JP2011520287A5 - - Google Patents
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- Publication number
- JP2011520287A5 JP2011520287A5 JP2011508570A JP2011508570A JP2011520287A5 JP 2011520287 A5 JP2011520287 A5 JP 2011520287A5 JP 2011508570 A JP2011508570 A JP 2011508570A JP 2011508570 A JP2011508570 A JP 2011508570A JP 2011520287 A5 JP2011520287 A5 JP 2011520287A5
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- condenser
- cabinet
- air flow
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003570 air Substances 0.000 claims 10
- 238000001816 cooling Methods 0.000 claims 4
- 239000012080 ambient air Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000013529 heat transfer fluid Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- -1 methyl perfluoropropyl ether Chemical compound 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08155830A EP2117288A1 (en) | 2008-05-07 | 2008-05-07 | Heat-management system for a cabinet containing electronic equipment |
| EP08155830.6 | 2008-05-07 | ||
| PCT/US2009/042672 WO2009137387A1 (en) | 2008-05-07 | 2009-05-04 | Heat-management system for a cabinet containing electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011520287A JP2011520287A (ja) | 2011-07-14 |
| JP2011520287A5 true JP2011520287A5 (https=) | 2012-06-21 |
Family
ID=39789712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011508570A Pending JP2011520287A (ja) | 2008-05-07 | 2009-05-04 | 電子装置を収容するキャビネットのための熱管理システム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110063798A1 (https=) |
| EP (1) | EP2117288A1 (https=) |
| JP (1) | JP2011520287A (https=) |
| CN (1) | CN102077704A (https=) |
| IL (1) | IL208709A0 (https=) |
| RU (1) | RU2010142253A (https=) |
| TW (1) | TW200952617A (https=) |
| WO (1) | WO2009137387A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8783336B2 (en) * | 2008-12-04 | 2014-07-22 | Io Data Centers, Llc | Apparatus and method of environmental condition management for electronic equipment |
| JP5460362B2 (ja) * | 2010-02-04 | 2014-04-02 | 株式会社日立製作所 | 電子機器の冷却システム |
| JP2012190884A (ja) * | 2011-03-09 | 2012-10-04 | Panasonic Corp | ラック型電子機器の冷却装置 |
| WO2012127383A1 (en) | 2011-03-18 | 2012-09-27 | Ecolab Usa Inc. | Heat system for killing pests |
| CN102256477A (zh) * | 2011-07-25 | 2011-11-23 | 李俊晖 | 机房设备并联散热系统 |
| WO2012106927A1 (zh) * | 2011-07-26 | 2012-08-16 | 华为技术有限公司 | 通信设备用散热柜 |
| EP2787802A4 (en) * | 2011-12-01 | 2015-09-30 | Nec Corp | ELECTRONIC CIRCUIT BOARD WITH A DEVICE AND ELECTRONIC DEVICE THEREFOR |
| SG10201705879SA (en) * | 2012-08-20 | 2017-08-30 | Adc Technology Inc | Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of acooling rack enclosure, and related components, systems, and methods |
| US10240850B1 (en) * | 2013-03-15 | 2019-03-26 | Joseph P. Stine | Supplemental refrigeration heat sink and related systems and methods |
| EP2990742A1 (en) * | 2014-08-28 | 2016-03-02 | ABB Technology AG | Method and apparatus for solidifying a polar substance |
| CN104470335B (zh) * | 2014-12-11 | 2017-03-15 | 中国航天空气动力技术研究院 | 基于热管技术的数据中心节能冷却系统 |
| EP3291494B1 (en) * | 2016-08-31 | 2020-09-30 | Corning Optical Communications LLC | Distribution point unit to exchange communication data between a service provider and subscribers |
| KR102389976B1 (ko) * | 2020-06-17 | 2022-04-22 | 김광일 | 수냉식 옥외 함체 |
| CN112229253B (zh) * | 2020-10-30 | 2022-07-08 | 上海卫星装备研究所 | 热管支路连接装置与热管系统 |
| JP7651903B2 (ja) * | 2021-03-26 | 2025-03-27 | 富士通株式会社 | 冷却装置 |
| CN113099702A (zh) * | 2021-04-29 | 2021-07-09 | 江西新电汽车空调系统有限公司 | 一种双柜及多联柜基站空调 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB698571A (en) | 1951-07-09 | 1953-10-21 | Aeroquip Corp | Improved composite fluid sealing structure applicable to valves and method of makingthe same |
| US2753195A (en) | 1953-07-14 | 1956-07-03 | William D Palmer | Self-sealing coupling |
| US4046193A (en) * | 1976-02-18 | 1977-09-06 | Westinghouse Electric Corporation | Closed electrical apparatus cabinet embodying a vaporization chamber and cabinet top thereof |
| JPS6441792A (en) * | 1987-08-07 | 1989-02-14 | Actronics Kk | Heat pipe type casing cooler |
