CN102037550B - 使工具与工艺效果分离的衬底矩阵 - Google Patents

使工具与工艺效果分离的衬底矩阵 Download PDF

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Publication number
CN102037550B
CN102037550B CN2009801185750A CN200980118575A CN102037550B CN 102037550 B CN102037550 B CN 102037550B CN 2009801185750 A CN2009801185750 A CN 2009801185750A CN 200980118575 A CN200980118575 A CN 200980118575A CN 102037550 B CN102037550 B CN 102037550B
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China
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parameter
test
test matrix
exposure
parameters
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CN2009801185750A
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Chinese (zh)
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CN102037550A (zh
Inventor
P·伊兹克森
M·E·阿德尔
D·坎德尔
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32187—Correlation between controlling parameters for influence on quality parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36307—Table with workpiece features and corresponding machining parameters, methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN2009801185750A 2008-05-21 2009-05-20 使工具与工艺效果分离的衬底矩阵 Active CN102037550B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5489708P 2008-05-21 2008-05-21
US61/054,897 2008-05-21
PCT/US2009/044594 WO2009143200A2 (en) 2008-05-21 2009-05-20 Substrate matrix to decouple tool and process effects

Publications (2)

Publication Number Publication Date
CN102037550A CN102037550A (zh) 2011-04-27
CN102037550B true CN102037550B (zh) 2012-08-15

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CN2009801185750A Active CN102037550B (zh) 2008-05-21 2009-05-20 使工具与工艺效果分离的衬底矩阵

Country Status (7)

Country Link
US (1) US8142966B2 (enExample)
EP (1) EP2286447A2 (enExample)
JP (3) JP2011521475A (enExample)
KR (1) KR101504504B1 (enExample)
CN (1) CN102037550B (enExample)
IL (1) IL208576A (enExample)
WO (1) WO2009143200A2 (enExample)

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US9588439B1 (en) * 2010-12-21 2017-03-07 Asml Netherlands B.V. Information matrix creation and calibration test pattern selection based on computational lithography model parameters
CN105892238B (zh) * 2011-08-31 2018-04-13 Asml荷兰有限公司 确定聚焦位置修正的方法、光刻处理元和器件制造方法
JP6122290B2 (ja) 2011-12-22 2017-04-26 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 再配線層を有する半導体パッケージ
US9875946B2 (en) 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
WO2015049087A1 (en) 2013-10-02 2015-04-09 Asml Netherlands B.V. Methods & apparatus for obtaining diagnostic information relating to an industrial process
US9490182B2 (en) 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
WO2016162231A1 (en) * 2015-04-10 2016-10-13 Asml Netherlands B.V. Method and apparatus for inspection and metrology
US10504759B2 (en) 2016-04-04 2019-12-10 Kla-Tencor Corporation Semiconductor metrology with information from multiple processing steps
US9940705B2 (en) * 2016-05-04 2018-04-10 Kla-Tencor Corporation System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components
JP6924261B2 (ja) 2016-10-20 2021-08-25 ケーエルエー コーポレイション パターニングされたウェハの特性評価のためのハイブリッド計量
JP6779173B2 (ja) * 2017-05-18 2020-11-04 株式会社荏原製作所 基板処理装置、プログラムを記録した記録媒体
JP7281547B2 (ja) * 2018-12-31 2023-05-25 エーエスエムエル ネザーランズ ビー．ブイ． プロセス制御のためのインダイメトロロジ方法及びシステム

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JP3109631B2 (ja) 1992-12-14 2000-11-20 沖電気工業株式会社 ホトリソグラフィーのパターン検証方法
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Also Published As

Publication number Publication date
KR20110010804A (ko) 2011-02-07
JP2015180953A (ja) 2015-10-15
WO2009143200A2 (en) 2009-11-26
US20110051116A1 (en) 2011-03-03
IL208576A0 (en) 2010-12-30
WO2009143200A3 (en) 2010-03-04
CN102037550A (zh) 2011-04-27
IL208576A (en) 2014-12-31
JP2011521475A (ja) 2011-07-21
JP2017201402A (ja) 2017-11-09
US8142966B2 (en) 2012-03-27
KR101504504B1 (ko) 2015-03-20
EP2286447A2 (en) 2011-02-23

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