JP2011521457A5 - - Google Patents
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- Publication number
- JP2011521457A5 JP2011521457A5 JP2011509782A JP2011509782A JP2011521457A5 JP 2011521457 A5 JP2011521457 A5 JP 2011521457A5 JP 2011509782 A JP2011509782 A JP 2011509782A JP 2011509782 A JP2011509782 A JP 2011509782A JP 2011521457 A5 JP2011521457 A5 JP 2011521457A5
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- dielectric film
- electrode
- forming
- capacitor electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims 95
- 239000000758 substrate Substances 0.000 claims 19
- 238000000034 method Methods 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 9
- 238000012544 monitoring process Methods 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000004891 communication Methods 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12789908P | 2008-05-15 | 2008-05-15 | |
| US61/127,899 | 2008-05-15 | ||
| US5680408P | 2008-05-28 | 2008-05-28 | |
| US61/056,804 | 2008-05-28 | ||
| PCT/US2009/044248 WO2009140658A1 (en) | 2008-05-15 | 2009-05-15 | Surveillance devices with multiple capacitors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011521457A JP2011521457A (ja) | 2011-07-21 |
| JP2011521457A5 true JP2011521457A5 (https=) | 2012-06-21 |
| JP5688492B2 JP5688492B2 (ja) | 2015-03-25 |
Family
ID=41319084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011509782A Expired - Fee Related JP5688492B2 (ja) | 2008-05-15 | 2009-05-15 | 複数コンデンサを有する監視デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8296943B2 (https=) |
| EP (1) | EP2286391B1 (https=) |
| JP (1) | JP5688492B2 (https=) |
| KR (1) | KR101634819B1 (https=) |
| CN (1) | CN102027515B (https=) |
| CA (1) | CA2725460C (https=) |
| WO (1) | WO2009140658A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9183973B2 (en) * | 2009-05-28 | 2015-11-10 | Thin Film Electronics Asa | Diffusion barrier coated substrates and methods of making the same |
| JP5370581B2 (ja) * | 2010-03-24 | 2013-12-18 | 株式会社村田製作所 | Rfidシステム |
| US9179531B2 (en) * | 2010-05-02 | 2015-11-03 | Melito Inc | Super conducting super capacitor |
| US9412061B2 (en) | 2010-08-13 | 2016-08-09 | Avery Dennison Corporation | Sensing radio frequency identification device with reactive strap attachment |
| US9092709B2 (en) * | 2010-08-25 | 2015-07-28 | Avery Dennison Corporation | RFID tag including environmentally sensitive materials |
| US20120098758A1 (en) * | 2010-10-22 | 2012-04-26 | Fearless Designs, Inc. d/b/a The Audience Group | Electronic program guide, mounting bracket and associated system |
| CN102509725B (zh) * | 2011-11-02 | 2016-06-29 | 上海华虹宏力半导体制造有限公司 | 监控用于集成无源器件的半导体衬底测试结构和测试方法 |
| WO2014012012A1 (en) * | 2012-07-12 | 2014-01-16 | Cornell University | Rfid device, methods and applications |
| KR102062841B1 (ko) * | 2012-09-19 | 2020-01-07 | 삼성디스플레이 주식회사 | 캐패시터 및 이를 포함하는 유기 발광 표시 장치 |
| US20140151095A1 (en) * | 2012-12-05 | 2014-06-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
| US9224799B2 (en) * | 2013-12-31 | 2015-12-29 | Intermolecular, Inc. | Capacitors including inner and outer electrodes |
| CN103969714B (zh) * | 2014-05-23 | 2016-08-31 | 豪威光电子科技(上海)有限公司 | 自对准金属层结构、镜片及其制备方法以及镜片模组 |
