装置の製造装置 Pending JP2012004464A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010139998A JP2012004464A (ja) 2010-06-18 2010-06-18 半導体装置、半導体装置の製造方法及び半導体装置の製造装置
CN201110066789.7A CN102290391B (zh) 2010-06-18 2011-03-18 半导体器件及其制造方法和制造装置
TW100109462A TWI484613B (zh) 2010-06-18 2011-03-18 半導體裝置、半導體裝置之製造方法及半導體裝置之製造設備
US13/052,368 US8237295B2 (en) 2010-06-18 2011-03-21 Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010139998A JP2012004464A (ja) 2010-06-18 2010-06-18 半導体装置、半導体装置の製造方法及び半導体装置の製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014085372A Division JP2014140074A (ja) 2014-04-17 2014-04-17 半導体装置

Publications (2)

Publication Number Publication Date
JP2012004464A JP2012004464A (ja) 2012-01-05
JP2012004464A5 true JP2012004464A5 (enExample) 2012-10-11

Family

ID=45327935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010139998A Pending JP2012004464A (ja) 2010-06-18 2010-06-18 半導体装置、半導体装置の製造方法及び半導体装置の製造装置

Country Status (4)

Country Link
US (1) US8237295B2 (enExample)
JP (1) JP2012004464A (enExample)
CN (1) CN102290391B (enExample)
TW (1) TWI484613B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013143447A (ja) * 2012-01-10 2013-07-22 Toshiba Corp 半導体装置の製造方法およびボンディング装置
KR102621753B1 (ko) 2018-09-28 2024-01-05 삼성전자주식회사 본딩 와이어, 이를 포함하는 반도체 패키지, 및 와이어 본딩 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
WO1996016440A1 (en) * 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
JPH0951011A (ja) * 1995-08-10 1997-02-18 Tanaka Denshi Kogyo Kk 半導体チップのワイヤボンディング方法
EP1158579B1 (en) * 1996-10-01 2008-11-19 Panasonic Corporation Wire bonding capillary for forming bump electrodes
JP2004172477A (ja) 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP2005019493A (ja) * 2003-06-24 2005-01-20 Renesas Technology Corp 半導体装置
JP2005167178A (ja) * 2003-11-10 2005-06-23 Shinkawa Ltd 半導体装置及びワイヤボンディング方法
US7347352B2 (en) * 2003-11-26 2008-03-25 Kulicke And Soffa Industries, Inc. Low loop height ball bonding method and apparatus
CN1886226A (zh) * 2003-11-26 2006-12-27 库利克和索夫工业公司 低回路高度球焊方法和设备
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
US7371676B2 (en) * 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
JP2008034567A (ja) * 2006-07-27 2008-02-14 Fujitsu Ltd 半導体装置及びその製造方法
WO2008048262A1 (en) * 2006-10-18 2008-04-24 Kulicke And Soffa Industries, Inc. Improved conductive bumps, wire loops including the improved conductive bumps, and methods of forming the same
KR101143836B1 (ko) * 2006-10-27 2012-05-04 삼성테크윈 주식회사 반도체 패키지 및 그 반도체 패키지의 와이어 루프 형성방법
JP2008117888A (ja) * 2006-11-02 2008-05-22 Rohm Co Ltd 電子部品、およびワイヤボンディング方法
US20080197461A1 (en) * 2007-02-15 2008-08-21 Taiwan Semiconductor Manufacturing Co.,Ltd. Apparatus for wire bonding and integrated circuit chip package
JP2009010064A (ja) * 2007-06-27 2009-01-15 Shinkawa Ltd 半導体装置及びワイヤボンディング方法
US7572679B2 (en) * 2007-07-26 2009-08-11 Texas Instruments Incorporated Heat extraction from packaged semiconductor chips, scalable with chip area
JP4397408B2 (ja) * 2007-09-21 2010-01-13 株式会社新川 半導体装置及びワイヤボンディング方法
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4344002B1 (ja) * 2008-10-27 2009-10-14 株式会社新川 ワイヤボンディング方法

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