JP2011524645A - 電子モジュールを製造するための方法 - Google Patents
電子モジュールを製造するための方法 Download PDFInfo
- Publication number
- JP2011524645A JP2011524645A JP2011513971A JP2011513971A JP2011524645A JP 2011524645 A JP2011524645 A JP 2011524645A JP 2011513971 A JP2011513971 A JP 2011513971A JP 2011513971 A JP2011513971 A JP 2011513971A JP 2011524645 A JP2011524645 A JP 2011524645A
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- Prior art keywords
- electronic component
- layer
- film
- conductive
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
(a)導体路構造を形成するために導電性フィルムをパターニングするステップ。
(b)前記導体路構造に少なくとも1つの電子構成素子を装着するステップ。
(c)前記少なくとも1つの電子構成素子が装着された導電性フィルムの、前記少なくとも1つの電子構成素子が装着されている方の側に、別のフィルムをラミネートするステップ。
Claims (13)
- 少なくとも1つの電子構成素子(9)ならびに、該電子構成素子をコンタクトする導体路構造(7)を含む電子モジュールを製造するための方法であって、
(a)導体路構造(7)を形成するために、導電性フィルム(1)の導電層(3)をパターニングするステップ、
(b)前記導体路構造(7)に少なくとも1つの電子構成素子(9)を装着するステップ、
(c)前記少なくとも1つの電子構成素子(9)が装着された前記導電性フィルム(1)のうち、前記少なくとも1つの電子構成素子(9)が装着された方の側に、別のフィルムをラミネートするステップ、
を有することを特徴とする方法。 - 前記別のフィルムも、少なくとも1つの電子構成素子(9)が装着された導電性フィルム(1)である、
ことを特徴とする請求項1記載の方法。 - 2つの導電性フィルム(1)の間に誘電体が設けられている、
ことを特徴とする請求項1または2記載の方法。 - 前記導電性フィルム(1)の上に、前記少なくとも1つの電子構成素子(9)を装着する前に、誘電体からなる被膜を被着し、
この際前記誘電体からなる被膜を、前記導体路構造(7)を形成するための導電性フィルム(1)の導電層(3)をパターニングする前または後に被着する、
ことを特徴とする請求項3記載の方法。 - 前記誘電体を、前記導電性フィルム(1)に少なくとも1つの電子構成素子(9)を装着した後に、前記導電性フィルム(1)のうち前記少なくとも1つの電子構成素子(9)が配置されている方の側に被着する、
ことを特徴とする請求項3または4記載の方法。 - 前記誘電体はプラスチック層である、
ことを特徴とする請求項3から5のいずれか一項記載の方法。 - 前記導電性フィルム(1)の前記導電層(3)からパターニングされた導体路構造(7)の接続のために、スルーホールコンタクト(17)を設ける、
ことを特徴とする請求項2から6のいずれか一項記載の方法。 - 前記電子モジュールのうち外側に向いた少なくとも1つの側に、絶縁層(19)を被着する、
ことを特徴とする請求項1から7のいずれか一項記載の方法。 - 少なくとも2つの電子モジュールを、互いに接合して層複合体を形成する、
ことを特徴とする請求項1から8のいずれか一項記載の方法。 - 前記導電性フィルム(1)の表側および裏側に、それぞれ少なくとも1つの電子構成素子(9)を装着する、
ことを特徴とする請求項1から9のいずれか一項記載の方法。 - 両側にそれぞれ少なくとも1つの電子構成素子(9)が装着されている複数の導電性フィルム(1)を互いに接合して層複合体を形成し、
この際2つの導電性フィルム(1)の間にそれぞれ誘電体を設ける、
ことを特徴とする請求項10記載の方法。 - 前記導電性フィルム(1)に装着された少なくとも1つの電子構成素子(9)を、成型材料(15)によって包囲する、
ことを特徴とする請求項1から11のいずれか一項記載の方法。 - 前記電子モジュールを、最終ステップにおいて成型部材に成型する、
ことを特徴とする請求項1から12のいずれか一項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008002532.1 | 2008-06-19 | ||
DE102008002532A DE102008002532A1 (de) | 2008-06-19 | 2008-06-19 | Verfahren zur Herstellung einer elektronischen Baugruppe |
PCT/EP2009/056286 WO2009153129A2 (de) | 2008-06-19 | 2009-05-25 | Verfahren zur herstellung einer elektronischen baugruppe |
Publications (1)
Publication Number | Publication Date |
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JP2011524645A true JP2011524645A (ja) | 2011-09-01 |
Family
ID=40905909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011513971A Pending JP2011524645A (ja) | 2008-06-19 | 2009-05-25 | 電子モジュールを製造するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8505198B2 (ja) |
EP (1) | EP2289100A2 (ja) |
JP (1) | JP2011524645A (ja) |
CN (1) | CN102124560B (ja) |
DE (1) | DE102008002532A1 (ja) |