| US9293254B2 (en) * | 2014-05-28 | 2016-03-22 | Texas Instruments Incorporated | Heated capacitor and method of forming the heated capacitor |
| US9934903B2 (en) * | 2015-08-14 | 2018-04-03 | Wisconsin Alumni Research Foundation | Integrated capacitor and inductor with low parasitic inductance |
| US20180285706A1 (en) * | 2015-10-06 | 2018-10-04 | Thin Film Electronics Asa | Electronic Device Having an Antenna, Metal Trace(s) and/or Inductor With a Printed Adhesion Promoter Thereon, and Methods of Making and Using the Same |
| FR3053156B1 (fr) * | 2016-06-28 | 2018-11-16 | Stmicroelectronics (Rousset) Sas | Composant a faible dispersion dans une puce electronique |
| JP6857329B2 (ja) * | 2016-10-24 | 2021-04-14 | 大日本印刷株式会社 | 高周波部品及びその製造方法 |
| EP3563297B1 (en) | 2016-12-29 | 2023-07-05 | Avery Dennison Retail Information Services LLC | Dual function strap for resonating elements and ultra high frequency antennas |
| US11282638B2 (en) | 2017-05-26 | 2022-03-22 | Nucurrent, Inc. | Inductor coil structures to influence wireless transmission performance |
| WO2019018494A1 (en) * | 2017-07-21 | 2019-01-24 | Walmart Apollo, Llc | RFID SYSTEM PRINTER AND METHOD THEREOF |
| US10535617B2 (en) | 2018-05-10 | 2020-01-14 | International Business Machines Corporation | Implementing transient electronic circuits for security applications |
| JP6614401B1 (ja) * | 2018-07-24 | 2019-12-04 | 株式会社村田製作所 | 無線通信デバイス |
| CN211238502U (zh) * | 2018-07-24 | 2020-08-11 | 株式会社村田制作所 | 无线通信设备 |
| JP7115117B2 (ja) * | 2018-07-30 | 2022-08-09 | Tdk株式会社 | Lcフィルタ |
| WO2020086532A1 (en) | 2018-10-22 | 2020-04-30 | Thin Film Electronics Asa | Barrier stacks for printed and/or thin film electronics methods of manufacturing the same, and method of controlling a threshold voltage of a thin film transistor |
| CN111293012B (zh) * | 2018-12-07 | 2022-03-29 | 士林电机厂股份有限公司 | 具有耐温和少积碳隔弧框的断路器及其制造方法 |
| US11081306B2 (en) * | 2019-03-29 | 2021-08-03 | Shihlin Electric & Engineering Corp. | Process of manufacturing heat resistant and low carbon plate for circuit breaker |
| WO2021041820A1 (en) * | 2019-08-29 | 2021-03-04 | Ppg Industries Ohio, Inc. | Radio frequency signaling system and curable composition |
| US11283303B2 (en) | 2020-07-24 | 2022-03-22 | Nucurrent, Inc. | Area-apportioned wireless power antenna for maximized charging volume |
| CN114582708A (zh) * | 2020-12-02 | 2022-06-03 | 贺利氏德国有限及两合公司 | 半导体晶片的金属化 |
| US11695302B2 (en) | 2021-02-01 | 2023-07-04 | Nucurrent, Inc. | Segmented shielding for wide area wireless power transmitter |
| US20230030569A1 (en) * | 2021-08-02 | 2023-02-02 | Qualcomm Incorporated | Signal power splitter/combiner with resistance and impedance transformer loading |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE179822T1 (de) * | 1989-10-31 | 1999-05-15 | Checkpoint Systems Inc | Verfahren zum etikettieren von artikeln in verbindung mit einem elektronischen artikelüberwachungssystem |
| JP3096069B2 (ja) * | 1990-08-06 | 2000-10-10 | チェックポイント・マニュファクチュアリング・ジャパン株式会社 | 共振タグ及びその製造方法 |
| US5695860A (en) * | 1990-08-06 | 1997-12-09 | Tokai Electronics Co., Ltd. | Resonant tag and method of manufacturing the same |
| JPH0744778A (ja) * | 1993-07-29 | 1995-02-14 | Toyo Alum Kk | 不活化可能な共鳴ラベル |
