JP2011521475A5 - - Google Patents

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Publication number
JP2011521475A5
JP2011521475A5 JP2011510665A JP2011510665A JP2011521475A5 JP 2011521475 A5 JP2011521475 A5 JP 2011521475A5 JP 2011510665 A JP2011510665 A JP 2011510665A JP 2011510665 A JP2011510665 A JP 2011510665A JP 2011521475 A5 JP2011521475 A5 JP 2011521475A5
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Japan
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JP2011510665A
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Japanese (ja)
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JP2011521475A (ja
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Priority claimed from PCT/US2009/044594 external-priority patent/WO2009143200A2/en
Publication of JP2011521475A publication Critical patent/JP2011521475A/ja
Publication of JP2011521475A5 publication Critical patent/JP2011521475A5/ja
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JP2011510665A 2008-05-21 2009-05-20 ツール及びプロセスの効果を分離する基板マトリクス Pending JP2011521475A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5489708P 2008-05-21 2008-05-21
US61/054,897 2008-05-21
PCT/US2009/044594 WO2009143200A2 (en) 2008-05-21 2009-05-20 Substrate matrix to decouple tool and process effects

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015105955A Division JP2015180953A (ja) 2008-05-21 2015-05-26 ツール及びプロセスの効果を分離する基板マトリクス

Publications (2)

Publication Number Publication Date
JP2011521475A JP2011521475A (ja) 2011-07-21
JP2011521475A5 true JP2011521475A5 (enExample) 2011-12-08

Family

ID=41340835

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011510665A Pending JP2011521475A (ja) 2008-05-21 2009-05-20 ツール及びプロセスの効果を分離する基板マトリクス
JP2015105955A Pending JP2015180953A (ja) 2008-05-21 2015-05-26 ツール及びプロセスの効果を分離する基板マトリクス
JP2017115541A Pending JP2017201402A (ja) 2008-05-21 2017-06-13 ツール及びプロセスの効果を分離する基板マトリクス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015105955A Pending JP2015180953A (ja) 2008-05-21 2015-05-26 ツール及びプロセスの効果を分離する基板マトリクス
JP2017115541A Pending JP2017201402A (ja) 2008-05-21 2017-06-13 ツール及びプロセスの効果を分離する基板マトリクス

Country Status (7)

Country Link
US (1) US8142966B2 (enExample)
EP (1) EP2286447A2 (enExample)
JP (3) JP2011521475A (enExample)
KR (1) KR101504504B1 (enExample)
CN (1) CN102037550B (enExample)
IL (1) IL208576A (enExample)
WO (1) WO2009143200A2 (enExample)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
US9588439B1 (en) * 2010-12-21 2017-03-07 Asml Netherlands B.V. Information matrix creation and calibration test pattern selection based on computational lithography model parameters
CN105892238B (zh) * 2011-08-31 2018-04-13 Asml荷兰有限公司 确定聚焦位置修正的方法、光刻处理元和器件制造方法
JP6122290B2 (ja) 2011-12-22 2017-04-26 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 再配線層を有する半導体パッケージ
US9875946B2 (en) 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
WO2015049087A1 (en) 2013-10-02 2015-04-09 Asml Netherlands B.V. Methods & apparatus for obtaining diagnostic information relating to an industrial process
US9490182B2 (en) 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
WO2016162231A1 (en) * 2015-04-10 2016-10-13 Asml Netherlands B.V. Method and apparatus for inspection and metrology
US10504759B2 (en) 2016-04-04 2019-12-10 Kla-Tencor Corporation Semiconductor metrology with information from multiple processing steps
US9940705B2 (en) * 2016-05-04 2018-04-10 Kla-Tencor Corporation System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components
JP6924261B2 (ja) 2016-10-20 2021-08-25 ケーエルエー コーポレイション パターニングされたウェハの特性評価のためのハイブリッド計量
JP6779173B2 (ja) * 2017-05-18 2020-11-04 株式会社荏原製作所 基板処理装置、プログラムを記録した記録媒体
JP7281547B2 (ja) * 2018-12-31 2023-05-25 エーエスエムエル ネザーランズ ビー．ブイ． プロセス制御のためのインダイメトロロジ方法及びシステム

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JPH04282820A (ja) * 1991-03-11 1992-10-07 Nippon Telegr & Teleph Corp <Ntt> パタン形成方法
JP3109631B2 (ja) 1992-12-14 2000-11-20 沖電気工業株式会社 ホトリソグラフィーのパターン検証方法
EP1205806A1 (en) * 2000-11-09 2002-05-15 Semiconductor300 GmbH &amp; Co KG Method for exposing a semiconductor wafer
US6625497B2 (en) * 2000-11-20 2003-09-23 Applied Materials Inc. Semiconductor processing module with integrated feedback/feed forward metrology
JP4158384B2 (ja) * 2001-07-19 2008-10-01 株式会社日立製作所 半導体デバイスの製造工程監視方法及びそのシステム
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
JP2004072000A (ja) * 2002-08-09 2004-03-04 Matsushita Electric Ind Co Ltd 加熱装置
US6915177B2 (en) * 2002-09-30 2005-07-05 Advanced Micro Devices, Inc. Comprehensive integrated lithographic process control system based on product design and yield feedback system
JP2007528114A (ja) * 2003-04-29 2007-10-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ウェハ上のリソグラフィ効果を特性化するシステム及び方法
EP1507172A1 (en) * 2003-08-12 2005-02-16 ASML Netherlands B.V. Lithographic apparatus and apparatus adjustment method
JP2005228978A (ja) * 2004-02-13 2005-08-25 Canon Inc 露光装置及び半導体デバイスの製造方法
US20050185174A1 (en) * 2004-02-23 2005-08-25 Asml Netherlands B.V. Method to determine the value of process parameters based on scatterometry data
JP4361830B2 (ja) * 2004-05-13 2009-11-11 信越化学工業株式会社 レジストパターン寸法の面内分布の評価方法、フォトマスクブランクの製造方法、フォトマスクブランク、及びレジストパターン形成工程の管理方法
JP4527652B2 (ja) * 2004-11-16 2010-08-18 東京エレクトロン株式会社 露光条件設定方法、基板処理装置およびコンピュータプログラム
KR20060055863A (ko) 2004-11-19 2006-05-24 삼성전자주식회사 반도체 집적회로 칩의 구리 패드 구조와 형성 방법 및이를 이용한 적층 패키지
US7239368B2 (en) * 2004-11-29 2007-07-03 Asml Netherlands B.V. Using unflatness information of the substrate table or mask table for decreasing overlay
US7381634B2 (en) * 2005-04-13 2008-06-03 Stats Chippac Ltd. Integrated circuit system for bonding
KR100958714B1 (ko) * 2005-08-08 2010-05-18 브라이언 테크놀로지스, 인코포레이티드 리소그래피 공정의 포커스-노광 모델을 생성하는 시스템 및방법
US7566650B2 (en) * 2005-09-23 2009-07-28 Stats Chippac Ltd. Integrated circuit solder bumping system
US7596420B2 (en) * 2006-06-19 2009-09-29 Asml Netherlands B.V. Device manufacturing method and computer program product
US7916284B2 (en) * 2006-07-18 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
DE102006034679A1 (de) * 2006-07-24 2008-01-31 Infineon Technologies Ag Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben

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