WO (1) | WO2009153129A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010014579A1 (de) * | 2010-04-09 | 2011-10-13 | Würth Elektronik Rot am See GmbH & Co. KG | Verfahren zum Herstellen einer elektronischen Baugruppe |
DE102010030528A1 (de) * | 2010-06-25 | 2011-12-29 | Robert Bosch Gmbh | Eingekapseltes Steuerungsmodul für ein Kraftfahrzeug |
WO2018063198A1 (en) * | 2016-09-28 | 2018-04-05 | Aleksandar Aleksov | Flexible packaging for a wearable electronic device |
DE102017203381A1 (de) * | 2017-03-02 | 2018-04-05 | Robert Bosch Gmbh | Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren |
EP4070534A1 (en) * | 2020-01-24 | 2022-10-12 | Huawei Technologies Co., Ltd. | Functional housing structure for an electronic device |
DE102021108701A1 (de) | 2021-04-08 | 2022-10-13 | Innome Gmbh | Sensorbauteil und Verfahren zur Herstellung desselben |
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JP2005045228A (ja) * | 2003-07-09 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 光学情報記録媒体とその製造方法 |
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TW350194B (en) * | 1994-11-30 | 1999-01-11 | Mitsubishi Gas Chemical Co | Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production |
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DE19830540A1 (de) * | 1998-07-08 | 2000-01-13 | Siemens Ag | Elektronischer Schaltungsträger |
US6512182B2 (en) | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
TW200302685A (en) * | 2002-01-23 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Circuit component built-in module and method of manufacturing the same |
CN1577819A (zh) * | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
US6928726B2 (en) * | 2003-07-24 | 2005-08-16 | Motorola, Inc. | Circuit board with embedded components and method of manufacture |
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-
2008
- 2008-06-19 DE DE102008002532A patent/DE102008002532A1/de not_active Withdrawn
-
2009
- 2009-05-25 EP EP09765709A patent/EP2289100A2/de not_active Ceased
- 2009-05-25 US US12/999,834 patent/US8505198B2/en active Active
- 2009-05-25 CN CN200980132214.1A patent/CN102124560B/zh not_active Expired - Fee Related
- 2009-05-25 WO PCT/EP2009/056286 patent/WO2009153129A2/de active Application Filing
- 2009-05-25 JP JP2011513971A patent/JP2011524645A/ja active Pending
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JP2000151057A (ja) * | 1998-11-09 | 2000-05-30 | Hitachi Ltd | 電子部品実装構造体およびその製造方法並びに無線icカードおよびその製造方法 |
JP2005045228A (ja) * | 2003-07-09 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 光学情報記録媒体とその製造方法 |
Also Published As
Publication number | Publication date |
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US8505198B2 (en) | 2013-08-13 |
DE102008002532A1 (de) | 2009-12-24 |
US20110138620A1 (en) | 2011-06-16 |
WO2009153129A2 (de) | 2009-12-23 |
WO2009153129A3 (de) | 2010-03-04 |
EP2289100A2 (de) | 2011-03-02 |
CN102124560A (zh) | 2011-07-13 |
CN102124560B (zh) | 2014-05-07 |
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