| JPH08335561A (ja) * | 1995-06-06 | 1996-12-17 | Fujitsu Ltd | 薄膜構成体とその製造方法 |
| JPH09320892A (ja) * | 1996-05-24 | 1997-12-12 | Rohm Co Ltd | チップ状電子部品 |
| US6093575A (en) * | 1996-09-04 | 2000-07-25 | Nippon Steel Corporation | Semiconductor device and production method of a semiconductor device having a capacitor |
| JP2000003354A (ja) * | 1998-06-12 | 2000-01-07 | Matsushita Electric Ind Co Ltd | 電磁界の解析方法およびその装置 |
| DE69927342T2 (de) * | 1998-07-08 | 2006-06-22 | Dai Nippon Printing Co., Ltd. | Kontaktlose chipkarte und verfahren zu ihrer herstellung |
| US6509217B1 (en) * | 1999-10-22 | 2003-01-21 | Damoder Reddy | Inexpensive, reliable, planar RFID tag structure and method for making same |
| US6761963B2 (en) * | 2000-09-21 | 2004-07-13 | Michael D. Casper | Integrated thin film capacitor/inductor/interconnect system and method |
| US6424263B1 (en) * | 2000-12-01 | 2002-07-23 | Microchip Technology Incorporated | Radio frequency identification tag on a single layer substrate |
| JP4177560B2 (ja) * | 2001-03-16 | 2008-11-05 | 株式会社ルネサステクノロジ | 薄膜コンデンサ及び受動素子内蔵電子部品と高周波対応モジュール |
| US6665193B1 (en) * | 2002-07-09 | 2003-12-16 | Amerasia International Technology, Inc. | Electronic circuit construction, as for a wireless RF tag |
| JP2004287970A (ja) * | 2003-03-24 | 2004-10-14 | Toppan Forms Co Ltd | 共振タグ及びそのキャパシタンス調整方法 |
| JP2005294517A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 半導体装置およびその製造方法 |
| US7286053B1 (en) * | 2004-07-31 | 2007-10-23 | Kovio, Inc. | Electronic article surveillance (EAS) tag/device with coplanar and/or multiple coil circuits, an EAS tag/device with two or more memory bits, and methods for tuning the resonant frequency of an RLC EAS tag/device |
| US7109867B2 (en) * | 2004-09-09 | 2006-09-19 | Avery Dennison Corporation | RFID tags with EAS deactivation ability |
| US9953259B2 (en) * | 2004-10-08 | 2018-04-24 | Thin Film Electronics, Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| US7687327B2 (en) * | 2005-07-08 | 2010-03-30 | Kovio, Inc, | Methods for manufacturing RFID tags and structures formed therefrom |
| JP2007142109A (ja) * | 2005-11-17 | 2007-06-07 | Tdk Corp | 電子部品 |
| JP2007201158A (ja) * | 2006-01-26 | 2007-08-09 | Kyocera Corp | コンデンサ |
| JP2007323386A (ja) * | 2006-06-01 | 2007-12-13 | Canon Inc | 非接触タグ |
| JP2008040822A (ja) * | 2006-08-07 | 2008-02-21 | Dainippon Printing Co Ltd | 非接触通信部材、導電体付シート、および導電体付シートの製造方法 |
| CA2702324C (en) * | 2007-10-10 | 2017-04-11 | Kovio, Inc. | High reliability surveillance and/or identification tag/devices and methods of making and using the same |
-
2009
- 2009-05-15 KR KR1020107025654A patent/KR101634819B1/ko not_active Expired - Fee Related
- 2009-05-15 JP JP2011509782A patent/JP5688492B2/ja not_active Expired - Fee Related
- 2009-05-15 EP EP09747739.2A patent/EP2286391B1/en active Active
- 2009-05-15 CN CN200980117247.9A patent/CN102027515B/zh not_active Expired - Fee Related
- 2009-05-15 WO PCT/US2009/044248 patent/WO2009140658A1/en not_active Ceased
- 2009-05-15 US US12/467,121 patent/US8296943B2/en not_active Expired - Fee Related
- 2009-05-15 CA CA2725460A patent/CA2725460C/en not_active Expired - Fee Related
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