| US5467250A (en) | 1994-03-21 | 1995-11-14 | Hubbell Incorporated | Electrical cabinet with door-mounted heat exchanger |
| US6030934A (en) | 1997-02-19 | 2000-02-29 | 3M Innovative Properties Company | Azeotropic compositions of methoxy-perfluoropropane and their use |
| US6022842A (en) | 1998-02-11 | 2000-02-08 | 3M Innovative Properties Company | Azeotrope-like compositions including perfluorobutyl methyl ether, 1- bromopropane and alcohol |
| JP3315649B2 (ja) * | 1998-08-11 | 2002-08-19 | 富士通株式会社 | 電子機器 |
| FI981909L (fi) | 1998-09-07 | 2000-03-08 | Nokia Networks Oy | Lämmönsiirrin |
| EP1003006A1 (en) * | 1998-11-19 | 2000-05-24 | Franz Isella S.p.A. | Hybrid system of passive cooling using heat pipes |
| IL129392A0 (en) | 1999-04-11 | 2000-06-01 | Eci Telecom Ltd | System and method for heat exchanging |
| FI108962B (fi) | 1999-08-20 | 2002-04-30 | Nokia Corp | Laitekaapin jäähdytysjärjestelmä |
| AU2001281624A1 (en) * | 2000-08-22 | 2002-03-04 | Hb Innovation Ltd. | Distributed thermal management system for electronic components |
| WO2002032202A1 (en) | 2000-10-10 | 2002-04-18 | 3M Innovative Properties Company | Heat exchanger for sealed cabinets |
| US6499717B1 (en) | 2000-11-27 | 2002-12-31 | International Business Machines Corporation | System and method of use for a refrigerant quick-connect coupling |
| US6388882B1 (en) | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
| US20030205363A1 (en) * | 2001-11-09 | 2003-11-06 | International Business Machines Corporation | Enhanced air cooling of electronic devices using fluid phase change heat transfer |
| US20080006037A1 (en) * | 2001-12-26 | 2008-01-10 | Coolit Systems Inc. | Computer cooling apparatus |
| US7061763B2 (en) | 2002-01-29 | 2006-06-13 | Telefonaktiebolaget Lm Ericsson (Publ) | Cabinet cooling |
| JP2003287329A (ja) * | 2002-03-28 | 2003-10-10 | Mitsubishi Electric Corp | 冷却装置 |
| JP2003324174A (ja) * | 2002-04-30 | 2003-11-14 | Toshiba Corp | 電子機器 |
| US7117930B2 (en) * | 2002-06-14 | 2006-10-10 | Thermal Corp. | Heat pipe fin stack with extruded base |
| US6603660B1 (en) | 2002-08-12 | 2003-08-05 | Netrix Technologies, Inc. | Remote distribution frame |
| US6942193B2 (en) | 2002-08-16 | 2005-09-13 | Eaton Corporation | Self-sealing end fitting |
| US6788535B2 (en) | 2002-12-12 | 2004-09-07 | 3M Innovative Properties Company | Outdoor electronic equipment cabinet |
| JP4199018B2 (ja) * | 2003-02-14 | 2008-12-17 | 株式会社日立製作所 | ラックマウントサーバシステム |
| US7013955B2 (en) * | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
| JP4350606B2 (ja) * | 2004-07-23 | 2009-10-21 | シャープ株式会社 | プリント配線板の製造方法 |
| JP4321413B2 (ja) * | 2004-09-02 | 2009-08-26 | 株式会社日立製作所 | ディスクアレイ装置 |
| US20060181848A1 (en) * | 2005-02-14 | 2006-08-17 | Kiley Richard F | Heat sink and heat sink assembly |
| CN100590377C (zh) * | 2005-02-18 | 2010-02-17 | 阳傑科技股份有限公司 | 热管冷却系统及其热传递连接器 |
| EP1859336A2 (de) * | 2005-03-07 | 2007-11-28 | Asetek A/S | Kühlsystem für elektronische geräte, insbesondere computer |
| US7686071B2 (en) * | 2005-07-30 | 2010-03-30 | Articchoke Enterprises Llc | Blade-thru condenser having reeds and heat dissipation system thereof |
| US7614445B2 (en) * | 2005-12-21 | 2009-11-10 | Sun Microsystems, Inc. | Enhanced heat pipe cooling with MHD fluid flow |
| JP2008085144A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 冷却装置 |
| US7963118B2 (en) * | 2007-09-25 | 2011-06-21 | International Business Machines Corporation | Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack |
-
2008
- 2008-05-07 EP EP08155830A patent/EP2117288A1/en not_active Withdrawn
-
2009
- 2009-05-04 JP JP2011508570A patent/JP2011520287A/ja active Pending
- 2009-05-04 RU RU2010142253/07A patent/RU2010142253A/ru not_active Application Discontinuation
- 2009-05-04 US US12/991,599 patent/US20110063798A1/en not_active Abandoned
- 2009-05-04 CN CN200980125420XA patent/CN102077704A/zh active Pending
- 2009-05-04 WO PCT/US2009/042672 patent/WO2009137387A1/en not_active Ceased
- 2009-05-06 TW TW098115045A patent/TW200952617A/zh unknown
-
2010
- 2010-10-14 IL IL208709D patent/IL208709A0/en unknown
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